3D Printing Info

Filament comparison

PLA Silk vs PPSU

Compare printing settings, strength, heat resistance, dated prices and sources.

2 selected · all documented properties

PLA Silk vs PPSU — documented properties and sources
PropertySilk PLAPLAPPSUHIGHTEMP
Market snapshot
Listing priceUSD/kg; dated snapshots$19.49/kg median; $9.75–$24.99/kg across 15 dated product listings$337.40/kg median; $223.00–$732.56/kg across 4 dated product listings
Identity & Market
Base polymer / chemistryPLA with a gloss-forming additive package; suppliers publish the composition as polylactic acid only[1]Polyphenylsulfone — an amorphous high-temperature sulfone polymer[2]
Densityg/cm³1.27 (ISO 1183)[1]1.28 (ISO 1183, 3DXTech; ASTM D792, Stratasys PPSF)[2][3]
Typical priceUSD/kgMainstream 1 kg spools cluster near 20[4][5][6]1 kg-equivalent spools span 223–733; the middle of the market is about 425[7][8][9][10]
Price range across brandsUSD/kg10–25 across brands; CHCKX 10 in a 16-roll bundle, SUNLU 13, LANDU 18, YXPOLYER 20, Polymaker 22, Devil Design 25[11][12][13][14][15]223-733 across brands; IEMAI 3D 223 at 1 kg, 3DXTech ThermaX PPSU 250 at 500 g, 3D4Makers 425 at 750 g, Kimya PPSU-S 733 at 500 g[7][8][9][10]
Market availability1–5Stocked by most mainstream brands[4][11][16]Niche, a handful of specialist brands[7][8][9]
Spool sizes & diameters1.75 mm; 1 and 1.1 kg spools; dual- and tri-colour coextruded variants[17][18]1.75 and 2.85 mm; 200 g to 750 g spools[7][8][9]
Typical applicationsDecorative prints where surface gloss matters more than strength[1]Steam-sterilisable medical and dental tooling, and aircraft interior parts[2]
Diameter tolerance± mm±0.03 (Bambu Lab)[19]Not documented
Printing Parameters
Nozzle temperature°C210–240 — 20 °C above the plain PLA window[1]Not documented
Bed temperature°C35–45[1]130–150 (3DXTech)[2]
Enclosure / chamber requirement1–5Open frame is fine[1][20]Actively heated chamber required[21][22]
Part cooling fanFan on[1]Not documented
Bed surface & adhesion aidCool Plate SuperTack, smooth PEI or textured PEI[1]Not documented
Warping tendency1–5None[1]Severe — heated chamber needed[21]
Bed-adhesion difficulty1–5Sticks to anything[23]Not documented
Overall printing difficulty1–5Easy — minor profile tuning; hotter nozzle and slower cap of 250 mm/s[1]Expert / industrial hardware only[21][22]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[20]Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[21]
Abrasiveness1–5Non-abrasive[24][20]Non-abrasive when unfilled[2]
Nozzle clog risk1–5Very low[20]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[25]
Heat-creep / jam sensitivity1–5Moderate — good heatbreak cooling needed; PLA softens below 60 °C[26]Not documented
Hotend requirementNo special hot-end required[23]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Moderate — 0.40 % saturated at 25 °C / 55 % RH[1]Not documented
Equilibrium moisture content at ~50 % RH%0.40 saturated at 25 °C / 55 % RH (Bambu Lab)[1]0.37 in 24 h and 1.1 at saturation on extruded stock (ASTM D570)[27]
Drying temperature & time55 °C for 8 h in a forced-air dryer, or 65–75 °C for 12 h on an X1 heatbed[1][28]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing, rough surface and weak layers[29]Not documented
Effect of moisture on strengthPolymaker rates PLA low-sensitivity — the loss shows as poor layer adhesion and brittle layers rather than a published strength figure[29]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[25]
Storage requirementSealed with desiccant below 20 % RH; shelf life at ambient is long[30][23]Not documented
Mechanical Properties
Tensile strength (XY)MPa33 (printed XY, ISO 527); eSun Silk broke 22 % below the 16-brand PLA mean on identical 4×4 mm bars[1][31]55 (printed XY, ISO 527, 3DXTech) and 55 (printed on side long edge, ASTM D638, Stratasys PPSF); 79 at yield on extruded stock[2][3][27]
Young's modulusMPa2130 (printed XY, ISO 527)[1]2100 (printed, ASTM D638, Stratasys PPSF) and 2310 (printed XY, ISO 527, 3DXTech); 2344 on extruded stock[2][3][27]
Elongation at break%2.8 (printed XY, ISO 527) — a quarter of PLA Basic at 12.2[1][30]3 (printed, ISO 527 and ASTM D638) against 60 on extruded stock — printing costs PPSU almost all of its ductility[2][3][27]
Flexural strengthMPa75 (printed XY, ISO 178)[1]110 (printed, ISO 178 and ASTM D790, 3DXTech and Stratasys PPSF agree); 91 on extruded stock[2][3][27]
Flexural modulusMPa2460 (printed XY, ISO 178)[1]2200 (printed, ASTM D790, Stratasys PPSF) and 2215 (printed XY, ISO 178, 3DXTech)[2][3]
Charpy impact, notchedkJ/m²10.3 (printed XY, ISO 179, notched); unnotched 18.5[1]Not documented
Other impact dataNot documentedIzod notched 58.7 J/m and unnotched 165.5 J/m (printed, ASTM D256 Method A, Stratasys PPSF); 160 J/m notched on extruded stock[3][27]
Layer adhesion / Z tensileMPa25 (printed Z, ISO 527), and flexural Z collapses to 30 against 75 in XY; eSun Silk broke at 12.3 kg where twelve of the 16 plain PLAs managed 44.6–61.5 kg[1][31][32]Not documented
Brittleness1–5Brittle — snaps with little warning[1]Brittle — snaps with little warning[2]
Hardness (scale-specific)Shore A / Shore D / RockwellNot documentedRockwell M86 on printed PPSF (ASTM D785, Stratasys); M96 on extruded PPSU stock (and an unlabelled 123)[3][27]
Creep resistance / sustained load1–5Poor — no silk-specific creep data published; plain PLA sagged from 12 to 18.7–20.3 mm over 5 days at 1.25 kg[33][34]Good. Printed PPSF holds 189 °C heat deflection at 1.8 MPa (ASTM D648) and extruded stock is rated 149 °C long-term service, but Ensinger does not claim the creep resistance it claims for PSU and PPS[3][27]
Fatigue / repeated-flex resistance1–5Poor — no grade-specific S-N curve; plain printed PLA ran 38 000–49 000 cycles at 30 % of tensile strength (R = 0.2)[35][26]Not documented
Elasticity / flexibility1–5Rigid[1]Rigid[2]
Z strength as % of XY%76 by tensile, 40 by flexural (printed, Bambu Lab)[1]Not documented
Thermal Properties
HDT at 0.45 MPa°C60 (ISO 75, 0.45 MPa)[1]190 (printed XY, ISO 75 at 0.45 MPa, 3DXTech)[2]
HDT at 1.8 MPa°C56 (ISO 75, 1.8 MPa)[1]189 (printed, ASTM D648 at 264 psi, Stratasys PPSF); 207 on extruded stock, converted from 405 °F[3][27]
Glass transition (Tg)°C57 (DSC)[1]230 (DSC) — the highest glass transition in the dataset[2]
Melting point / Vicat°C158 peak melt (DSC); Vicat 66 °C[1]Not documented
Continuous service temperature°C50 — a loaded bar begins to move at this temperature (My Tech Fun, eSun eSilk PLA)[32]149 long-term service on extruded PPSU stock, converted from 300 °F[27]
Annealing response50–55 °C for 6–12 h[1]Not documented
Thermal expansion (CTE)µm/m·KNot documented55.0 (printed PPSF, ASTM D696; source states 5.5e-5 mm/mm/°C) and 55.8 on extruded stock (ASTM D696, from 3.1e-5 in/in/°F)[3][27]
Flammability / UL 94Flammable; no UL 94 rating published by the major brands[30][36]UL 94 V-0 at 1.5 mm, rated on the base resin[2]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors[26][37]Not documented
Chemical resistanceGood against weak acids, oils and grease; poor against strong acids and alkalis; dissolved by chloroform, THF and hot benzene[36][26]Withstands repeated steam autoclaving, the usual reason to choose PPSU over PSU; Stratasys also lists PPSF as passing 24 h stress-crack exposure to antifreeze, petrol, motor oil, power-steering, transmission and washer fluid at 23 °C and 100 °C[2][3]
Water / humidity resistance in service1–5Good — insoluble in water[30]Not documented
Food contactBase resin is food-contact grade, but printed layer grooves harbour bacteria; Prusa advises against food use[26]Not documented
Biodegradability / compostabilityIndustrially compostable only — needs sustained 55 °C; not home compostable[38][26]Not documented
RecyclabilityMechanically recyclable; not accepted in household plastic collection[38]Not documented
Electrical & ESD propertiesNot documentedVolume resistivity 5e13 to 1.5e14 ohm-cm and dielectric strength 80-290 V/mil on printed PPSF (ASTM D257, D149)[3]
Health & Safety
Fume toxicity1–5Low hazard — minimal VOC and particle emission[39]Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[39]
Ventilation / filtration requirement1–5None needed in a normal room[39]Ventilated room or enclosure recommended[39]
Post-Processing
Sanding & machiningWet sanding — dry sanding heats the surface by friction and smears it[37][26]Not documented
Gluing & solvent weldingCyanoacrylate for most joints; some grades partially dissolve and bond with acetone[26][40]Not documented
Vapour / chemical smoothingNo practical vapour smoothing — only chloroform, hot benzene or THF, which are laboratory-only[26]Not documented
Support material pairingSupport for PLA (Bambu Lab)[1]Not documented
Dimensional accuracy & detail55° overhangs and 30 mm bridges; gloss hides fine detail and is destroyed by sanding[1]Not documented
Solvents & Solubility
Soluble inChloroform: 10 % w/v in 2–4 h at 23 °C, every grade and morphology; THF and DMF only at 65 °C. Laboratory reagents.[41]Dichloromethane dissolves it at 23 °C at every stress level; acetone solvates and softens unstressed PPSU (Solvay ESCR).[42]
Softened or crazed byAcetone, ethyl acetate and toluene plasticise it but dissolve <1 % even at 65 °C; submersion in acetone crazes and destroys parts.[41][43]MEK ruptures stressed parts and toluene crazes them above 13.8 MPa; glass-filled grades survive where unfilled craze.[42]
Solvent welding & smoothing agentChloroform vapour smooths and welds PLA at the cost of tensile strength; acetone does not smooth it at all.[44][43]Dichloromethane cements PPSU and NMP softens residual resin; both are laboratory reagents, not workshop stock.[42]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Bambu Filament Technical Data Sheet V1.0 — PLA Silk+ Bambu Lab · 2026-08 · tds
  2. ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  3. PPSF (polyphenylsulfone) — FDM Data Sheet Stratasys · 2018-06 · tds
  4. Panchroma Silk PLA collection Polymaker Shop · 2026-08 · vendor
  5. Spectrum PLA Silk — product listing 3DJake International · 2026-08 · vendor
  6. 3DJake ecoPLA Silk Black 1.75mm 1000g 3DJake International · 2026-08 · vendor
  7. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  8. Kimya PPSU-S Natural 1.75 mm 500 g igo3d · 2026-08 · vendor
  9. 3D4Makers product catalogue 3D4Makers · 2026-08 · vendor
  10. IEMAI 3D PPSU 3D Printing Filament — store page IEMAI 3D · 2026-08 · vendor
  11. Sunlu Silk PLA+ 1.75mm 1kg Sunlu Official Store · 2026-08 · vendor
  12. Bambu Lab PLA Silk 1.75mm 1kg 3D Universe · 2026-08 · vendor
  13. CHCKX 16 Pack Silk Dual Color PLA Filament Bundle CHCKX (Amazon US) · 2026-08 · vendor
  14. YXPOLYER Silk PLA Black&Gold product page YXPOLYER · 2026-08 · vendor
  15. LANDU Silk Tri-Color PLA Filament 1.75 mm 1 kg LANDU (Amazon US) · 2026-08 · vendor
  16. Overture Silk PLA 1.75mm Overture3D · 2026-08 · vendor
  17. eSUN PLA-Silk Magic 1.75mm eSUN Official Store · 2026-08 · vendor
  18. JAYO Silk PLA+ 1.75mm 1.1kg JAYO Official Store · 2026-08 · vendor
  19. PLA Basic — product page Bambu Lab US Store · 2026-08 · vendor
  20. Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
  21. Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
  22. Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
  23. PLA — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  24. Prusament PLA — material page Prusa Polymers · 2026-08 · doc
  25. THERMAX PPSU — product page (print recommendations) 3DXTech · 2026-08 · doc
  26. PLA — material guide Prusa Knowledge Base · 2026-08 · doc
  27. TECASON P black (PPSU) — stock shape properties Ensinger · 2026-08 · tds
  28. Filament Drying Recommendations Bambu Lab Wiki · 2026-08 · doc
  29. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  30. Bambu Filament Technical Data Sheet V3.0 — PLA Basic Bambu Lab · 2026-08 · tds
  31. 16 PLA brand comparison test — results spreadsheet My Tech Fun (Igor Gaspar) · 2022-10 · test
  32. Testing eSun PLA filaments: PLA-ST vs PLA+ vs Silk PLA My Tech Fun (Igor Gaspar) · 2026-08 · test
  33. BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  34. PolyTerra PLA vs PLA+ — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  35. Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
  36. PolyLite PLA Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  37. Prusament PLA Technical Data Sheet v1.0 Prusa Polymers · 2018-09 · tds
  38. Filamentive PLA (recycled) — product page Filamentive · 2026-08 · vendor
  39. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  40. Prusament rPLA Corn Pigment 1kg — product page Prusa Research · 2026-08 · vendor
  41. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  42. Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
  43. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  44. Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper