3D Printing Info

Filament comparison

PLA Wood vs PSU

Compare printing settings, strength, heat resistance, dated prices and sources.

Wood-filled PLA guidePSU guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PLA Wood comparisonsMore PSU comparisons
PLA Wood vs PSU — documented properties and sources
PropertyWood-filled PLAPLAPSUHIGHTEMP
Market snapshot
Listing priceUSD/kg; dated snapshots$34.49/kg median; $13.99–$76.40/kg across 6 dated product listings$168.00/kg median; $168.00–$168.00/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryPLA filled with wood powder — 10–18 wt% (Bambu Lab SDS); colorFabb woodFill uses a PLA/PHA base with recycled wood fibre[1][2]Polysulfone — the lowest-temperature and cheapest of the sulfone family[3]
Densityg/cm³1.15 (colorFabb) to 1.23 (Fiberlogy), ISO 1183; Bambu Lab 1.21[4][2][5]1.24 (ISO 1183)[3]
Typical priceUSD/kg1 kg spools cluster near 25; counting the 0.5 kg specialty spools the middle of the market is about 34[6][7][8]1 kg-equivalent spools cluster near 250[9]
Price range across brandsUSD/kg14–76 across brands; SUNLU 14, ELEGOO 19, Bambu Lab 25, Prusament 44, Filament PM 49 on 0.5 kg spools, colorFabb 76[7][6][10][11][12][8]168-250 across formats; 250 g spool $42 (168/kg), 500 g $125 (250/kg) — 3DXTech is the only filament supplier found[9]
Market availability1–5Stocked by most mainstream brands[6][7][11][5]Special order, 1–2 makers worldwide[9]
Spool sizes & diameters1.75 and 2.85 mm; 0.6, 0.85 and 1 kg spools[11][5][6]1.75 mm; 250 g and 500 g spools[9]
Typical applicationsDecorative and model-making prints that are sanded and stained like timber[4][2]Transparent high-temperature housings, medical trays and hot-water fittings[3]
Diameter tolerance± mm±0.03 (Bambu Lab)[4]Not documented
Printing Parameters
Nozzle temperature°C190–240 (Bambu Lab); colorFabb advises 195–220 for its PLA/PHA base[4][2]Not documented
Bed temperature°C35–45 (Bambu Lab); 50–70 (Fiberlogy)[4][5]120–140 (3DXTech)[3]
Enclosure / chamber requirement1–5Open frame is fine[4]Actively heated chamber required[13][14]
Part cooling fanFan on[4]Not documented
Warping tendency1–5None[4]Not documented
Overall printing difficulty1–5Easy — minor profile tuning; pre-drying is required and the wood content chars if it sits hot[15][4]Expert / industrial hardware only[13][14]
Extruder requirementNozzles below 0.4 mm are not compatible; Bambu Lab does not recommend the AMS lite[15]Not documented
Hardware Wear & Reliability
Nozzle hardness required1–4Brass acceptable; hardened steel for volume work — Bambu Lab's PLA compatibility table lists no hardened-nozzle requirement, but its nozzle guide names wood among the abrasive filaments hardened steel exists for[15][16]Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[13]
Abrasiveness1–5Moderately abrasive — wood fill[15]Non-abrasive when unfilled[3]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; wood particles char and block small nozzles[15]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[17]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5High — 1.25 % saturated at 25 °C / 55 % RH, the highest in the PLA family[4]Not documented
Equilibrium moisture content at ~50 % RH%1.25 saturated at 25 °C / 55 % RH (Bambu Lab)[4]0.30 in 24 h on extruded stock (ASTM D570)[18]
Drying temperature & time55 °C for 8 h in a forced-air dryer; Bambu Lab lists pre-drying as required[4][15]Not documented
Symptoms when wetBambu Lab flags pre-drying and ventilation as specific requirements for this grade[15]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. At 1.25 % saturated uptake the practical loss shows as poor layer adhesion, rough surface and weak layers[19][4]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[17]
Mechanical Properties
Tensile strength (XY)MPa26 ± 5 (Bambu Lab) and 28.4 (colorFabb) printed XY, ISO 527; Fiberlogy quotes 35 at yield[4][2][5]52 (printed XY, ISO 527, 3DXTech); 81 at break on extruded stock (ASTM D638)[3][18]
Young's modulusMPa2360 ± 190 (Bambu Lab) and 2479 (colorFabb) printed XY, ISO 527; Fiberlogy 2950[4][2][5]2100 (printed XY, ISO 527)[3]
Elongation at break%4.5 (colorFabb) to 15.3 (Bambu Lab) printed XY, ISO 527; Fiberlogy 6.5[4][2][5]8 (printed XY, ISO 527) against 50 on extruded stock — nearly three times PPSU's printed 3 %[3][20][18]
Flexural strengthMPa55 ± 4 printed XY, ISO 178 (Bambu Lab)[4]87 (printed XY, ISO 178)[3]
Flexural modulusMPa2780 ± 120 printed XY, ISO 178 (Bambu Lab)[4]2050 (printed XY, ISO 178)[3]
Charpy impact, notchedkJ/m²3.81 (colorFabb) and 6.3 ± 2.2 (Bambu Lab) printed XY, ISO 179, notched[4][2]Not documented
Other impact dataCharpy unnotched 12.28 (colorFabb) and 15.7 (Bambu Lab), printed, ISO 179[4][2]Izod notched 69 J/m on extruded PSU stock, converted from 1.3 ft-lb/in (ASTM D256)[18]
Layer adhesion / Z tensileMPa15 ± 4 printed Z, ISO 527 (Bambu Lab); flexural Z falls to 28 against 55 in XY[4]Not documented
Brittleness1–5Brittle — snaps with little warning[4]Moderate[3]
Hardness (scale-specific)Shore A / Shore D / RockwellNot documentedRockwell M120 on extruded PSU stock (ASTM D785)[18]
Creep resistance / sustained load1–5Poor — no wood-filled creep test; plain printed PLA sagged from 12 to 16.2–21.8 mm over 5 days at 1.25 kg[21][22][23]Good. Ensinger lists high creep resistance as a headline property of extruded PSU stock, which is rated to 173 °C heat deflection at 1.8 MPa[18]
Fatigue / repeated-flex resistance1–5Poor — no grade-specific S-N curve; plain printed PLA ran 38 000–49 000 cycles at 30 % of tensile strength and the wood filler cuts elongation and the parts snap without warning[24][4]Not documented
Elasticity / flexibility1–5Rigid[4]Rigid[3]
Z strength as % of XY%58 by tensile, 51 by flexural (printed, Bambu Lab)[4]Not documented
Thermal Properties
HDT at 0.45 MPa°C60 (ISO 75, 0.45 MPa)[4]172 (printed XY, ISO 75 at 0.45 MPa, 3DXTech); 181 on extruded stock, converted from 358 °F at 66 psi[3][18]
HDT at 1.8 MPa°C57 (ISO 75, 1.8 MPa)[4]174 on extruded PSU stock, converted from 345 °F at 264 psi (ASTM D648)[18]
Glass transition (Tg)°C54 (Bambu Lab, DSC); Fiberlogy quotes 55–60[4][5]187 (DSC, 3DXTech) and 185 on extruded stock (ASTM D3418), against 230 for PPSU[3][20][18]
Melting point / Vicat°C156 peak melt (DSC)[4]Not documented
Continuous service temperature°CNot documented141 long-term service on extruded PSU stock, converted from 285 °F[18]
Thermal expansion (CTE)µm/m·KNot documented55.8 (extruded PSU stock, ASTM D696; source states 3.1e-5 in/in/°F)[18]
Flammability / UL 94Not documentedUL 94 V-0 on extruded PSU stock[18]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors[25]Not documented
Electrical & ESD propertiesNot documentedSurface resistance above 10¹³ ohm/sq — an insulator (IEC 60093)[3]
Health & Safety
Fume toxicity1–5Low hazard — minimal VOC and particle emission[26]Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[26]
Ventilation / filtration requirement1–5None needed in a normal room; Bambu Lab specifically advises ventilation for this grade[15]Ventilated room or enclosure recommended[26]
Post-Processing
Sanding & machiningSands and stains like timber — the usual reason for choosing it[2]Not documented
Support material pairingSupport for PLA (Bambu Lab)[4]Not documented
Dimensional accuracy & detailWood grain hides layer lines; colour darkens with nozzle temperature[4][2]Not documented
Solvents & Solubility
Soluble inChloroform dissolves the PLA matrix (10 % w/v, 2–4 h at 23 °C) and leaves the filler as loose sludge; laboratory reagent.[27]Chlorinated hydrocarbons — dichloromethane, chloroform — dissolve polysulfone; ketones and esters attack it as well.[28][29]
Softened or crazed byAcetone, ethyl acetate and toluene plasticise the matrix but dissolve <1 % even at 65 °C; acetone submersion crazes parts.[27][30]Acetone, MEK, ethyl acetate, benzene and toluene craze or stress-crack it; methanol and isopropanol only marginally.[29][28]
Solvent welding & smoothing agentChloroform vapour attacks only the resin fraction, so the filler is left standing proud; no workshop-safe agent exists.[31][30]Dichloromethane cement welds PSU and NMP softens residual resin. Both are laboratory reagents.[28]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Safety Data Sheet SDS20250723SA16 — Bambu PLA Wood Bambu Lab · 2025-07 · msds
  2. woodFill technical data sheet colorFabb · 2026-08 · tds
  3. ThermaX PSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  4. Bambu Filament Technical Data Sheet — PLA Wood Bambu Lab · 2026-08 · tds
  5. FiberWood technical data sheet Fiberlogy · 2026-08 · tds
  6. PLA Wood — product page Bambu Lab US Store · 2026-08 · vendor
  7. ELEGOO product catalogue ELEGOO · 2026-08 · vendor
  8. PLA+ WOODJet - Natur (1,75 mm; 0,5 kg) Filament PM shop · 2026-08 · vendor
  9. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  10. Printed Solid product catalogue Printed Solid · 2026-08 · vendor
  11. woodFill — product page colorFabb US · 2026-08 · vendor
  12. SUNLU Optimized Wood PLA 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
  13. Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
  14. Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
  15. PLA Usage Guide Bambu Lab Wiki · 2026-08 · doc
  16. Nozzles — material and compatibility Bambu Lab Wiki · 2026-08 · doc
  17. THERMAX PSU — product page (print recommendations) 3DXTech · 2026-08 · doc
  18. TECASON S natural (PSU) — stock shape properties Ensinger · 2026-08 · tds
  19. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  20. ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  21. BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  22. Polymaker PLA Pro vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  23. Carbon Fiber PLA vs META-PLA vs PLA+ vs PLA by Sunlu — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  24. Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
  25. PLA — material guide Prusa Knowledge Base · 2026-08 · doc
  26. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  27. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  28. Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
  29. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  30. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  31. Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper