3D Printing Info

Filament comparison

PC-FR vs PSU

Compare printing settings, strength, heat resistance, dated prices and sources.

Flame-retardant PC (PC-FR) guidePSU guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-FR comparisonsMore PSU comparisons
PC-FR vs PSU — documented properties and sources
PropertyFlame-retardant PC (PC-FR)PCPSUHIGHTEMP
Market snapshot
Listing priceUSD/kg; dated snapshots$87.50/kg median; $54.99–$224.00/kg across 4 dated product listings$168.00/kg median; $168.00–$168.00/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryFlame-retardant polycarbonate. Polymaker builds its grade on Covestro's Makrolon family and rates it UL 94 V-0[1][2]Polysulfone — the lowest-temperature and cheapest of the sulfone family[3]
Densityg/cm³1.18 (Bambu Lab) and 1.2 (Polymaker), ISO 1183[2][1]1.24 (ISO 1183)[3]
Typical priceUSD/kg1 kg-equivalent spools span 55–224; the two mainstream 1 kg grades are 55 and the industrial grades 120–224[2][4]1 kg-equivalent spools cluster near 250[5]
Price range across brandsUSD/kg55–224 across brands; Bambu Lab and Polymaker 55, 3DXTech FR PC/ABS 120, 3DXLABS FR-PC 224[2][4][5]168-250 across formats; 250 g spool $42 (168/kg), 500 g $125 (250/kg) — 3DXTech is the only filament supplier found[5]
Market availability1–5Available from several mainstream brands[2][4][5]Special order, 1–2 makers worldwide[5]
Spool sizes & diameters1.75 mm; 0.75 and 1 kg spools[4][5][2]1.75 mm; 250 g and 500 g spools[5]
Typical applicationsElectrical enclosures, transport interiors and battery housings that must meet a flammability rating[1][2]Transparent high-temperature housings, medical trays and hot-water fittings[3]
Diameter tolerance± mm±0.03 (Bambu Lab PC FR)[2]Not documented
Printing Parameters
Nozzle temperature°C260–280 (Bambu Lab); 250–270 (Polymaker)[2][1]Not documented
Bed temperature°C90–110 (Bambu Lab); 90–105 (Polymaker)[2][1]120–140 (3DXTech)[3]
Enclosure / chamber requirement1–5Enclosure required (passive) — Bambu Lab specifies a 45–60 °C chamber, Polymaker 70–100 °C[2][1]Actively heated chamber required[6][7]
Recommended chamber temperature°C45–60 (Bambu Lab); 70–100 (Polymaker)[2][1]Not documented
Part cooling fan0–60 % (Bambu Lab)[2]Not documented
Bed surface & adhesion aidSmooth or textured PEI plate (Bambu Lab)[2]Not documented
Maximum volumetric flow (mm³/s; see test conditions)mm³/s24 at Bambu Lab's 300 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[2][8]Not documented
Warping tendency1–5Severe — heated chamber needed[1][9]Not documented
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[10][11]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[11]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[2][9]Expert / industrial hardware only[6][7]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[9]Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[6]
Abrasiveness1–5Non-abrasive[1]Non-abrasive when unfilled[3]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 6 h pre-dry at 80 °C[12]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[13]
Heat-creep / jam sensitivity1–5Slightly sensitive[10]Not documented
Hotend requirementAll-metal hot end required (Simplify3D)[10]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — 0.12 % saturated at 25 °C / 55 % RH (Bambu Lab), half that of unfilled Bambu Lab PC[2][14]Not documented
Equilibrium moisture content at ~50 % RH%0.12 saturated at 25 °C / 55 % RH (Bambu Lab)[2]0.30 in 24 h on extruded stock (ASTM D570)[15]
Drying temperature & time75 °C for 6 h (Polymaker)[1]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[16]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[11][16]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[13]
Storage requirementAirtight containers with desiccant to prevent reabsorption[11]Not documented
Mechanical Properties
Tensile strength (XY)MPa60 ± 4 (Bambu Lab) and 67 ± 4.5 (Polymaker) printed XY, ISO 527[2][1]52 (printed XY, ISO 527, 3DXTech); 81 at break on extruded stock (ASTM D638)[3][15]
Young's modulusMPa1670 ± 40 (Bambu Lab) and 2634 ± 182 (Polymaker) printed XY, ISO 527[2][1]2100 (printed XY, ISO 527)[3]
Elongation at break%2.4 ± 0.3 (Bambu Lab) and 3.49 ± 0.7 (Polymaker) at break, printed XY, ISO 527 — the retardant roughly halves unfilled PC's elongation[2][1][17]8 (printed XY, ISO 527) against 50 on extruded stock — nearly three times PPSU's printed 3 %[3][18][15]
Flexural strengthMPa96.6 ± 1.3 printed XY, ISO 178 (Polymaker)[1]87 (printed XY, ISO 178)[3]
Flexural modulusMPa2518 ± 53 printed XY, ISO 178 (Polymaker)[1]2050 (printed XY, ISO 178)[3]
Charpy impact, notchedkJ/m²11.7 ± 1.6 printed XY, ISO 179, notched (Polymaker)[1]Not documented
Other impact dataNotched Charpy 7.5 ± 1.6 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA)[1]Izod notched 69 J/m on extruded PSU stock, converted from 1.3 ft-lb/in (ASTM D256)[15]
Layer adhesion / Z tensileMPa21 ± 3 (Bambu Lab) and 46 ± 4.8 (Polymaker) printed Z, ISO 527[2][1]Not documented
Brittleness1–5Moderate[2][1]Moderate[3]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a flame-retardant filament[19]Rockwell M120 on extruded PSU stock (ASTM D785)[15]
Creep resistance / sustained load1–5Good. Moulded unfilled PC sustained 41 MPa tensile creep at room temperature without breaking, but the retardant package drops the glass transition to 115 °C in Polymaker's grade, so the unfilled rating is not carried over in full[20][1]Good. Ensinger lists high creep resistance as a headline property of extruded PSU stock, which is rated to 173 °C heat deflection at 1.8 MPa[15]
Elasticity / flexibility1–5Rigid[1]Rigid[3]
Z strength as % of XY%35 (Bambu Lab) to 69 (Polymaker), printed[2][1]Not documented
Thermal Properties
HDT at 0.45 MPa°C110 (Polymaker) and 113 (Bambu Lab), ISO 75 at 0.45 MPa[1][2]172 (printed XY, ISO 75 at 0.45 MPa, 3DXTech); 181 on extruded stock, converted from 358 °F at 66 psi[3][15]
HDT at 1.8 MPa°C107 (Polymaker) and 108 (Bambu Lab), ISO 75 at 1.8 MPa[1][2]174 on extruded PSU stock, converted from 345 °F at 264 psi (ASTM D648)[15]
Glass transition (Tg)°C115 (Polymaker) and 145 (Bambu Lab), DSC[1][2]187 (DSC, 3DXTech) and 185 on extruded stock (ASTM D3418), against 230 for PPSU[3][18][15]
Melting point / Vicat°CAmorphous — no melting point; Vicat 114 (Bambu Lab, ISO 306)[2]Not documented
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[21]141 long-term service on extruded PSU stock, converted from 285 °F[15]
Thermal expansion (CTE)µm/m·K68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a flame-retardant grade[19]55.8 (extruded PSU stock, ASTM D696; source states 3.1e-5 in/in/°F)[15]
Flammability / UL 94UL 94 V-0 (Polymaker PolyMax PC-FR); 3DXTech rates its FR PC/ABS V-0 at 1.5 mm on the base resin[1][22]UL 94 V-0 on extruded PSU stock[15]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors unless stabilised[11]Not documented
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[11]Not documented
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[11]Not documented
Biodegradability / compostabilityNot biodegradable[11]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[11]Not documented
Electrical & ESD propertiesNot documentedSurface resistance above 10¹³ ohm/sq — an insulator (IEC 60093)[3]
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[23]Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[23]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[23]Not documented
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[23][9]Ventilated room or enclosure recommended[23]
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[10]Not documented
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[10]Not documented
Vapour / chemical smoothingNo practical vapour smoothing[10]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[10]Not documented
Solvents & Solubility
Soluble inDichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[24]Chlorinated hydrocarbons — dichloromethane, chloroform — dissolve polysulfone; ketones and esters attack it as well.[25][26]
Softened or crazed byMethanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[24]Acetone, MEK, ethyl acetate, benzene and toluene craze or stress-crack it; methanol and isopropanol only marginally.[26][25]
Solvent welding & smoothing agentDichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[27]Dichloromethane cement welds PSU and NMP softens residual resin. Both are laboratory reagents.[25]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. PolyMax PC-FR Technical Data Sheet V5.5 Polymaker · 2024-11 · tds
  2. Bambu Filament Technical Data Sheet V1.0 — PC FR Bambu Lab · 2026-08 · tds
  3. ThermaX PSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  4. Polymaker product catalogue Polymaker · 2026-08 · vendor
  5. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  6. Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
  7. Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
  8. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  9. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  10. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  11. PC — material basics Polymaker Wiki · 2026-08 · doc
  12. 3DXTech Firewire FR-PC/ABS product page 3DXTech · 2026-08 · vendor
  13. THERMAX PSU — product page (print recommendations) 3DXTech · 2026-08 · doc
  14. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  15. TECASON S natural (PSU) — stock shape properties Ensinger · 2026-08 · tds
  16. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  17. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  18. ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  19. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  20. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  21. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  22. Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
  23. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  24. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  25. Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
  26. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  27. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds