3D Printing Info

Filament comparison

PLA-GF vs POM

Compare printing settings, strength, heat resistance, dated prices and sources.

Glass-fibre PLA (PLA-GF) guidePOM (acetal) guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PLA-GF comparisonsMore POM comparisons
PLA-GF vs POM — documented properties and sources
PropertyGlass-fibre PLA (PLA-GF)PLAPOM (acetal)ENGINEERING
Market snapshot
Listing priceUSD/kg; dated snapshots$44.99/kg median; $29.99–$59.99/kg across 2 dated product listingsNot documented
Identity & Market
Base polymer / chemistryPLA filled with chopped glass fibre — 12 wt% (Polymaker HT-PLA-GF), 15–20 wt% (eSUN PLA-GF). Bambu Lab PLA Galaxy uses glass microspheres, not fibre, and is not equivalent[1][2][3]Polyoxymethylene, normally the copolymer POM-C. Apium's filament grade is POM-C with antistatic additives; no unfilled POM filament was found on sale[4][5]
Densityg/cm³1.31 (eSUN) to 1.337 (Polymaker), ISO 1183 / GB/T 1033[1][2]1.41 (extruded POM-C stock)[4]
Typical priceUSD/kg1 kg spools cluster near 30[6][7]Not documented
Price range across brandsUSD/kg30–60 across brands; Polymaker 30, Proto-pasta 60[6][7]Not documented
Market availability1–5Niche, a handful of specialist brands[6][7][2]Special order, 1-2 makers worldwide — Apium sells a POM-C ESD filament through its own shop and states its printers are the only ones able to process POM-C; no POM filament appears in the 3DJAKE or igo3d product sitemaps, at MatterHackers or at Printed Solid[5][8][9][10]
Spool sizes & diameters1.75 mm; 0.5 and 1 kg spools[7][11]Not documented
Typical applicationsStiff brackets and fixtures; the Polymaker grade is aimed at parts annealed for heat resistance[1]Gears, bushings, bearings, conveyor and food-machinery parts; Apium markets its POM-C ESD grade for semiconductor insulators, aerospace fasteners and sliding parts[4][5]
Printing Parameters
Nozzle temperature°C210–230 (Polymaker HT-PLA-GF)[1]Not documented
Bed temperature°C25–60 (Polymaker HT-PLA-GF)[1]Not documented
Enclosure / chamber requirement1–5Open frame is fine[1]Not documented
Part cooling fanFan on — eSUN specifies 100 %[2]Not documented
Maximum volumetric flow (mm³/s; see test conditions)mm³/s28 at Polymaker's stated 350 mm/s on a 0.4 mm nozzle at 0.2 mm layer; eSUN prints its specimens at 60 mm/s[1][2][12]Not documented
Shrinkage%0.05 in X-Y and Z, 0.10 diagonal (Polymaker HT-PLA-GF)[1]Not documented
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile; hardened nozzle mandatory[1]Not documented
Extruder requirementNot documentedApium states that the adaptive heating system on its industrial machines is what makes POM-C printable, and that no other 3D printer can process it[5]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required[1]Not documented
Abrasiveness1–5Highly abrasive — standard GF composite[1]Not documented
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; Prusa lists higher risk of nozzle clogging for glass-filled composites[13]Not documented
Hotend requirementHardened steel or ruby nozzle; Polymaker's own slicer preset sets a minimum nozzle hardness of 40 HRC[1]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Moderate — the PLA matrix takes up 0.40–0.51 % saturated; no glass-filled grade publishes its own figure[14][15]Low (0.1-0.3 %) — extruded POM-C stock takes up 0.18 % in 24 h and 0.80 % at saturation (ASTM D570)[4]
Drying temperature & time60 °C for 6 h (Polymaker HT-PLA-GF)[1]Not documented
Effect of moisture on strengthPolymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures for this grade; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[16]Not documented
Mechanical Properties
Tensile strength (XY)MPa50.1 as printed and 50.2 annealed, printed XY, ISO 527 (Polymaker); eSUN quotes 59.3 by GB/T 1040[1][2]66.9 at break and 64.1 at yield (extruded POM-C stock, ASTM D638; converted from 9700 and 9300 psi)[4]
Young's modulusMPa3794 as printed, 4207 annealed, printed XY, ISO 527 (Polymaker)[1]2275 (extruded POM-C stock, ASTM D638; converted from 330,000 psi)[4]
Elongation at break%2.77 as printed, 2.3 annealed, printed XY, ISO 527 (Polymaker); eSUN quotes 7.99[1][2]40 at break and 9 at yield (extruded POM-C stock, ASTM D638)[4]
Flexural strengthMPa86.4 printed XY, ISO 178 (Polymaker)[1]89.6 (extruded POM-C stock, ASTM D790; converted from 13,000 psi)[4]
Flexural modulusMPa3685 printed XY, ISO 178 (Polymaker); eSUN quotes 4415 flexural modulus by GB/T 9341[1][2]2758 (extruded POM-C stock, ASTM D790; converted from 400,000 psi)[4]
Charpy impact, notchedkJ/m²5.31 ± 0.46 as printed and 4.92 ± 0.50 annealed (printed XY, ISO 179, notched); Z 4.28 ± 0.18[1]Not documented
Other impact dataIzod 10.16 kJ/m² (eSUN, GB/T 1843)[2]Izod 53 J/m on extruded POM-C stock, converted from 1.0 ft-lb/in[4]
Layer adhesion / Z tensileMPa23.7 as printed, 22.5 annealed, printed Z, ISO 527 (Polymaker)[1]Not documented
Brittleness1–5Very brittle — elongation at break 2.77 % in XY and 0.85 % in Z[1]Tough — absorbs impact, yields before breaking; extruded stock elongates 40 % before failing. No printed figure is published[4]
Hardness (scale-specific)Shore A / Shore D / RockwellNot documentedRockwell 86 (and R120) — the source names only the R scale on extruded POM-C stock (ASTM D785)[4]
Creep resistance / sustained load1–5Poor — no GF-grade creep test; plain printed PLA sagged from 12 to 16.2–21.8 mm over 5 days at 1.25 kg[17][18][19]Not documented
Fatigue / repeated-flex resistance1–5Poor — no grade-specific S-N curve; plain printed PLA ran 38 000–49 000 cycles at 30 % of tensile strength and elongation at break falls to 2.77 % in XY and 0.85 % in Z[20][1]Not documented
Elasticity / flexibility1–5Rigid[1]Not documented
Z strength as % of XY%47 as printed (23.7 Z against 50.1 XY), printed[1]Not documented
Wear resistance & frictioneSUN describes high wear resistance and positions the grade for wear parts[2]Wear factor 65e-10 in3*min/(ft*lb*h) and a dynamic coefficient of friction of 0.21 at 40 psi and 50 fpm (ASTM D3702, extruded stock) — the properties that make acetal the default gear and bushing plastic; Apium lists good sliding properties as the reason for its grade[4][5]
Thermal Properties
HDT at 0.45 MPa°C75.5 as printed, 114.7 after annealing (ISO 75, 0.45 MPa) — the point of the material[1]158 (extruded POM-C stock, ASTM D648 at 66 psi; converted from 316 °F)[4]
HDT at 1.8 MPa°C59.7 as printed, 84 after annealing (ISO 75, 1.8 MPa)[1]110 (extruded POM-C stock, ASTM D648 at 264 psi; converted from 230 °F)[4]
Glass transition (Tg)°C59.8 (DSC)[1]Not documented
Melting point / Vicat°C174.9 peak melt (DSC); Vicat 148.9 as printed, 148.3 annealed[1]165 melting (extruded POM-C stock; converted from 329 °F)[4]
Continuous service temperature°CNot documented91 long term and 141 intermittent (extruded POM-C stock; converted from 195 °F and 285 °F)[4]
Annealing responseAnnealing lifts HDT at 0.45 MPa from 75.5 to 114.7 °C and modulus from 3794 to 4207 MPa[1]Not documented
Thermal expansion (CTE)µm/m·KNot documented84.6 (extruded POM-C stock, ASTM D696; source states 4.7e-5 in/in/°F)[4]
Flammability / UL 94Not documentedUL 94 HB on extruded POM-C stock[4]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors[21]Not documented
Chemical resistanceNot documentedGood chemical resistance, particularly to bases; Apium lists resistance to bases as a headline property[4][5]
Water / humidity resistance in service1–5Not documentedGood — minor absorption; 0.80 % water at saturation (ASTM D570, extruded stock)[4]
Electrical & ESD propertiesNot documentedVolume resistance 1e14 ohm-cm, dielectric strength 500 V/mil and dielectric constant 3.7 at 60 Hz on extruded stock (ASTM D257, D149, D150); Apium's filament grade adds antistatic agents[4][5]
Health & Safety
Fume toxicity1–5Low hazard — minimal VOC and particle emission[22]Not documented
Ventilation / filtration requirement1–5None needed in a normal room[22]Not documented
Dust & fibre handling hazardGlass fibre is bound in the matrix; avoid inhaling sanding dust[23]Not documented
Post-Processing
Sanding & machiningNot documentedEasy to machine — Ensinger lists machinability as a headline property of POM-C stock[4]
Dimensional accuracy & detailNear-zero shrinkage — 0.05 % in X-Y and Z (Polymaker)[1]Not documented
Solvents & Solubility
Soluble inChloroform dissolves the PLA matrix (10 % w/v, 2–4 h at 23 °C) and leaves the filler as loose sludge; laboratory reagent.[24]Hexafluoroisopropanol dissolves it at room temperature; NMP and DMF only when hot. Laboratory reagents.[25]
Softened or crazed byAcetone, ethyl acetate and toluene plasticise the matrix but dissolve <1 % even at 65 °C; acetone submersion crazes parts.[24][26]Acids, oxidants, halogens and hot concentrated zinc chloride attack it; alcohols, ketones and esters do not.[25][27]
Solvent welding & smoothing agentChloroform vapour attacks only the resin fraction, so the filler is left standing proud; no workshop-safe agent exists.[28][26]None — no solvent softens POM below its melting point, which is why it is bolted or heat-welded rather than glued.[25]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Polymaker HT-PLA-GF Technical Data Sheet V1.1 Polymaker · 2026-08 · tds
  2. eSUN ePLA-GF Technical Data Sheet V1.0 (Nov 2023) eSUN (copy hosted on 3d.nice-cdn.com) · 2023-11 · tds
  3. Bambu Filament Technical Data Sheet V1.0 — PLA Galaxy Bambu Lab · 2026-08 · tds
  4. TECAFORM AH natural (POM-C) — stock shape properties Ensinger · 2026-08 · tds
  5. POM-C ESD 3D printing — material page Apium 3D Technologies · 2026-08 · doc
  6. Polymaker HT-PLA-GF — product page Polymaker Shop · 2026-08 · vendor
  7. Proto-pasta product catalogue Proto-pasta · 2026-08 · vendor
  8. 3DJAKE product catalogue 3DJAKE · 2026-08 · vendor
  9. igo3d product sitemap (17452 product URLs) igo3d · 2026-08 · vendor
  10. Printed Solid product catalogue Printed Solid · 2026-08 · vendor
  11. Polymaker product catalogue Polymaker · 2026-08 · vendor
  12. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  13. Composite materials filled with carbon, kevlar or glass Prusa Knowledge Base · 2026-08 · doc
  14. Bambu Filament Technical Data Sheet V3.0 — PLA Basic Bambu Lab · 2026-08 · tds
  15. PolyLite PLA Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  16. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  17. BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  18. Polymaker PLA Pro vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  19. Carbon Fiber PLA vs META-PLA vs PLA+ vs PLA by Sunlu — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  20. Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
  21. PLA — material guide Prusa Knowledge Base · 2026-08 · doc
  22. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  23. StoneFil safety data sheet Formfutura · 2026-08 · msds
  24. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  25. Resistance of Ultramid, Ultraform and Ultradur to chemicals (TI-KTU/AS-28 e) BASF · 2000-10 · tds
  26. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  27. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  28. Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper