3D Printing Info

Filament comparison

PC vs PSU

Compare printing settings, strength, heat resistance, dated prices and sources.

Polycarbonate (PC) guidePSU guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC comparisonsMore PSU comparisons
PC vs PSU — documented properties and sources
PropertyPolycarbonate (PC)PCPSUHIGHTEMP
Market snapshot
Listing priceUSD/kg; dated snapshots$39.99/kg median; $29.99–$92.00/kg across 9 dated product listings$168.00/kg median; $168.00–$168.00/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryBisphenol-A polycarbonate — an amorphous engineering thermoplastic[1][2]Polysulfone — the lowest-temperature and cheapest of the sulfone family[3]
Densityg/cm³1.19 (Polymaker) to 1.22 (Prusament), ISO 1183; Bambu Lab 1.20; Stratasys specific gravity 1.20 (ASTM D792)[1][4][5][6]1.24 (ISO 1183)[3]
Typical priceUSD/kg1 kg spools cluster near 40[5][7][8]1 kg-equivalent spools cluster near 250[9]
Price range across brandsUSD/kg30–92 across brands; Polymaker PolyLite 30, Bambu Lab 40, Polymaker PolyMax 52, Prusament 59, 3DXTech ezPC 64 and 3DXMAX PC 92[7][5][8][9]168-250 across formats; 250 g spool $42 (168/kg), 500 g $125 (250/kg) — 3DXTech is the only filament supplier found[9]
Market availability1–5Available from several mainstream brands[5][7][9][8]Special order, 1–2 makers worldwide[9]
Spool sizes & diameters1.75 and 2.85 mm; 0.5, 0.75, 0.9, 1 and 3 kg spools[7][9][8]1.75 mm; 250 g and 500 g spools[9]
Typical applicationsLight guides, lenses, under-bonnet automotive parts and impact-loaded housings that must hold shape above 110 °C[2][1]Transparent high-temperature housings, medical trays and hot-water fittings[3]
Diameter tolerance± mm±0.03 (Prusament PC Blend)[4]Not documented
Printing Parameters
Nozzle temperature°C250–280 across brands; Prusament 275 ± 10, Bambu Lab 260–280, Polymaker 250–270. Polymaker's material guide gives a wider 260–310 for PC and its composites[4][5][1][2]Not documented
Bed temperature°C90–115; Prusament 110 ± 10, Bambu Lab 90–110, Polymaker 90–105[4][5][1]120–140 (3DXTech)[3]
Enclosure / chamber requirement1–5Enclosure required (passive) — Polymaker specifies a 70–100 °C chamber, Bambu Lab 45–60 °C and rules out its P1P and A-series machines[1][5][10]Actively heated chamber required[11][12]
Recommended chamber temperature°C70–100 (Polymaker); 45–60 (Bambu Lab)[1][5]Not documented
Part cooling fanOff or very low — Polymaker specifies off, Prusament 20 % within a 0–30 % range, Bambu Lab 0–60 %[1][4][5]Not documented
Bed surface & adhesion aidTextured PEI with glue when needed (Polymaker); smooth or textured PEI (Bambu Lab)[1][13]Not documented
Maximum volumetric flow (mm³/s; see test conditions)mm³/s24 at Bambu Lab's 300 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer; Polymaker allows 50–200 mm/s and its material guide advises 30–60 for layer adhesion[5][1][2][14]Not documented
Warping tendency1–5Severe — heated chamber needed[1][2][10]Not documented
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[1][10]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed[2]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[2][10]Expert / industrial hardware only[11][12]
Extruder requirementAll-metal hotend rated to 300 °C; Polymaker advises larger nozzles and high chamber temperatures to improve bonding[2]Not documented
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[10]Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[11]
Abrasiveness1–5Non-abrasive[1]Non-abrasive when unfilled[3]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle[2]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[15]
Heat-creep / jam sensitivity1–5Slightly sensitive[16]Not documented
Hotend requirementAll-metal hot end required (Simplify3D); Polymaker advises a hot end rated above 300 °C[16][2]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low — 0.25 % saturated at 25 °C / 55 % RH (Bambu Lab); Prusa measures 0.15 % after 7 days at 22 % RH. Polymaker nonetheless calls PC highly hygroscopic in service[5][4][2]Not documented
Equilibrium moisture content at ~50 % RH%0.25 saturated at 25 °C / 55 % RH (Bambu Lab); 0.15 after 7 days at 24 °C / 22 % RH (Prusa)[5][4]0.30 in 24 h on extruded stock (ASTM D570)[17]
Drying temperature & time80 °C for 8 h (Bambu Lab); 75 °C for 6 h (Polymaker); 70–80 °C for 6–8 h (Polymaker material guide)[5][1][2]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing, rough surface and weak layers[18]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[2][18]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[15]
Storage requirementAirtight containers with desiccant to prevent reabsorption[2]Not documented
Mechanical Properties
Tensile strength (XY)MPa53.4 (PolyMax) to 69.1 (PolyLite) printed XY, ISO 527; Bambu Lab 62 +/- 2 and Prusament 63 +/- 1 at yield; Stratasys 62.3-64.6 at yield printed XZ, ASTM D638 (its PC White table duplicates the Antero 840CN03 figures and was not used)[1][19][5][4][20][6]52 (printed XY, ISO 527, 3DXTech); 81 at break on extruded stock (ASTM D638)[3][17]
Young's modulusMPa2110 (Bambu Lab) to 2497 (PolyLite) printed XY, ISO 527; Prusament 1900, 3DXTech 2180[5][1][4][20]2100 (printed XY, ISO 527)[3]
Elongation at break%3.8 (Bambu Lab) to 4.8 (PolyLite) at break, printed XY, ISO 527; 3DXTech quotes 14 at break, Prusament 5.8 at yield[5][1][20][4]8 (printed XY, ISO 527) against 50 on extruded stock — nearly three times PPSU's printed 3 %[3][21][17]
Flexural strengthMPa81.3 (PolyMax) to 108 (Bambu Lab) printed XY, ISO 178; Prusament 88 ± 1, PolyLite 106.1[19][5][4][1]87 (printed XY, ISO 178)[3]
Flexural modulusMPa2050 (PolyMax) to 2640 (PolyLite) printed XY, ISO 178; Prusament 2100[19][1][4]2050 (printed XY, ISO 178)[3]
Charpy impact, notchedkJ/m²4.1 (PolyLite) to 21.3 (PolyMax) printed XY, ISO 179, notched; Prusament 12 ± 1[1][19][4]Not documented
Other impact dataCharpy unnotched does not break on Prusa's pendulum in either orientation (ISO 179-1); PolyMax PC retains 9.2 kJ/m2 notched at -30 °C. Stratasys PC Black gives 85.3 MPa flexural strength at break in ZX against no break in XZ (ASTM D790, printed)[4][19][6]Izod notched 69 J/m on extruded PSU stock, converted from 1.3 ft-lb/in (ASTM D256)[17]
Layer adhesion / Z tensileMPa37.1-45.3 at yield printed ZX (Stratasys PC Black and Red, ASTM D638); 41.4 (PolyMax) to 56 (Bambu Lab) printed Z; Prusa's interlayer adhesion test gives 21 +/- 2[4][19][5][6]Not documented
Brittleness1–5Tough — absorbs impact, yields before breaking[2][4]Moderate[3]
Hardness (scale-specific)Shore A / Shore D / RockwellShore D 79 (Prusa Polymers method) and Shore D 79 on extruded PC stock (ASTM D2240); Rockwell 70 (118) — the source does not name the scales[4][22]Rockwell M120 on extruded PSU stock (ASTM D785)[17]
Creep resistance / sustained load1–5Excellent — holds load for years. Room-temperature tensile creep of moulded PC was still running unbroken at 41 MPa when the experiment was stopped for time; specimens failed within the test window only at 47-52 MPa (ASTM D638)[23]Good. Ensinger lists high creep resistance as a headline property of extruded PSU stock, which is rated to 173 °C heat deflection at 1.8 MPa[17]
Fatigue / repeated-flex resistance1–5Good[4][2]Not documented
Elasticity / flexibility1–5Rigid[1]Rigid[3]
Z strength as % of XY%59-73 (Stratasys PC Black and Red, ZX against XZ tensile yield, ASTM D638); 76 for PolyLite PC and 90 for Bambu Lab (printed Z against XY tensile)[5][1][6]Not documented
Thermal Properties
HDT at 0.45 MPa°C110 (PolyMax PC-FR) to 114 (PolyMax PC), ISO 75 at 0.45 MPa; Bambu Lab 112, PolyLite 111, Prusament 113. Stratasys FDM PC reaches 144 printed (ASTM D648 Method B at 66 psi)[19][1][5][4][6]172 (printed XY, ISO 75 at 0.45 MPa, 3DXTech); 181 on extruded stock, converted from 358 °F at 66 psi[3][17]
HDT at 1.8 MPa°C93 (Prusament) to 117 (Bambu Lab), ISO 75 at 1.8 MPa; PolyLite 107, PolyMax 99. Stratasys FDM PC reaches 141 printed (ASTM D648 Method B at 264 psi)[4][5][1][19][6]174 on extruded PSU stock, converted from 345 °F at 264 psi (ASTM D648)[17]
Glass transition (Tg)°C113 (Polymaker, DSC), 142.5 (Stratasys, ASTM D7426 inflection point) and 145 (Bambu Lab, DSC); Polymaker's material guide quotes 150[1][5][2][6]187 (DSC, 3DXTech) and 185 on extruded stock (ASTM D3418), against 230 for PPSU[3][21][17]
Melting point / Vicat°CAmorphous — no melting point; Vicat 117–120 (Polymaker, ISO 306); decomposition above 360 °C[1][19]Not documented
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend; extruded PC stock is rated 121 long term (converted from 250 °F)[4][22]141 long-term service on extruded PSU stock, converted from 285 °F[17]
Annealing response90 °C for 2 h (Polymaker)[1]Not documented
Thermal expansion (CTE)µm/m·K51.6 in XY over -50 to 30 °C, falling to 35.8 over 30-75 °C and 11.5 over 75-130 °C; 49.2 in XZ over -50 to 120 °C (printed, ASTM E831). Extruded PC stock gives 68.4 (ASTM D696)[6][22]55.8 (extruded PSU stock, ASTM D696; source states 3.1e-5 in/in/°F)[17]
Flammability / UL 94Flammable; no UL 94 rating on standard PC, though V-0 grades exist[24][1]UL 94 V-0 on extruded PSU stock[17]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors — unstabilised PC yellows and embrittles under UV[2]Not documented
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[2]Not documented
Water / humidity resistance in service1–5Good — minor absorption[5]Not documented
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[2]Not documented
Biodegradability / compostabilityNot biodegradable[2]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[2]Not documented
Electrical & ESD propertiesSurface resistance above 10¹³ ohm/sq — an electrical insulator, which Polymaker lists as a headline advantage[20][2]Surface resistance above 10¹³ ohm/sq — an insulator (IEC 60093)[3]
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[25]Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[25]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[25]Not documented
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[25][10]Ventilated room or enclosure recommended[25]
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[16]Not documented
Painting & finishingOptical clarity survives printing, so transparent parts are usually left unpainted[2]Not documented
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[16]Not documented
Vapour / chemical smoothingNo practical vapour smoothing[16]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[16]Not documented
Dimensional accuracy & detailWarping is the dominant accuracy limit; light transmission 89 % on PolyLite PC (GB/T 2410)[1][2]Not documented
Solvents & Solubility
Soluble inDichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[26]Chlorinated hydrocarbons — dichloromethane, chloroform — dissolve polysulfone; ketones and esters attack it as well.[27][28]
Softened or crazed byMethanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[26]Acetone, MEK, ethyl acetate, benzene and toluene craze or stress-crack it; methanol and isopropanol only marginally.[28][27]
Solvent welding & smoothing agentDichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[29]Dichloromethane cement welds PSU and NMP softens residual resin. Both are laboratory reagents.[27]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  2. PC — material basics Polymaker Wiki · 2026-08 · doc
  3. ThermaX PSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  4. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  5. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  6. PC (Polycarbonate) — FDM Material Data Sheet Stratasys · 2026-04 · tds
  7. Polymaker product catalogue Polymaker · 2026-08 · vendor
  8. Printed Solid product catalogue Printed Solid · 2026-08 · vendor
  9. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  10. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  11. Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
  12. Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
  13. Bambu Filament Technical Data Sheet V1.0 — PC FR Bambu Lab · 2026-08 · tds
  14. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  15. THERMAX PSU — product page (print recommendations) 3DXTech · 2026-08 · doc
  16. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  17. TECASON S natural (PSU) — stock shape properties Ensinger · 2026-08 · tds
  18. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  19. PolyMax PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  20. ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
  21. ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  22. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  23. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  24. PolyMax PC-FR Technical Data Sheet V5.5 Polymaker · 2024-11 · tds
  25. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  26. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  27. Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
  28. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  29. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds