3D Printing Info

Filament comparison

PC-ESD vs PPSU

Compare printing settings, strength, heat resistance, dated prices and sources.

ESD-safe PC guidePPSU guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-ESD comparisonsMore PPSU comparisons
PC-ESD vs PPSU — documented properties and sources
PropertyESD-safe PCPCPPSUHIGHTEMP
Market snapshot
Listing priceUSD/kg; dated snapshots$180.00/kg median; $180.00–$180.00/kg across 1 dated product listings$337.40/kg median; $223.00–$732.56/kg across 4 dated product listings
Identity & Market
Base polymer / chemistryPolycarbonate compounded with a conductive filler for static-dissipative parts[1]Polyphenylsulfone — an amorphous high-temperature sulfone polymer[2]
Densityg/cm³1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[1][3]1.28 (ISO 1183, 3DXTech; ASTM D792, Stratasys PPSF)[2][4]
Typical priceUSD/kg1 kg-equivalent spools cluster near 180[5]1 kg-equivalent spools span 223–733; the middle of the market is about 425[5][6][7][8]
Price range across brandsUSD/kg180 at 3DXTech's 750 g pricing — the most expensive material in this group[5]223-733 across brands; IEMAI 3D 223 at 1 kg, 3DXTech ThermaX PPSU 250 at 500 g, 3D4Makers 425 at 750 g, Kimya PPSU-S 733 at 500 g[5][6][7][8]
Market availability1–5Special order, 1–2 makers worldwide[5]Niche, a handful of specialist brands[5][6][7]
Spool sizes & diameters1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[5]1.75 and 2.85 mm; 200 g to 750 g spools[5][6][7]
Typical applicationsElectronics fixtures and trays that need PC heat resistance and static dissipation together[1]Steam-sterilisable medical and dental tooling, and aircraft interior parts[2]
Printing Parameters
Bed temperature°CNot documented130–150 (3DXTech)[2]
Enclosure / chamber requirement1–5Enclosure required (passive)[9][10]Actively heated chamber required[11][12]
Bed surface & adhesion aidPEI with a glue stick or a commercial adhesive[13]Not documented
Warping tendency1–5Severe — heated chamber needed[9][10]Severe — heated chamber needed[11]
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[13][14]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[14]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[9]Expert / industrial hardware only[11][12]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required[1]Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[11]
Abrasiveness1–5Moderately abrasive — conductive carbon filler[1]Non-abrasive when unfilled[2]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[15]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[16]
Heat-creep / jam sensitivity1–5Slightly sensitive[13]Not documented
Hotend requirementAll-metal hot end required (Simplify3D)[13]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[17][18][15]Not documented
Equilibrium moisture content at ~50 % RH%Not documented0.37 in 24 h and 1.1 at saturation on extruded stock (ASTM D570)[19]
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[20]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[14][20]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[16]
Storage requirementAirtight containers with desiccant to prevent reabsorption[14]Not documented
Mechanical Properties
Tensile strength (XY)MPa68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[1][21][3]55 (printed XY, ISO 527, 3DXTech) and 55 (printed on side long edge, ASTM D638, Stratasys PPSF); 79 at yield on extruded stock[2][4][19]
Young's modulusMPa2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[1][3]2100 (printed, ASTM D638, Stratasys PPSF) and 2310 (printed XY, ISO 527, 3DXTech); 2344 on extruded stock[2][4][19]
Elongation at break%6 at break (printed XY, ISO 527), against 14 for the unfilled grade[1][21]3 (printed, ISO 527 and ASTM D638) against 60 on extruded stock — printing costs PPSU almost all of its ductility[2][4][19]
Flexural strengthMPa95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[1][3]110 (printed, ISO 178 and ASTM D790, 3DXTech and Stratasys PPSF agree); 91 on extruded stock[2][4][19]
Flexural modulusMPa2310 (printed XY, ISO 178)[1]2200 (printed, ASTM D790, Stratasys PPSF) and 2215 (printed XY, ISO 178, 3DXTech)[2][4]
Other impact dataNot documentedIzod notched 58.7 J/m and unnotched 165.5 J/m (printed, ASTM D256 Method A, Stratasys PPSF); 160 J/m notched on extruded stock[4][19]
Layer adhesion / Z tensileMPa32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[3]Not documented
Brittleness1–5Moderate[1]Brittle — snaps with little warning[2]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[22]Rockwell M86 on printed PPSF (ASTM D785, Stratasys); M96 on extruded PPSU stock (and an unlabelled 123)[4][19]
Creep resistance / sustained load1–5Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[23][3]Good. Printed PPSF holds 189 °C heat deflection at 1.8 MPa (ASTM D648) and extruded stock is rated 149 °C long-term service, but Ensinger does not claim the creep resistance it claims for PSU and PPS[4][19]
Elasticity / flexibility1–5Rigid[1]Rigid[2]
Z strength as % of XY%68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[3]Not documented
Thermal Properties
HDT at 0.45 MPa°C143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[3]190 (printed XY, ISO 75 at 0.45 MPa, 3DXTech)[2]
HDT at 1.8 MPa°C140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[3]189 (printed, ASTM D648 at 264 psi, Stratasys PPSF); 207 on extruded stock, converted from 405 °F[4][19]
Glass transition (Tg)°C143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[1][3]230 (DSC) — the highest glass transition in the dataset[2]
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[18]149 long-term service on extruded PPSU stock, converted from 300 °F[19]
Thermal expansion (CTE)µm/m·K68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[22]55.0 (printed PPSF, ASTM D696; source states 5.5e-5 mm/mm/°C) and 55.8 on extruded stock (ASTM D696, from 3.1e-5 in/in/°F)[4][19]
Flammability / UL 94Not documentedUL 94 V-0 at 1.5 mm, rated on the base resin[2]
Environment & Chemical
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[14]Withstands repeated steam autoclaving, the usual reason to choose PPSU over PSU; Stratasys also lists PPSF as passing 24 h stress-crack exposure to antifreeze, petrol, motor oil, power-steering, transmission and washer fluid at 23 °C and 100 °C[2][4]
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[14]Not documented
Biodegradability / compostabilityNot biodegradable[14]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[14]Not documented
Electrical & ESD propertiesSurface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[1][21]Volume resistivity 5e13 to 1.5e14 ohm-cm and dielectric strength 80-290 V/mil on printed PPSF (ASTM D257, D149)[4]
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[24]Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[24]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[24]Not documented
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[24][9]Ventilated room or enclosure recommended[24]
Dust & fibre handling hazardConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1]Not documented
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[13]Not documented
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[13]Not documented
Vapour / chemical smoothingNo practical vapour smoothing[13]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[13]Not documented
Solvents & Solubility
Soluble inDichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[25]Dichloromethane dissolves it at 23 °C at every stress level; acetone solvates and softens unstressed PPSU (Solvay ESCR).[26]
Softened or crazed byMethanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[25]MEK ruptures stressed parts and toluene crazes them above 13.8 MPa; glass-filled grades survive where unfilled craze.[26]
Solvent welding & smoothing agentDichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[27]Dichloromethane cements PPSU and NMP softens residual resin; both are laboratory reagents, not workshop stock.[26]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
  2. ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  3. PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
  4. PPSF (polyphenylsulfone) — FDM Data Sheet Stratasys · 2018-06 · tds
  5. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  6. Kimya PPSU-S Natural 1.75 mm 500 g igo3d · 2026-08 · vendor
  7. 3D4Makers product catalogue 3D4Makers · 2026-08 · vendor
  8. IEMAI 3D PPSU 3D Printing Filament — store page IEMAI 3D · 2026-08 · vendor
  9. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  10. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  11. Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
  12. Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
  13. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  14. PC — material basics Polymaker Wiki · 2026-08 · doc
  15. 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
  16. THERMAX PPSU — product page (print recommendations) 3DXTech · 2026-08 · doc
  17. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  18. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  19. TECASON P black (PPSU) — stock shape properties Ensinger · 2026-08 · tds
  20. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  21. ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
  22. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  23. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  24. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  25. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  26. Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
  27. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds