3D Printing Info

Filament comparison

PC-ESD vs PSU

Compare printing settings, strength, heat resistance, dated prices and sources.

ESD-safe PC guidePSU guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-ESD comparisonsMore PSU comparisons
PC-ESD vs PSU — documented properties and sources
PropertyESD-safe PCPCPSUHIGHTEMP
Market snapshot
Listing priceUSD/kg; dated snapshots$180.00/kg median; $180.00–$180.00/kg across 1 dated product listings$168.00/kg median; $168.00–$168.00/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryPolycarbonate compounded with a conductive filler for static-dissipative parts[1]Polysulfone — the lowest-temperature and cheapest of the sulfone family[2]
Densityg/cm³1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[1][3]1.24 (ISO 1183)[2]
Typical priceUSD/kg1 kg-equivalent spools cluster near 180[4]1 kg-equivalent spools cluster near 250[4]
Price range across brandsUSD/kg180 at 3DXTech's 750 g pricing — the most expensive material in this group[4]168-250 across formats; 250 g spool $42 (168/kg), 500 g $125 (250/kg) — 3DXTech is the only filament supplier found[4]
Market availability1–5Special order, 1–2 makers worldwide[4]Special order, 1–2 makers worldwide[4]
Spool sizes & diameters1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[4]1.75 mm; 250 g and 500 g spools[4]
Typical applicationsElectronics fixtures and trays that need PC heat resistance and static dissipation together[1]Transparent high-temperature housings, medical trays and hot-water fittings[2]
Printing Parameters
Bed temperature°CNot documented120–140 (3DXTech)[2]
Enclosure / chamber requirement1–5Enclosure required (passive)[5][6]Actively heated chamber required[7][8]
Bed surface & adhesion aidPEI with a glue stick or a commercial adhesive[9]Not documented
Warping tendency1–5Severe — heated chamber needed[5][6]Not documented
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[9][10]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[10]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[5]Expert / industrial hardware only[7][8]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required[1]Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[7]
Abrasiveness1–5Moderately abrasive — conductive carbon filler[1]Non-abrasive when unfilled[2]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[11]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[12]
Heat-creep / jam sensitivity1–5Slightly sensitive[9]Not documented
Hotend requirementAll-metal hot end required (Simplify3D)[9]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[13][14][11]Not documented
Equilibrium moisture content at ~50 % RH%Not documented0.30 in 24 h on extruded stock (ASTM D570)[15]
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[16]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[10][16]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[12]
Storage requirementAirtight containers with desiccant to prevent reabsorption[10]Not documented
Mechanical Properties
Tensile strength (XY)MPa68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[1][17][3]52 (printed XY, ISO 527, 3DXTech); 81 at break on extruded stock (ASTM D638)[2][15]
Young's modulusMPa2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[1][3]2100 (printed XY, ISO 527)[2]
Elongation at break%6 at break (printed XY, ISO 527), against 14 for the unfilled grade[1][17]8 (printed XY, ISO 527) against 50 on extruded stock — nearly three times PPSU's printed 3 %[2][18][15]
Flexural strengthMPa95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[1][3]87 (printed XY, ISO 178)[2]
Flexural modulusMPa2310 (printed XY, ISO 178)[1]2050 (printed XY, ISO 178)[2]
Other impact dataNot documentedIzod notched 69 J/m on extruded PSU stock, converted from 1.3 ft-lb/in (ASTM D256)[15]
Layer adhesion / Z tensileMPa32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[3]Not documented
Brittleness1–5Moderate[1]Moderate[2]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[19]Rockwell M120 on extruded PSU stock (ASTM D785)[15]
Creep resistance / sustained load1–5Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[20][3]Good. Ensinger lists high creep resistance as a headline property of extruded PSU stock, which is rated to 173 °C heat deflection at 1.8 MPa[15]
Elasticity / flexibility1–5Rigid[1]Rigid[2]
Z strength as % of XY%68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[3]Not documented
Thermal Properties
HDT at 0.45 MPa°C143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[3]172 (printed XY, ISO 75 at 0.45 MPa, 3DXTech); 181 on extruded stock, converted from 358 °F at 66 psi[2][15]
HDT at 1.8 MPa°C140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[3]174 on extruded PSU stock, converted from 345 °F at 264 psi (ASTM D648)[15]
Glass transition (Tg)°C143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[1][3]187 (DSC, 3DXTech) and 185 on extruded stock (ASTM D3418), against 230 for PPSU[2][18][15]
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[14]141 long-term service on extruded PSU stock, converted from 285 °F[15]
Thermal expansion (CTE)µm/m·K68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[19]55.8 (extruded PSU stock, ASTM D696; source states 3.1e-5 in/in/°F)[15]
Flammability / UL 94Not documentedUL 94 V-0 on extruded PSU stock[15]
Environment & Chemical
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[10]Not documented
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[10]Not documented
Biodegradability / compostabilityNot biodegradable[10]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[10]Not documented
Electrical & ESD propertiesSurface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[1][17]Surface resistance above 10¹³ ohm/sq — an insulator (IEC 60093)[2]
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[21]Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[21]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[21]Not documented
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[21][5]Ventilated room or enclosure recommended[21]
Dust & fibre handling hazardConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1]Not documented
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[9]Not documented
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[9]Not documented
Vapour / chemical smoothingNo practical vapour smoothing[9]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[9]Not documented
Solvents & Solubility
Soluble inDichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[22]Chlorinated hydrocarbons — dichloromethane, chloroform — dissolve polysulfone; ketones and esters attack it as well.[23][24]
Softened or crazed byMethanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[22]Acetone, MEK, ethyl acetate, benzene and toluene craze or stress-crack it; methanol and isopropanol only marginally.[24][23]
Solvent welding & smoothing agentDichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[25]Dichloromethane cement welds PSU and NMP softens residual resin. Both are laboratory reagents.[23]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
  2. ThermaX PSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  3. PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
  4. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  5. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  6. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  7. Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
  8. Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
  9. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  10. PC — material basics Polymaker Wiki · 2026-08 · doc
  11. 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
  12. THERMAX PSU — product page (print recommendations) 3DXTech · 2026-08 · doc
  13. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  14. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  15. TECASON S natural (PSU) — stock shape properties Ensinger · 2026-08 · tds
  16. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  17. ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
  18. ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  19. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  20. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  21. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  22. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  23. Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
  24. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  25. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds