Filament comparison
PC-FR vs PLA Silk
Compare printing settings, strength, heat resistance, dated prices and sources.
2 selected · all documented properties
| Property | Flame-retardant PC (PC-FR)PC | Silk PLAPLA |
|---|---|---|
| Market snapshot | ||
| Listing priceUSD/kg; dated snapshots | $87.50/kg median; $54.99–$224.00/kg across 4 dated product listings | $19.49/kg median; $9.75–$24.99/kg across 15 dated product listings |
| Identity & Market | ||
| Base polymer / chemistry | Flame-retardant polycarbonate. Polymaker builds its grade on Covestro's Makrolon family and rates it UL 94 V-0[1][2] | PLA with a gloss-forming additive package; suppliers publish the composition as polylactic acid only[3] |
| Densityg/cm³ | 1.18 (Bambu Lab) and 1.2 (Polymaker), ISO 1183[2][1] | 1.27 (ISO 1183)[3] |
| Typical priceUSD/kg | 1 kg-equivalent spools span 55–224; the two mainstream 1 kg grades are 55 and the industrial grades 120–224[2][4] | Mainstream 1 kg spools cluster near 20[5][6][7] |
| Price range across brandsUSD/kg | 55–224 across brands; Bambu Lab and Polymaker 55, 3DXTech FR PC/ABS 120, 3DXLABS FR-PC 224[2][4][8] | 10–25 across brands; CHCKX 10 in a 16-roll bundle, SUNLU 13, LANDU 18, YXPOLYER 20, Polymaker 22, Devil Design 25[9][10][11][12][13] |
| Market availability1–5 | Available from several mainstream brands[2][4][8] | Stocked by most mainstream brands[5][9][14] |
| Spool sizes & diameters | 1.75 mm; 0.75 and 1 kg spools[4][8][2] | 1.75 mm; 1 and 1.1 kg spools; dual- and tri-colour coextruded variants[15][16] |
| Typical applications | Electrical enclosures, transport interiors and battery housings that must meet a flammability rating[1][2] | Decorative prints where surface gloss matters more than strength[3] |
| Diameter tolerance± mm | ±0.03 (Bambu Lab PC FR)[2] | ±0.03 (Bambu Lab)[17] |
| Printing Parameters | ||
| Nozzle temperature°C | 260–280 (Bambu Lab); 250–270 (Polymaker)[2][1] | 210–240 — 20 °C above the plain PLA window[3] |
| Bed temperature°C | 90–110 (Bambu Lab); 90–105 (Polymaker)[2][1] | 35–45[3] |
| Enclosure / chamber requirement1–5 | Enclosure required (passive) — Bambu Lab specifies a 45–60 °C chamber, Polymaker 70–100 °C[2][1] | Open frame is fine[3][18] |
| Recommended chamber temperature°C | 45–60 (Bambu Lab); 70–100 (Polymaker)[2][1] | Not documented |
| Part cooling fan | 0–60 % (Bambu Lab)[2] | Fan on[3] |
| Bed surface & adhesion aid | Smooth or textured PEI plate (Bambu Lab)[2] | Cool Plate SuperTack, smooth PEI or textured PEI[3] |
| Maximum volumetric flow (mm³/s; see test conditions)mm³/s | 24 at Bambu Lab's 300 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[2][19] | Not documented |
| Warping tendency1–5 | Severe — heated chamber needed[1][20] | None[3] |
| Bed-adhesion difficulty1–5 | Needs a specific surface plus adhesive[21][22] | Sticks to anything[23] |
| Stringing / oozing tendency1–5 | Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[22] | Not documented |
| Overall printing difficulty1–5 | Advanced — enclosure, hardware upgrades, tuning[2][20] | Easy — minor profile tuning; hotter nozzle and slower cap of 250 mm/s[3] |
| Hardware Wear & Reliability | ||
| Nozzle hardness required1–4 | Brass fine indefinitely[20] | Brass fine indefinitely[18] |
| Abrasiveness1–5 | Non-abrasive[1] | Non-abrasive[24][18] |
| Nozzle clog risk1–5 | Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 6 h pre-dry at 80 °C[25] | Very low[18] |
| Heat-creep / jam sensitivity1–5 | Slightly sensitive[21] | Moderate — good heatbreak cooling needed; PLA softens below 60 °C[26] |
| Hotend requirement | All-metal hot end required (Simplify3D)[21] | No special hot-end required[23] |
| Moisture Behaviour | ||
| Moisture absorption (hygroscopicity)1–5 | Low (0.1–0.3 %) — 0.12 % saturated at 25 °C / 55 % RH (Bambu Lab), half that of unfilled Bambu Lab PC[2][27] | Moderate — 0.40 % saturated at 25 °C / 55 % RH[3] |
| Equilibrium moisture content at ~50 % RH% | 0.12 saturated at 25 °C / 55 % RH (Bambu Lab)[2] | 0.40 saturated at 25 °C / 55 % RH (Bambu Lab)[3] |
| Drying temperature & time | 75 °C for 6 h (Polymaker)[1] | 55 °C for 8 h in a forced-air dryer, or 65–75 °C for 12 h on an X1 heatbed[3][28] |
| Symptoms when wet | Bubbling and popping at the nozzle, stringing and a rough surface[29] | Bubbling and popping at the nozzle, stringing, rough surface and weak layers[29] |
| Effect of moisture on strength | No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[22][29] | Polymaker rates PLA low-sensitivity — the loss shows as poor layer adhesion and brittle layers rather than a published strength figure[29] |
| Storage requirement | Airtight containers with desiccant to prevent reabsorption[22] | Sealed with desiccant below 20 % RH; shelf life at ambient is long[30][23] |
| Mechanical Properties | ||
| Tensile strength (XY)MPa | 60 ± 4 (Bambu Lab) and 67 ± 4.5 (Polymaker) printed XY, ISO 527[2][1] | 33 (printed XY, ISO 527); eSun Silk broke 22 % below the 16-brand PLA mean on identical 4×4 mm bars[3][31] |
| Young's modulusMPa | 1670 ± 40 (Bambu Lab) and 2634 ± 182 (Polymaker) printed XY, ISO 527[2][1] | 2130 (printed XY, ISO 527)[3] |
| Elongation at break% | 2.4 ± 0.3 (Bambu Lab) and 3.49 ± 0.7 (Polymaker) at break, printed XY, ISO 527 — the retardant roughly halves unfilled PC's elongation[2][1][32] | 2.8 (printed XY, ISO 527) — a quarter of PLA Basic at 12.2[3][30] |
| Flexural strengthMPa | 96.6 ± 1.3 printed XY, ISO 178 (Polymaker)[1] | 75 (printed XY, ISO 178)[3] |
| Flexural modulusMPa | 2518 ± 53 printed XY, ISO 178 (Polymaker)[1] | 2460 (printed XY, ISO 178)[3] |
| Charpy impact, notchedkJ/m² | 11.7 ± 1.6 printed XY, ISO 179, notched (Polymaker)[1] | 10.3 (printed XY, ISO 179, notched); unnotched 18.5[3] |
| Other impact data | Notched Charpy 7.5 ± 1.6 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA)[1] | Not documented |
| Layer adhesion / Z tensileMPa | 21 ± 3 (Bambu Lab) and 46 ± 4.8 (Polymaker) printed Z, ISO 527[2][1] | 25 (printed Z, ISO 527), and flexural Z collapses to 30 against 75 in XY; eSun Silk broke at 12.3 kg where twelve of the 16 plain PLAs managed 44.6–61.5 kg[3][31][33] |
| Brittleness1–5 | Moderate[2][1] | Brittle — snaps with little warning[3] |
| Hardness (scale-specific)Shore A / Shore D / Rockwell | Rockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a flame-retardant filament[34] | Not documented |
| Creep resistance / sustained load1–5 | Good. Moulded unfilled PC sustained 41 MPa tensile creep at room temperature without breaking, but the retardant package drops the glass transition to 115 °C in Polymaker's grade, so the unfilled rating is not carried over in full[35][1] | Poor — no silk-specific creep data published; plain PLA sagged from 12 to 18.7–20.3 mm over 5 days at 1.25 kg[36][37] |
| Fatigue / repeated-flex resistance1–5 | Not documented | Poor — no grade-specific S-N curve; plain printed PLA ran 38 000–49 000 cycles at 30 % of tensile strength (R = 0.2)[38][26] |
| Elasticity / flexibility1–5 | Rigid[1] | Rigid[3] |
| Z strength as % of XY% | 35 (Bambu Lab) to 69 (Polymaker), printed[2][1] | 76 by tensile, 40 by flexural (printed, Bambu Lab)[3] |
| Thermal Properties | ||
| HDT at 0.45 MPa°C | 110 (Polymaker) and 113 (Bambu Lab), ISO 75 at 0.45 MPa[1][2] | 60 (ISO 75, 0.45 MPa)[3] |
| HDT at 1.8 MPa°C | 107 (Polymaker) and 108 (Bambu Lab), ISO 75 at 1.8 MPa[1][2] | 56 (ISO 75, 1.8 MPa)[3] |
| Glass transition (Tg)°C | 115 (Polymaker) and 145 (Bambu Lab), DSC[1][2] | 57 (DSC)[3] |
| Melting point / Vicat°C | Amorphous — no melting point; Vicat 114 (Bambu Lab, ISO 306)[2] | 158 peak melt (DSC); Vicat 66 °C[3] |
| Continuous service temperature°C | 113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[39] | 50 — a loaded bar begins to move at this temperature (My Tech Fun, eSun eSilk PLA)[33] |
| Annealing response | Not documented | 50–55 °C for 6–12 h[3] |
| Thermal expansion (CTE)µm/m·K | 68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a flame-retardant grade[34] | Not documented |
| Flammability / UL 94 | UL 94 V-0 (Polymaker PolyMax PC-FR); 3DXTech rates its FR PC/ABS V-0 at 1.5 mm on the base resin[1][40] | Flammable; no UL 94 rating published by the major brands[30][41] |
| Environment & Chemical | ||
| UV resistance1–5 | Degrades within weeks outdoors unless stabilised[22] | Degrades within weeks outdoors[26][42] |
| Chemical resistance | Withstands oils, solvents and fuels; Polymaker rates it good against weak acids[22] | Good against weak acids, oils and grease; poor against strong acids and alkalis; dissolved by chloroform, THF and hot benzene[41][26] |
| Water / humidity resistance in service1–5 | Not documented | Good — insoluble in water[30] |
| Food contact | Bisphenol-A polycarbonate is not offered as food-contact filament[22] | Base resin is food-contact grade, but printed layer grooves harbour bacteria; Prusa advises against food use[26] |
| Biodegradability / compostability | Not biodegradable[22] | Industrially compostable only — needs sustained 55 °C; not home compostable[43][26] |
| Recyclability | Mechanically recyclable but not accepted in household plastic collection[22] | Mechanically recyclable; not accepted in household plastic collection[43] |
| Health & Safety | ||
| Fume toxicity1–5 | Moderate — measurable VOCs and UFPs, ventilation advised[44] | Low hazard — minimal VOC and particle emission[44] |
| Ultrafine-particle emission rateparticles/min | ≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[44] | Not documented |
| Ventilation / filtration requirement1–5 | Ventilated room or enclosure recommended[44][20] | None needed in a normal room[44] |
| Post-Processing | ||
| Sanding & machining | Sands and machines well; the toughness means it cuts rather than chips[21] | Wet sanding — dry sanding heats the surface by friction and smears it[42][26] |
| Gluing & solvent welding | Cyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[21] | Cyanoacrylate for most joints; some grades partially dissolve and bond with acetone[26][45] |
| Vapour / chemical smoothing | No practical vapour smoothing[21] | No practical vapour smoothing — only chloroform, hot benzene or THF, which are laboratory-only[26] |
| Support material pairing | Prints its own supports; 3DXTech sells a dedicated PC break-away support[21] | Support for PLA (Bambu Lab)[3] |
| Dimensional accuracy & detail | Not documented | 55° overhangs and 30 mm bridges; gloss hides fine detail and is destroyed by sanding[3] |
| Solvents & Solubility | ||
| Soluble in | Dichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[46] | Chloroform: 10 % w/v in 2–4 h at 23 °C, every grade and morphology; THF and DMF only at 65 °C. Laboratory reagents.[47] |
| Softened or crazed by | Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[46] | Acetone, ethyl acetate and toluene plasticise it but dissolve <1 % even at 65 °C; submersion in acetone crazes and destroys parts.[47][48] |
| Solvent welding & smoothing agent | Dichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[49] | Chloroform vapour smooths and welds PLA at the cost of tensile strength; acetone does not smooth it at all.[50][48] |
Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- PolyMax PC-FR Technical Data Sheet V5.5 Polymaker · 2024-11 · tds
- Bambu Filament Technical Data Sheet V1.0 — PC FR Bambu Lab · 2026-08 · tds
- Bambu Filament Technical Data Sheet V1.0 — PLA Silk+ Bambu Lab · 2026-08 · tds
- Polymaker product catalogue Polymaker · 2026-08 · vendor
- Panchroma Silk PLA collection Polymaker Shop · 2026-08 · vendor
- Spectrum PLA Silk — product listing 3DJake International · 2026-08 · vendor
- 3DJake ecoPLA Silk Black 1.75mm 1000g 3DJake International · 2026-08 · vendor
- 3DXTech product catalogue 3DXTech · 2026-08 · vendor
- Sunlu Silk PLA+ 1.75mm 1kg Sunlu Official Store · 2026-08 · vendor
- Bambu Lab PLA Silk 1.75mm 1kg 3D Universe · 2026-08 · vendor
- CHCKX 16 Pack Silk Dual Color PLA Filament Bundle CHCKX (Amazon US) · 2026-08 · vendor
- YXPOLYER Silk PLA Black&Gold product page YXPOLYER · 2026-08 · vendor
- LANDU Silk Tri-Color PLA Filament 1.75 mm 1 kg LANDU (Amazon US) · 2026-08 · vendor
- Overture Silk PLA 1.75mm Overture3D · 2026-08 · vendor
- eSUN PLA-Silk Magic 1.75mm eSUN Official Store · 2026-08 · vendor
- JAYO Silk PLA+ 1.75mm 1.1kg JAYO Official Store · 2026-08 · vendor
- PLA Basic — product page Bambu Lab US Store · 2026-08 · vendor
- Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
- Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
- ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
- Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- PC — material basics Polymaker Wiki · 2026-08 · doc
- PLA — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- Prusament PLA — material page Prusa Polymers · 2026-08 · doc
- 3DXTech Firewire FR-PC/ABS product page 3DXTech · 2026-08 · vendor
- PLA — material guide Prusa Knowledge Base · 2026-08 · doc
- Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
- Filament Drying Recommendations Bambu Lab Wiki · 2026-08 · doc
- Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
- Bambu Filament Technical Data Sheet V3.0 — PLA Basic Bambu Lab · 2026-08 · tds
- 16 PLA brand comparison test — results spreadsheet My Tech Fun (Igor Gaspar) · 2022-10 · test
- PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
- Testing eSun PLA filaments: PLA-ST vs PLA+ vs Silk PLA My Tech Fun (Igor Gaspar) · 2026-08 · test
- TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
- Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
- BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
- PolyTerra PLA vs PLA+ — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
- Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
- Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
- Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
- PolyLite PLA Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
- Prusament PLA Technical Data Sheet v1.0 Prusa Polymers · 2018-09 · tds
- Filamentive PLA (recycled) — product page Filamentive · 2026-08 · vendor
- Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
- Prusament rPLA Corn Pigment 1kg — product page Prusa Research · 2026-08 · vendor
- Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
- Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
- Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
- Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds
- Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper