3D Printing Info

Filament comparison

PLA+ vs POM

Compare printing settings, strength, heat resistance, dated prices and sources.

PLA+ / Tough PLA guidePOM (acetal) guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PLA+ comparisonsMore POM comparisons
PLA+ vs POM — documented properties and sources
PropertyPLA+ / Tough PLAPLAPOM (acetal)ENGINEERING
Market snapshot
Listing priceUSD/kg; dated snapshots$16.49/kg median; $10.45–$39.99/kg across 10 dated product listingsNot documented
Identity & Market
Base polymer / chemistryPLA compounded with impact modifiers; suppliers publish the base as polylactic acid only[1][2]Polyoxymethylene, normally the copolymer POM-C. Apium's filament grade is POM-C with antistatic additives; no unfilled POM filament was found on sale[3][4]
Densityg/cm³1.17–1.24 (Polymaker); 1.21 (Bambu Lab, ISO 1183)[1][2]1.41 (extruded POM-C stock)[3]
Typical priceUSD/kgMainstream 1 kg spools cluster near 16[5][6]Not documented
Price range across brandsUSD/kg10–40 across brands; budget house brands 10–17, Sakata 3D HR-870 26, Polymaker and Fiberlogy 36–40[7][6][8][9][10]Not documented
Market availability1–5Stocked by most mainstream brands[7][5][6][8][9]Special order, 1-2 makers worldwide — Apium sells a POM-C ESD filament through its own shop and states its printers are the only ones able to process POM-C; no POM filament appears in the 3DJAKE or igo3d product sitemaps, at MatterHackers or at Printed Solid[4][11][12][13]
Spool sizes & diameters1.75 and 2.85 mm; 0.75, 0.85, 1 and 1.1 kg spools[8][9][7]Not documented
Typical applicationsFunctional parts and enclosures that need impact tolerance but not heat resistance[1][2]Gears, bushings, bearings, conveyor and food-machinery parts; Apium markets its POM-C ESD grade for semiconductor insulators, aerospace fasteners and sliding parts[3][4]
Diameter tolerance± mm±0.03 (Bambu Lab)[14]Not documented
Printing Parameters
Nozzle temperature°C190–230 (Polymaker); Bambu Lab Tough+ needs 220–250[1][2]Not documented
Bed temperature°C25–60 (Polymaker); 35–65 (Bambu Lab Tough+)[1][2]Not documented
Enclosure / chamber requirement1–5Open frame is fine[1][2]Not documented
Part cooling fanFan on[1][2]Not documented
Bed surface & adhesion aidTextured or smooth PEI; Bambu Lab recommends glue stick or liquid glue for Tough+[1][2]Not documented
Warping tendency1–5None[1]Not documented
Bed-adhesion difficulty1–5Sticks to anything[15]Not documented
Stringing / oozing tendency1–5Slight — 1–3 mm retraction handles it[1][15]Not documented
Overall printing difficulty1–5Easy — minor profile tuning; Tough+ wants a hotter nozzle than plain PLA[1][2]Not documented
Extruder requirementNot documentedApium states that the adaptive heating system on its industrial machines is what makes POM-C printable, and that no other 3D printer can process it[4]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[16]Not documented
Abrasiveness1–5Non-abrasive[17][16]Not documented
Nozzle clog risk1–5Very low[16]Not documented
Heat-creep / jam sensitivity1–5Moderate — good heatbreak cooling needed; softens below 60 °C like plain PLA[18]Not documented
Hotend requirementNo special hot-end required[15]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low — 0.27 % saturated at 25 °C / 55 % RH[2]Low (0.1-0.3 %) — extruded POM-C stock takes up 0.18 % in 24 h and 0.80 % at saturation (ASTM D570)[3]
Equilibrium moisture content at ~50 % RH%0.27 saturated at 25 °C / 55 % RH (Bambu Lab Tough+)[2]Not documented
Drying temperature & time55 °C for 6–8 h; 65–75 °C for 12 h on a Bambu Lab X1 heatbed[1][2]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing, rough surface and weak layers[19]Not documented
Effect of moisture on strengthPolymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures for the modified grades; the loss shows as poor layer adhesion rather than a strength number[19]Not documented
Storage requirementSealed with desiccant below 20 % RH; shelf life at ambient is long[2][15]Not documented
Mechanical Properties
Tensile strength (XY)MPa35–43 (printed XY, ISO 527); 53 on My Tech Fun 4×4 mm bars for Bambu Lab Tough[1][2][20][21]66.9 at break and 64.1 at yield (extruded POM-C stock, ASTM D638; converted from 9700 and 9300 psi)[3]
Young's modulusMPa1860–2150 (printed XY, ISO 527) — below plain PLA at 2300–3427[1][2][22][23]2275 (extruded POM-C stock, ASTM D638; converted from 330,000 psi)[3]
Elongation at break%5.1–5.7 (printed XY, ISO 527)[1][2]40 at break and 9 at yield (extruded POM-C stock, ASTM D638)[3]
Flexural strengthMPa62–65 (printed XY, ISO 178) — below plain PLA at 76–87[1][2][24][23]89.6 (extruded POM-C stock, ASTM D790; converted from 13,000 psi)[3]
Flexural modulusMPa2140–2393 (printed XY, ISO 178)[1][2]2758 (extruded POM-C stock, ASTM D790; converted from 400,000 psi)[3]
Charpy impact, notchedkJ/m²38.9–72.3 (printed XY, ISO 179, notched) — 5–9× plain PLA[1][2]Not documented
Other impact dataCharpy unnotched 80.6 printed XY (Bambu Lab Tough+); CNC Kitchen measured ~20 vs 5 kJ/m² for PolyLite PLA[2][20]Izod 53 J/m on extruded POM-C stock, converted from 1.0 ft-lb/in[3]
Layer adhesion / Z tensileMPa20.9–32.4 printed Z (ISO 527); 33.0 on My Tech Fun layer-adhesion bars vs 27.6 for PLA Basic[1][2][21]Not documented
Brittleness1–5Tough — absorbs impact, yields before breaking[1][2][20]Tough — absorbs impact, yields before breaking; extruded stock elongates 40 % before failing. No printed figure is published[3]
Hardness (scale-specific)Shore A / Shore D / Rockwell78.8 Shore D measured on printed bars (My Tech Fun), against 75.3 for the same maker's plain PLA[25]Rockwell 86 (and R120) — the source names only the R scale on extruded POM-C stock (ASTM D785)[3]
Creep resistance / sustained load1–5Poor — 12 mm bar sagged to 20.2 mm over 5 days at 1.25 kg, the same as plain PLA[21][26]Not documented
Fatigue / repeated-flex resistance1–5Below average — impact modifiers raise absorbed energy 5–9×; plain PLA ran 38 000–49 000 cycles at 30 % of tensile strength[27][2][20]Not documented
Elasticity / flexibility1–5Rigid[1]Not documented
Z strength as % of XY%60 (Bambu Lab Tough+) to 78 (PolyMax PLA), printed[1][2]Not documented
Wear resistance & frictionNot documentedWear factor 65e-10 in3*min/(ft*lb*h) and a dynamic coefficient of friction of 0.21 at 40 psi and 50 fpm (ASTM D3702, extruded stock) — the properties that make acetal the default gear and bushing plastic; Apium lists good sliding properties as the reason for its grade[3][4]
Thermal Properties
HDT at 0.45 MPa°C55 (PolyMax) to 61 (Tough+), ISO 75 at 0.45 MPa[1][2]158 (extruded POM-C stock, ASTM D648 at 66 psi; converted from 316 °F)[3]
HDT at 1.8 MPa°C52 (PolyMax) to 58 (Tough+), ISO 75 at 1.8 MPa[1][2]110 (extruded POM-C stock, ASTM D648 at 264 psi; converted from 230 °F)[3]
Glass transition (Tg)°C61 (DSC)[1][2]Not documented
Melting point / Vicat°C149–151 peak melt (DSC); Vicat 62 (ISO 306)[1][2]165 melting (extruded POM-C stock; converted from 329 °F)[3]
Continuous service temperature°C48–57 — loaded bars begin to move at this temperature: 48 for Polymaker PLA Pro, 50 for Sunlu PLA+, 52 for Bambu Lab Tough, 57 for PolyTerra PLA+[21][28][25][26]91 long term and 141 intermittent (extruded POM-C stock; converted from 195 °F and 285 °F)[3]
Thermal expansion (CTE)µm/m·K96–99 for plain printed PLA (fibre Bragg grating, 25–50 °C); no grade-specific measurement published[29]84.6 (extruded POM-C stock, ASTM D696; source states 4.7e-5 in/in/°F)[3]
Flammability / UL 94Flammable; no UL 94 rating published by the major brands[2][1]UL 94 HB on extruded POM-C stock[3]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors[18][30]Not documented
Chemical resistanceGood against weak acids, oils and grease; poor against strong acids and alkalis[1][2]Good chemical resistance, particularly to bases; Apium lists resistance to bases as a headline property[3][4]
Water / humidity resistance in service1–5Not documentedGood — minor absorption; 0.80 % water at saturation (ASTM D570, extruded stock)[3]
Food contactBase resin is food-contact grade, but printed layer grooves harbour bacteria; Prusa advises against food use[18]Not documented
Biodegradability / compostabilityIndustrially compostable only — needs sustained 55 °C; not home compostable[31][18]Not documented
RecyclabilityMechanically recyclable; not accepted in household plastic collection[31]Not documented
Electrical & ESD propertiesNot documentedVolume resistance 1e14 ohm-cm, dielectric strength 500 V/mil and dielectric constant 3.7 at 60 Hz on extruded stock (ASTM D257, D149, D150); Apium's filament grade adds antistatic agents[3][4]
Health & Safety
Fume toxicity1–5Low hazard — minimal VOC and particle emission[32]Not documented
Ventilation / filtration requirement1–5None needed in a normal room[32]Not documented
Post-Processing
Sanding & machiningWet sanding — dry sanding heats the surface by friction and smears it[30][18]Easy to machine — Ensinger lists machinability as a headline property of POM-C stock[3]
Gluing & solvent weldingCyanoacrylate for most joints; some grades partially dissolve and bond with acetone[18][33]Not documented
Vapour / chemical smoothingNo practical vapour smoothing — only chloroform, hot benzene or THF, which are laboratory-only[18]Not documented
Support material pairingPolySupport and PolyDissolve S1 (Polymaker); Support for PLA (Bambu Lab)[1][2]Not documented
Dimensional accuracy & detail55° overhangs and 30 mm bridges (Bambu Lab Tough+)[2]Not documented
Solvents & Solubility
Soluble inChloroform: 10 % w/v in 2–4 h at 23 °C, every grade and morphology; THF and DMF only at 65 °C. Laboratory reagents.[34]Hexafluoroisopropanol dissolves it at room temperature; NMP and DMF only when hot. Laboratory reagents.[35]
Softened or crazed byAcetone, ethyl acetate and toluene plasticise it but dissolve <1 % even at 65 °C; submersion in acetone crazes and destroys parts.[34][36]Acids, oxidants, halogens and hot concentrated zinc chloride attack it; alcohols, ketones and esters do not.[35][37]
Solvent welding & smoothing agentChloroform vapour smooths and welds PLA at the cost of tensile strength; acetone does not smooth it at all.[38][36]None — no solvent softens POM below its melting point, which is why it is bolted or heat-welded rather than glued.[35]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. PolyMax PLA Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  2. Bambu Filament Technical Data Sheet V3.0 — PLA Tough+ Bambu Lab · 2026-08 · tds
  3. TECAFORM AH natural (POM-C) — stock shape properties Ensinger · 2026-08 · tds
  4. POM-C ESD 3D printing — material page Apium 3D Technologies · 2026-08 · doc
  5. eSUN PLA+ 1.75mm 1KG eSUN Official Store · 2026-08 · vendor
  6. Overture PLA+ 1.75mm Overture3D · 2026-08 · vendor
  7. JAYO PLA+ 1.1KG Reusable Spool 1.75mm JAYO Official Store · 2026-08 · vendor
  8. Polymaker PolyMax PLA 0.75kg Polymaker Shop · 2026-08 · vendor
  9. Fiberlogy Impact PLA 850g 3DJake International · 2026-08 · vendor
  10. PLA HR-870 NATURAL Sakata 3D Filaments · 2026-08 · vendor
  11. 3DJAKE product catalogue 3DJAKE · 2026-08 · vendor
  12. igo3d product sitemap (17452 product URLs) igo3d · 2026-08 · vendor
  13. Printed Solid product catalogue Printed Solid · 2026-08 · vendor
  14. PLA Basic — product page Bambu Lab US Store · 2026-08 · vendor
  15. PLA — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  16. Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
  17. Prusament PLA — material page Prusa Polymers · 2026-08 · doc
  18. PLA — material guide Prusa Knowledge Base · 2026-08 · doc
  19. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  20. The difference of PLA and PLA+ tested! (feat. Polymaker) CNC Kitchen · 2020-08 · test
  21. BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  22. Prusament PLA Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  23. PolyLite PLA Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  24. Bambu Filament Technical Data Sheet V3.0 — PLA Basic Bambu Lab · 2026-08 · tds
  25. Carbon Fiber PLA vs META-PLA vs PLA+ vs PLA by Sunlu — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  26. PolyTerra PLA vs PLA+ — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  27. Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
  28. Polymaker PLA Pro vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  29. Characterization of Thermal Expansion Coefficient of 3D Printing Polymeric Materials Using Fiber Bragg Grating Sensors Materials 17(18):4668 · 2024-09 · paper
  30. Prusament PLA Technical Data Sheet v1.0 Prusa Polymers · 2018-09 · tds
  31. Filamentive PLA (recycled) — product page Filamentive · 2026-08 · vendor
  32. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  33. Prusament rPLA Corn Pigment 1kg — product page Prusa Research · 2026-08 · vendor
  34. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  35. Resistance of Ultramid, Ultraform and Ultradur to chemicals (TI-KTU/AS-28 e) BASF · 2000-10 · tds
  36. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  37. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  38. Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper