3D Printing Info

Filament comparison

PLA-GF vs PSU

Compare printing settings, strength, heat resistance, dated prices and sources.

Glass-fibre PLA (PLA-GF) guidePSU guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PLA-GF comparisonsMore PSU comparisons
PLA-GF vs PSU — documented properties and sources
PropertyGlass-fibre PLA (PLA-GF)PLAPSUHIGHTEMP
Market snapshot
Listing priceUSD/kg; dated snapshots$44.99/kg median; $29.99–$59.99/kg across 2 dated product listings$168.00/kg median; $168.00–$168.00/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryPLA filled with chopped glass fibre — 12 wt% (Polymaker HT-PLA-GF), 15–20 wt% (eSUN PLA-GF). Bambu Lab PLA Galaxy uses glass microspheres, not fibre, and is not equivalent[1][2][3]Polysulfone — the lowest-temperature and cheapest of the sulfone family[4]
Densityg/cm³1.31 (eSUN) to 1.337 (Polymaker), ISO 1183 / GB/T 1033[1][2]1.24 (ISO 1183)[4]
Typical priceUSD/kg1 kg spools cluster near 30[5][6]1 kg-equivalent spools cluster near 250[7]
Price range across brandsUSD/kg30–60 across brands; Polymaker 30, Proto-pasta 60[5][6]168-250 across formats; 250 g spool $42 (168/kg), 500 g $125 (250/kg) — 3DXTech is the only filament supplier found[7]
Market availability1–5Niche, a handful of specialist brands[5][6][2]Special order, 1–2 makers worldwide[7]
Spool sizes & diameters1.75 mm; 0.5 and 1 kg spools[6][8]1.75 mm; 250 g and 500 g spools[7]
Typical applicationsStiff brackets and fixtures; the Polymaker grade is aimed at parts annealed for heat resistance[1]Transparent high-temperature housings, medical trays and hot-water fittings[4]
Printing Parameters
Nozzle temperature°C210–230 (Polymaker HT-PLA-GF)[1]Not documented
Bed temperature°C25–60 (Polymaker HT-PLA-GF)[1]120–140 (3DXTech)[4]
Enclosure / chamber requirement1–5Open frame is fine[1]Actively heated chamber required[9][10]
Part cooling fanFan on — eSUN specifies 100 %[2]Not documented
Maximum volumetric flow (mm³/s; see test conditions)mm³/s28 at Polymaker's stated 350 mm/s on a 0.4 mm nozzle at 0.2 mm layer; eSUN prints its specimens at 60 mm/s[1][2][11]Not documented
Shrinkage%0.05 in X-Y and Z, 0.10 diagonal (Polymaker HT-PLA-GF)[1]Not documented
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile; hardened nozzle mandatory[1]Expert / industrial hardware only[9][10]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required[1]Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[9]
Abrasiveness1–5Highly abrasive — standard GF composite[1]Non-abrasive when unfilled[4]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; Prusa lists higher risk of nozzle clogging for glass-filled composites[12]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[13]
Hotend requirementHardened steel or ruby nozzle; Polymaker's own slicer preset sets a minimum nozzle hardness of 40 HRC[1]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Moderate — the PLA matrix takes up 0.40–0.51 % saturated; no glass-filled grade publishes its own figure[14][15]Not documented
Equilibrium moisture content at ~50 % RH%Not documented0.30 in 24 h on extruded stock (ASTM D570)[16]
Drying temperature & time60 °C for 6 h (Polymaker HT-PLA-GF)[1]Not documented
Effect of moisture on strengthPolymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures for this grade; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[17]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[13]
Mechanical Properties
Tensile strength (XY)MPa50.1 as printed and 50.2 annealed, printed XY, ISO 527 (Polymaker); eSUN quotes 59.3 by GB/T 1040[1][2]52 (printed XY, ISO 527, 3DXTech); 81 at break on extruded stock (ASTM D638)[4][16]
Young's modulusMPa3794 as printed, 4207 annealed, printed XY, ISO 527 (Polymaker)[1]2100 (printed XY, ISO 527)[4]
Elongation at break%2.77 as printed, 2.3 annealed, printed XY, ISO 527 (Polymaker); eSUN quotes 7.99[1][2]8 (printed XY, ISO 527) against 50 on extruded stock — nearly three times PPSU's printed 3 %[4][18][16]
Flexural strengthMPa86.4 printed XY, ISO 178 (Polymaker)[1]87 (printed XY, ISO 178)[4]
Flexural modulusMPa3685 printed XY, ISO 178 (Polymaker); eSUN quotes 4415 flexural modulus by GB/T 9341[1][2]2050 (printed XY, ISO 178)[4]
Charpy impact, notchedkJ/m²5.31 ± 0.46 as printed and 4.92 ± 0.50 annealed (printed XY, ISO 179, notched); Z 4.28 ± 0.18[1]Not documented
Other impact dataIzod 10.16 kJ/m² (eSUN, GB/T 1843)[2]Izod notched 69 J/m on extruded PSU stock, converted from 1.3 ft-lb/in (ASTM D256)[16]
Layer adhesion / Z tensileMPa23.7 as printed, 22.5 annealed, printed Z, ISO 527 (Polymaker)[1]Not documented
Brittleness1–5Very brittle — elongation at break 2.77 % in XY and 0.85 % in Z[1]Moderate[4]
Hardness (scale-specific)Shore A / Shore D / RockwellNot documentedRockwell M120 on extruded PSU stock (ASTM D785)[16]
Creep resistance / sustained load1–5Poor — no GF-grade creep test; plain printed PLA sagged from 12 to 16.2–21.8 mm over 5 days at 1.25 kg[19][20][21]Good. Ensinger lists high creep resistance as a headline property of extruded PSU stock, which is rated to 173 °C heat deflection at 1.8 MPa[16]
Fatigue / repeated-flex resistance1–5Poor — no grade-specific S-N curve; plain printed PLA ran 38 000–49 000 cycles at 30 % of tensile strength and elongation at break falls to 2.77 % in XY and 0.85 % in Z[22][1]Not documented
Elasticity / flexibility1–5Rigid[1]Rigid[4]
Z strength as % of XY%47 as printed (23.7 Z against 50.1 XY), printed[1]Not documented
Wear resistance & frictioneSUN describes high wear resistance and positions the grade for wear parts[2]Not documented
Thermal Properties
HDT at 0.45 MPa°C75.5 as printed, 114.7 after annealing (ISO 75, 0.45 MPa) — the point of the material[1]172 (printed XY, ISO 75 at 0.45 MPa, 3DXTech); 181 on extruded stock, converted from 358 °F at 66 psi[4][16]
HDT at 1.8 MPa°C59.7 as printed, 84 after annealing (ISO 75, 1.8 MPa)[1]174 on extruded PSU stock, converted from 345 °F at 264 psi (ASTM D648)[16]
Glass transition (Tg)°C59.8 (DSC)[1]187 (DSC, 3DXTech) and 185 on extruded stock (ASTM D3418), against 230 for PPSU[4][18][16]
Melting point / Vicat°C174.9 peak melt (DSC); Vicat 148.9 as printed, 148.3 annealed[1]Not documented
Continuous service temperature°CNot documented141 long-term service on extruded PSU stock, converted from 285 °F[16]
Annealing responseAnnealing lifts HDT at 0.45 MPa from 75.5 to 114.7 °C and modulus from 3794 to 4207 MPa[1]Not documented
Thermal expansion (CTE)µm/m·KNot documented55.8 (extruded PSU stock, ASTM D696; source states 3.1e-5 in/in/°F)[16]
Flammability / UL 94Not documentedUL 94 V-0 on extruded PSU stock[16]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors[23]Not documented
Electrical & ESD propertiesNot documentedSurface resistance above 10¹³ ohm/sq — an insulator (IEC 60093)[4]
Health & Safety
Fume toxicity1–5Low hazard — minimal VOC and particle emission[24]Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[24]
Ventilation / filtration requirement1–5None needed in a normal room[24]Ventilated room or enclosure recommended[24]
Dust & fibre handling hazardGlass fibre is bound in the matrix; avoid inhaling sanding dust[25]Not documented
Post-Processing
Dimensional accuracy & detailNear-zero shrinkage — 0.05 % in X-Y and Z (Polymaker)[1]Not documented
Solvents & Solubility
Soluble inChloroform dissolves the PLA matrix (10 % w/v, 2–4 h at 23 °C) and leaves the filler as loose sludge; laboratory reagent.[26]Chlorinated hydrocarbons — dichloromethane, chloroform — dissolve polysulfone; ketones and esters attack it as well.[27][28]
Softened or crazed byAcetone, ethyl acetate and toluene plasticise the matrix but dissolve <1 % even at 65 °C; acetone submersion crazes parts.[26][29]Acetone, MEK, ethyl acetate, benzene and toluene craze or stress-crack it; methanol and isopropanol only marginally.[28][27]
Solvent welding & smoothing agentChloroform vapour attacks only the resin fraction, so the filler is left standing proud; no workshop-safe agent exists.[30][29]Dichloromethane cement welds PSU and NMP softens residual resin. Both are laboratory reagents.[27]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Polymaker HT-PLA-GF Technical Data Sheet V1.1 Polymaker · 2026-08 · tds
  2. eSUN ePLA-GF Technical Data Sheet V1.0 (Nov 2023) eSUN (copy hosted on 3d.nice-cdn.com) · 2023-11 · tds
  3. Bambu Filament Technical Data Sheet V1.0 — PLA Galaxy Bambu Lab · 2026-08 · tds
  4. ThermaX PSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  5. Polymaker HT-PLA-GF — product page Polymaker Shop · 2026-08 · vendor
  6. Proto-pasta product catalogue Proto-pasta · 2026-08 · vendor
  7. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  8. Polymaker product catalogue Polymaker · 2026-08 · vendor
  9. Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
  10. Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
  11. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  12. Composite materials filled with carbon, kevlar or glass Prusa Knowledge Base · 2026-08 · doc
  13. THERMAX PSU — product page (print recommendations) 3DXTech · 2026-08 · doc
  14. Bambu Filament Technical Data Sheet V3.0 — PLA Basic Bambu Lab · 2026-08 · tds
  15. PolyLite PLA Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  16. TECASON S natural (PSU) — stock shape properties Ensinger · 2026-08 · tds
  17. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  18. ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  19. BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  20. Polymaker PLA Pro vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  21. Carbon Fiber PLA vs META-PLA vs PLA+ vs PLA by Sunlu — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  22. Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
  23. PLA — material guide Prusa Knowledge Base · 2026-08 · doc
  24. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  25. StoneFil safety data sheet Formfutura · 2026-08 · msds
  26. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  27. Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
  28. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  29. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  30. Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper