3D Printing Info

Filament comparison

PC-FR vs POM

Compare printing settings, strength, heat resistance, dated prices and sources.

Flame-retardant PC (PC-FR) guidePOM (acetal) guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-FR comparisonsMore POM comparisons
PC-FR vs POM — documented properties and sources
PropertyFlame-retardant PC (PC-FR)PCPOM (acetal)ENGINEERING
Market snapshot
Listing priceUSD/kg; dated snapshots$87.50/kg median; $54.99–$224.00/kg across 4 dated product listingsNot documented
Identity & Market
Base polymer / chemistryFlame-retardant polycarbonate. Polymaker builds its grade on Covestro's Makrolon family and rates it UL 94 V-0[1][2]Polyoxymethylene, normally the copolymer POM-C. Apium's filament grade is POM-C with antistatic additives; no unfilled POM filament was found on sale[3][4]
Densityg/cm³1.18 (Bambu Lab) and 1.2 (Polymaker), ISO 1183[2][1]1.41 (extruded POM-C stock)[3]
Typical priceUSD/kg1 kg-equivalent spools span 55–224; the two mainstream 1 kg grades are 55 and the industrial grades 120–224[2][5]Not documented
Price range across brandsUSD/kg55–224 across brands; Bambu Lab and Polymaker 55, 3DXTech FR PC/ABS 120, 3DXLABS FR-PC 224[2][5][6]Not documented
Market availability1–5Available from several mainstream brands[2][5][6]Special order, 1-2 makers worldwide — Apium sells a POM-C ESD filament through its own shop and states its printers are the only ones able to process POM-C; no POM filament appears in the 3DJAKE or igo3d product sitemaps, at MatterHackers or at Printed Solid[4][7][8][9]
Spool sizes & diameters1.75 mm; 0.75 and 1 kg spools[5][6][2]Not documented
Typical applicationsElectrical enclosures, transport interiors and battery housings that must meet a flammability rating[1][2]Gears, bushings, bearings, conveyor and food-machinery parts; Apium markets its POM-C ESD grade for semiconductor insulators, aerospace fasteners and sliding parts[3][4]
Diameter tolerance± mm±0.03 (Bambu Lab PC FR)[2]Not documented
Printing Parameters
Nozzle temperature°C260–280 (Bambu Lab); 250–270 (Polymaker)[2][1]Not documented
Bed temperature°C90–110 (Bambu Lab); 90–105 (Polymaker)[2][1]Not documented
Enclosure / chamber requirement1–5Enclosure required (passive) — Bambu Lab specifies a 45–60 °C chamber, Polymaker 70–100 °C[2][1]Not documented
Recommended chamber temperature°C45–60 (Bambu Lab); 70–100 (Polymaker)[2][1]Not documented
Part cooling fan0–60 % (Bambu Lab)[2]Not documented
Bed surface & adhesion aidSmooth or textured PEI plate (Bambu Lab)[2]Not documented
Maximum volumetric flow (mm³/s; see test conditions)mm³/s24 at Bambu Lab's 300 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[2][10]Not documented
Warping tendency1–5Severe — heated chamber needed[1][11]Not documented
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[12][13]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[13]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[2][11]Not documented
Extruder requirementNot documentedApium states that the adaptive heating system on its industrial machines is what makes POM-C printable, and that no other 3D printer can process it[4]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[11]Not documented
Abrasiveness1–5Non-abrasive[1]Not documented
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 6 h pre-dry at 80 °C[14]Not documented
Heat-creep / jam sensitivity1–5Slightly sensitive[12]Not documented
Hotend requirementAll-metal hot end required (Simplify3D)[12]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — 0.12 % saturated at 25 °C / 55 % RH (Bambu Lab), half that of unfilled Bambu Lab PC[2][15]Low (0.1-0.3 %) — extruded POM-C stock takes up 0.18 % in 24 h and 0.80 % at saturation (ASTM D570)[3]
Equilibrium moisture content at ~50 % RH%0.12 saturated at 25 °C / 55 % RH (Bambu Lab)[2]Not documented
Drying temperature & time75 °C for 6 h (Polymaker)[1]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[16]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[13][16]Not documented
Storage requirementAirtight containers with desiccant to prevent reabsorption[13]Not documented
Mechanical Properties
Tensile strength (XY)MPa60 ± 4 (Bambu Lab) and 67 ± 4.5 (Polymaker) printed XY, ISO 527[2][1]66.9 at break and 64.1 at yield (extruded POM-C stock, ASTM D638; converted from 9700 and 9300 psi)[3]
Young's modulusMPa1670 ± 40 (Bambu Lab) and 2634 ± 182 (Polymaker) printed XY, ISO 527[2][1]2275 (extruded POM-C stock, ASTM D638; converted from 330,000 psi)[3]
Elongation at break%2.4 ± 0.3 (Bambu Lab) and 3.49 ± 0.7 (Polymaker) at break, printed XY, ISO 527 — the retardant roughly halves unfilled PC's elongation[2][1][17]40 at break and 9 at yield (extruded POM-C stock, ASTM D638)[3]
Flexural strengthMPa96.6 ± 1.3 printed XY, ISO 178 (Polymaker)[1]89.6 (extruded POM-C stock, ASTM D790; converted from 13,000 psi)[3]
Flexural modulusMPa2518 ± 53 printed XY, ISO 178 (Polymaker)[1]2758 (extruded POM-C stock, ASTM D790; converted from 400,000 psi)[3]
Charpy impact, notchedkJ/m²11.7 ± 1.6 printed XY, ISO 179, notched (Polymaker)[1]Not documented
Other impact dataNotched Charpy 7.5 ± 1.6 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA)[1]Izod 53 J/m on extruded POM-C stock, converted from 1.0 ft-lb/in[3]
Layer adhesion / Z tensileMPa21 ± 3 (Bambu Lab) and 46 ± 4.8 (Polymaker) printed Z, ISO 527[2][1]Not documented
Brittleness1–5Moderate[2][1]Tough — absorbs impact, yields before breaking; extruded stock elongates 40 % before failing. No printed figure is published[3]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a flame-retardant filament[18]Rockwell 86 (and R120) — the source names only the R scale on extruded POM-C stock (ASTM D785)[3]
Creep resistance / sustained load1–5Good. Moulded unfilled PC sustained 41 MPa tensile creep at room temperature without breaking, but the retardant package drops the glass transition to 115 °C in Polymaker's grade, so the unfilled rating is not carried over in full[19][1]Not documented
Elasticity / flexibility1–5Rigid[1]Not documented
Z strength as % of XY%35 (Bambu Lab) to 69 (Polymaker), printed[2][1]Not documented
Wear resistance & frictionNot documentedWear factor 65e-10 in3*min/(ft*lb*h) and a dynamic coefficient of friction of 0.21 at 40 psi and 50 fpm (ASTM D3702, extruded stock) — the properties that make acetal the default gear and bushing plastic; Apium lists good sliding properties as the reason for its grade[3][4]
Thermal Properties
HDT at 0.45 MPa°C110 (Polymaker) and 113 (Bambu Lab), ISO 75 at 0.45 MPa[1][2]158 (extruded POM-C stock, ASTM D648 at 66 psi; converted from 316 °F)[3]
HDT at 1.8 MPa°C107 (Polymaker) and 108 (Bambu Lab), ISO 75 at 1.8 MPa[1][2]110 (extruded POM-C stock, ASTM D648 at 264 psi; converted from 230 °F)[3]
Glass transition (Tg)°C115 (Polymaker) and 145 (Bambu Lab), DSC[1][2]Not documented
Melting point / Vicat°CAmorphous — no melting point; Vicat 114 (Bambu Lab, ISO 306)[2]165 melting (extruded POM-C stock; converted from 329 °F)[3]
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[20]91 long term and 141 intermittent (extruded POM-C stock; converted from 195 °F and 285 °F)[3]
Thermal expansion (CTE)µm/m·K68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a flame-retardant grade[18]84.6 (extruded POM-C stock, ASTM D696; source states 4.7e-5 in/in/°F)[3]
Flammability / UL 94UL 94 V-0 (Polymaker PolyMax PC-FR); 3DXTech rates its FR PC/ABS V-0 at 1.5 mm on the base resin[1][21]UL 94 HB on extruded POM-C stock[3]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors unless stabilised[13]Not documented
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[13]Good chemical resistance, particularly to bases; Apium lists resistance to bases as a headline property[3][4]
Water / humidity resistance in service1–5Not documentedGood — minor absorption; 0.80 % water at saturation (ASTM D570, extruded stock)[3]
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[13]Not documented
Biodegradability / compostabilityNot biodegradable[13]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[13]Not documented
Electrical & ESD propertiesNot documentedVolume resistance 1e14 ohm-cm, dielectric strength 500 V/mil and dielectric constant 3.7 at 60 Hz on extruded stock (ASTM D257, D149, D150); Apium's filament grade adds antistatic agents[3][4]
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[22]Not documented
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[22]Not documented
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[22][11]Not documented
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[12]Easy to machine — Ensinger lists machinability as a headline property of POM-C stock[3]
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[12]Not documented
Vapour / chemical smoothingNo practical vapour smoothing[12]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[12]Not documented
Solvents & Solubility
Soluble inDichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[23]Hexafluoroisopropanol dissolves it at room temperature; NMP and DMF only when hot. Laboratory reagents.[24]
Softened or crazed byMethanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[23]Acids, oxidants, halogens and hot concentrated zinc chloride attack it; alcohols, ketones and esters do not.[24][25]
Solvent welding & smoothing agentDichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[26]None — no solvent softens POM below its melting point, which is why it is bolted or heat-welded rather than glued.[24]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. PolyMax PC-FR Technical Data Sheet V5.5 Polymaker · 2024-11 · tds
  2. Bambu Filament Technical Data Sheet V1.0 — PC FR Bambu Lab · 2026-08 · tds
  3. TECAFORM AH natural (POM-C) — stock shape properties Ensinger · 2026-08 · tds
  4. POM-C ESD 3D printing — material page Apium 3D Technologies · 2026-08 · doc
  5. Polymaker product catalogue Polymaker · 2026-08 · vendor
  6. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  7. 3DJAKE product catalogue 3DJAKE · 2026-08 · vendor
  8. igo3d product sitemap (17452 product URLs) igo3d · 2026-08 · vendor
  9. Printed Solid product catalogue Printed Solid · 2026-08 · vendor
  10. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  11. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  12. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  13. PC — material basics Polymaker Wiki · 2026-08 · doc
  14. 3DXTech Firewire FR-PC/ABS product page 3DXTech · 2026-08 · vendor
  15. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  16. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  17. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  18. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  19. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  20. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  21. Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
  22. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  23. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  24. Resistance of Ultramid, Ultraform and Ultradur to chemicals (TI-KTU/AS-28 e) BASF · 2000-10 · tds
  25. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  26. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds