3D Printing Info

Filament comparison

PC-FR vs PPSU

Compare printing settings, strength, heat resistance, dated prices and sources.

Flame-retardant PC (PC-FR) guidePPSU guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-FR comparisonsMore PPSU comparisons
PC-FR vs PPSU — documented properties and sources
PropertyFlame-retardant PC (PC-FR)PCPPSUHIGHTEMP
Market snapshot
Listing priceUSD/kg; dated snapshots$87.50/kg median; $54.99–$224.00/kg across 4 dated product listings$337.40/kg median; $223.00–$732.56/kg across 4 dated product listings
Identity & Market
Base polymer / chemistryFlame-retardant polycarbonate. Polymaker builds its grade on Covestro's Makrolon family and rates it UL 94 V-0[1][2]Polyphenylsulfone — an amorphous high-temperature sulfone polymer[3]
Densityg/cm³1.18 (Bambu Lab) and 1.2 (Polymaker), ISO 1183[2][1]1.28 (ISO 1183, 3DXTech; ASTM D792, Stratasys PPSF)[3][4]
Typical priceUSD/kg1 kg-equivalent spools span 55–224; the two mainstream 1 kg grades are 55 and the industrial grades 120–224[2][5]1 kg-equivalent spools span 223–733; the middle of the market is about 425[6][7][8][9]
Price range across brandsUSD/kg55–224 across brands; Bambu Lab and Polymaker 55, 3DXTech FR PC/ABS 120, 3DXLABS FR-PC 224[2][5][6]223-733 across brands; IEMAI 3D 223 at 1 kg, 3DXTech ThermaX PPSU 250 at 500 g, 3D4Makers 425 at 750 g, Kimya PPSU-S 733 at 500 g[6][7][8][9]
Market availability1–5Available from several mainstream brands[2][5][6]Niche, a handful of specialist brands[6][7][8]
Spool sizes & diameters1.75 mm; 0.75 and 1 kg spools[5][6][2]1.75 and 2.85 mm; 200 g to 750 g spools[6][7][8]
Typical applicationsElectrical enclosures, transport interiors and battery housings that must meet a flammability rating[1][2]Steam-sterilisable medical and dental tooling, and aircraft interior parts[3]
Diameter tolerance± mm±0.03 (Bambu Lab PC FR)[2]Not documented
Printing Parameters
Nozzle temperature°C260–280 (Bambu Lab); 250–270 (Polymaker)[2][1]Not documented
Bed temperature°C90–110 (Bambu Lab); 90–105 (Polymaker)[2][1]130–150 (3DXTech)[3]
Enclosure / chamber requirement1–5Enclosure required (passive) — Bambu Lab specifies a 45–60 °C chamber, Polymaker 70–100 °C[2][1]Actively heated chamber required[10][11]
Recommended chamber temperature°C45–60 (Bambu Lab); 70–100 (Polymaker)[2][1]Not documented
Part cooling fan0–60 % (Bambu Lab)[2]Not documented
Bed surface & adhesion aidSmooth or textured PEI plate (Bambu Lab)[2]Not documented
Maximum volumetric flow (mm³/s; see test conditions)mm³/s24 at Bambu Lab's 300 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[2][12]Not documented
Warping tendency1–5Severe — heated chamber needed[1][13]Severe — heated chamber needed[10]
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[14][15]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[15]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[2][13]Expert / industrial hardware only[10][11]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[13]Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[10]
Abrasiveness1–5Non-abrasive[1]Non-abrasive when unfilled[3]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 6 h pre-dry at 80 °C[16]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[17]
Heat-creep / jam sensitivity1–5Slightly sensitive[14]Not documented
Hotend requirementAll-metal hot end required (Simplify3D)[14]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — 0.12 % saturated at 25 °C / 55 % RH (Bambu Lab), half that of unfilled Bambu Lab PC[2][18]Not documented
Equilibrium moisture content at ~50 % RH%0.12 saturated at 25 °C / 55 % RH (Bambu Lab)[2]0.37 in 24 h and 1.1 at saturation on extruded stock (ASTM D570)[19]
Drying temperature & time75 °C for 6 h (Polymaker)[1]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[20]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[15][20]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[17]
Storage requirementAirtight containers with desiccant to prevent reabsorption[15]Not documented
Mechanical Properties
Tensile strength (XY)MPa60 ± 4 (Bambu Lab) and 67 ± 4.5 (Polymaker) printed XY, ISO 527[2][1]55 (printed XY, ISO 527, 3DXTech) and 55 (printed on side long edge, ASTM D638, Stratasys PPSF); 79 at yield on extruded stock[3][4][19]
Young's modulusMPa1670 ± 40 (Bambu Lab) and 2634 ± 182 (Polymaker) printed XY, ISO 527[2][1]2100 (printed, ASTM D638, Stratasys PPSF) and 2310 (printed XY, ISO 527, 3DXTech); 2344 on extruded stock[3][4][19]
Elongation at break%2.4 ± 0.3 (Bambu Lab) and 3.49 ± 0.7 (Polymaker) at break, printed XY, ISO 527 — the retardant roughly halves unfilled PC's elongation[2][1][21]3 (printed, ISO 527 and ASTM D638) against 60 on extruded stock — printing costs PPSU almost all of its ductility[3][4][19]
Flexural strengthMPa96.6 ± 1.3 printed XY, ISO 178 (Polymaker)[1]110 (printed, ISO 178 and ASTM D790, 3DXTech and Stratasys PPSF agree); 91 on extruded stock[3][4][19]
Flexural modulusMPa2518 ± 53 printed XY, ISO 178 (Polymaker)[1]2200 (printed, ASTM D790, Stratasys PPSF) and 2215 (printed XY, ISO 178, 3DXTech)[3][4]
Charpy impact, notchedkJ/m²11.7 ± 1.6 printed XY, ISO 179, notched (Polymaker)[1]Not documented
Other impact dataNotched Charpy 7.5 ± 1.6 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA)[1]Izod notched 58.7 J/m and unnotched 165.5 J/m (printed, ASTM D256 Method A, Stratasys PPSF); 160 J/m notched on extruded stock[4][19]
Layer adhesion / Z tensileMPa21 ± 3 (Bambu Lab) and 46 ± 4.8 (Polymaker) printed Z, ISO 527[2][1]Not documented
Brittleness1–5Moderate[2][1]Brittle — snaps with little warning[3]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a flame-retardant filament[22]Rockwell M86 on printed PPSF (ASTM D785, Stratasys); M96 on extruded PPSU stock (and an unlabelled 123)[4][19]
Creep resistance / sustained load1–5Good. Moulded unfilled PC sustained 41 MPa tensile creep at room temperature without breaking, but the retardant package drops the glass transition to 115 °C in Polymaker's grade, so the unfilled rating is not carried over in full[23][1]Good. Printed PPSF holds 189 °C heat deflection at 1.8 MPa (ASTM D648) and extruded stock is rated 149 °C long-term service, but Ensinger does not claim the creep resistance it claims for PSU and PPS[4][19]
Elasticity / flexibility1–5Rigid[1]Rigid[3]
Z strength as % of XY%35 (Bambu Lab) to 69 (Polymaker), printed[2][1]Not documented
Thermal Properties
HDT at 0.45 MPa°C110 (Polymaker) and 113 (Bambu Lab), ISO 75 at 0.45 MPa[1][2]190 (printed XY, ISO 75 at 0.45 MPa, 3DXTech)[3]
HDT at 1.8 MPa°C107 (Polymaker) and 108 (Bambu Lab), ISO 75 at 1.8 MPa[1][2]189 (printed, ASTM D648 at 264 psi, Stratasys PPSF); 207 on extruded stock, converted from 405 °F[4][19]
Glass transition (Tg)°C115 (Polymaker) and 145 (Bambu Lab), DSC[1][2]230 (DSC) — the highest glass transition in the dataset[3]
Melting point / Vicat°CAmorphous — no melting point; Vicat 114 (Bambu Lab, ISO 306)[2]Not documented
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[24]149 long-term service on extruded PPSU stock, converted from 300 °F[19]
Thermal expansion (CTE)µm/m·K68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a flame-retardant grade[22]55.0 (printed PPSF, ASTM D696; source states 5.5e-5 mm/mm/°C) and 55.8 on extruded stock (ASTM D696, from 3.1e-5 in/in/°F)[4][19]
Flammability / UL 94UL 94 V-0 (Polymaker PolyMax PC-FR); 3DXTech rates its FR PC/ABS V-0 at 1.5 mm on the base resin[1][25]UL 94 V-0 at 1.5 mm, rated on the base resin[3]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors unless stabilised[15]Not documented
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[15]Withstands repeated steam autoclaving, the usual reason to choose PPSU over PSU; Stratasys also lists PPSF as passing 24 h stress-crack exposure to antifreeze, petrol, motor oil, power-steering, transmission and washer fluid at 23 °C and 100 °C[3][4]
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[15]Not documented
Biodegradability / compostabilityNot biodegradable[15]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[15]Not documented
Electrical & ESD propertiesNot documentedVolume resistivity 5e13 to 1.5e14 ohm-cm and dielectric strength 80-290 V/mil on printed PPSF (ASTM D257, D149)[4]
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[26]Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[26]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[26]Not documented
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[26][13]Ventilated room or enclosure recommended[26]
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[14]Not documented
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[14]Not documented
Vapour / chemical smoothingNo practical vapour smoothing[14]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[14]Not documented
Solvents & Solubility
Soluble inDichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[27]Dichloromethane dissolves it at 23 °C at every stress level; acetone solvates and softens unstressed PPSU (Solvay ESCR).[28]
Softened or crazed byMethanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[27]MEK ruptures stressed parts and toluene crazes them above 13.8 MPa; glass-filled grades survive where unfilled craze.[28]
Solvent welding & smoothing agentDichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[29]Dichloromethane cements PPSU and NMP softens residual resin; both are laboratory reagents, not workshop stock.[28]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. PolyMax PC-FR Technical Data Sheet V5.5 Polymaker · 2024-11 · tds
  2. Bambu Filament Technical Data Sheet V1.0 — PC FR Bambu Lab · 2026-08 · tds
  3. ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  4. PPSF (polyphenylsulfone) — FDM Data Sheet Stratasys · 2018-06 · tds
  5. Polymaker product catalogue Polymaker · 2026-08 · vendor
  6. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  7. Kimya PPSU-S Natural 1.75 mm 500 g igo3d · 2026-08 · vendor
  8. 3D4Makers product catalogue 3D4Makers · 2026-08 · vendor
  9. IEMAI 3D PPSU 3D Printing Filament — store page IEMAI 3D · 2026-08 · vendor
  10. Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
  11. Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
  12. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  13. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  14. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  15. PC — material basics Polymaker Wiki · 2026-08 · doc
  16. 3DXTech Firewire FR-PC/ABS product page 3DXTech · 2026-08 · vendor
  17. THERMAX PPSU — product page (print recommendations) 3DXTech · 2026-08 · doc
  18. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  19. TECASON P black (PPSU) — stock shape properties Ensinger · 2026-08 · tds
  20. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  21. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  22. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  23. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  24. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  25. Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
  26. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  27. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  28. Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
  29. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds