Filament comparison
PC-ESD vs POM
Compare printing settings, strength, heat resistance, dated prices and sources.
2 selected · all documented properties
| Property | ESD-safe PCPC | POM (acetal)ENGINEERING |
|---|---|---|
| Market snapshot | ||
| Listing priceUSD/kg; dated snapshots | $180.00/kg median; $180.00–$180.00/kg across 1 dated product listings | Not documented |
| Identity & Market | ||
| Base polymer / chemistry | Polycarbonate compounded with a conductive filler for static-dissipative parts[1] | Polyoxymethylene, normally the copolymer POM-C. Apium's filament grade is POM-C with antistatic additives; no unfilled POM filament was found on sale[2][3] |
| Densityg/cm³ | 1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[1][4] | 1.41 (extruded POM-C stock)[2] |
| Typical priceUSD/kg | 1 kg-equivalent spools cluster near 180[5] | Not documented |
| Price range across brandsUSD/kg | 180 at 3DXTech's 750 g pricing — the most expensive material in this group[5] | Not documented |
| Market availability1–5 | Special order, 1–2 makers worldwide[5] | Special order, 1-2 makers worldwide — Apium sells a POM-C ESD filament through its own shop and states its printers are the only ones able to process POM-C; no POM filament appears in the 3DJAKE or igo3d product sitemaps, at MatterHackers or at Printed Solid[3][6][7][8] |
| Spool sizes & diameters | 1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[5] | Not documented |
| Typical applications | Electronics fixtures and trays that need PC heat resistance and static dissipation together[1] | Gears, bushings, bearings, conveyor and food-machinery parts; Apium markets its POM-C ESD grade for semiconductor insulators, aerospace fasteners and sliding parts[2][3] |
| Printing Parameters | ||
| Enclosure / chamber requirement1–5 | Enclosure required (passive)[9][10] | Not documented |
| Bed surface & adhesion aid | PEI with a glue stick or a commercial adhesive[11] | Not documented |
| Warping tendency1–5 | Severe — heated chamber needed[9][10] | Not documented |
| Bed-adhesion difficulty1–5 | Needs a specific surface plus adhesive[11][12] | Not documented |
| Stringing / oozing tendency1–5 | Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[12] | Not documented |
| Overall printing difficulty1–5 | Advanced — enclosure, hardware upgrades, tuning[9] | Not documented |
| Extruder requirement | Not documented | Apium states that the adaptive heating system on its industrial machines is what makes POM-C printable, and that no other 3D printer can process it[3] |
| Hardware Wear & Reliability | ||
| Nozzle hardness required1–4 | Hardened steel required[1] | Not documented |
| Abrasiveness1–5 | Moderately abrasive — conductive carbon filler[1] | Not documented |
| Nozzle clog risk1–5 | Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[13] | Not documented |
| Heat-creep / jam sensitivity1–5 | Slightly sensitive[11] | Not documented |
| Hotend requirement | All-metal hot end required (Simplify3D)[11] | Not documented |
| Moisture Behaviour | ||
| Moisture absorption (hygroscopicity)1–5 | Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[14][15][13] | Low (0.1-0.3 %) — extruded POM-C stock takes up 0.18 % in 24 h and 0.80 % at saturation (ASTM D570)[2] |
| Symptoms when wet | Bubbling and popping at the nozzle, stringing and a rough surface[16] | Not documented |
| Effect of moisture on strength | No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[12][16] | Not documented |
| Storage requirement | Airtight containers with desiccant to prevent reabsorption[12] | Not documented |
| Mechanical Properties | ||
| Tensile strength (XY)MPa | 68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[1][17][4] | 66.9 at break and 64.1 at yield (extruded POM-C stock, ASTM D638; converted from 9700 and 9300 psi)[2] |
| Young's modulusMPa | 2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[1][4] | 2275 (extruded POM-C stock, ASTM D638; converted from 330,000 psi)[2] |
| Elongation at break% | 6 at break (printed XY, ISO 527), against 14 for the unfilled grade[1][17] | 40 at break and 9 at yield (extruded POM-C stock, ASTM D638)[2] |
| Flexural strengthMPa | 95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[1][4] | 89.6 (extruded POM-C stock, ASTM D790; converted from 13,000 psi)[2] |
| Flexural modulusMPa | 2310 (printed XY, ISO 178)[1] | 2758 (extruded POM-C stock, ASTM D790; converted from 400,000 psi)[2] |
| Other impact data | Not documented | Izod 53 J/m on extruded POM-C stock, converted from 1.0 ft-lb/in[2] |
| Layer adhesion / Z tensileMPa | 32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[4] | Not documented |
| Brittleness1–5 | Moderate[1] | Tough — absorbs impact, yields before breaking; extruded stock elongates 40 % before failing. No printed figure is published[2] |
| Hardness (scale-specific)Shore A / Shore D / Rockwell | Rockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[18] | Rockwell 86 (and R120) — the source names only the R scale on extruded POM-C stock (ASTM D785)[2] |
| Creep resistance / sustained load1–5 | Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[19][4] | Not documented |
| Elasticity / flexibility1–5 | Rigid[1] | Not documented |
| Z strength as % of XY% | 68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[4] | Not documented |
| Wear resistance & friction | Not documented | Wear factor 65e-10 in3*min/(ft*lb*h) and a dynamic coefficient of friction of 0.21 at 40 psi and 50 fpm (ASTM D3702, extruded stock) — the properties that make acetal the default gear and bushing plastic; Apium lists good sliding properties as the reason for its grade[2][3] |
| Thermal Properties | ||
| HDT at 0.45 MPa°C | 143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[4] | 158 (extruded POM-C stock, ASTM D648 at 66 psi; converted from 316 °F)[2] |
| HDT at 1.8 MPa°C | 140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[4] | 110 (extruded POM-C stock, ASTM D648 at 264 psi; converted from 230 °F)[2] |
| Glass transition (Tg)°C | 143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[1][4] | Not documented |
| Melting point / Vicat°C | Not documented | 165 melting (extruded POM-C stock; converted from 329 °F)[2] |
| Continuous service temperature°C | 113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[15] | 91 long term and 141 intermittent (extruded POM-C stock; converted from 195 °F and 285 °F)[2] |
| Thermal expansion (CTE)µm/m·K | 68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[18] | 84.6 (extruded POM-C stock, ASTM D696; source states 4.7e-5 in/in/°F)[2] |
| Flammability / UL 94 | Not documented | UL 94 HB on extruded POM-C stock[2] |
| Environment & Chemical | ||
| Chemical resistance | Withstands oils, solvents and fuels; Polymaker rates it good against weak acids[12] | Good chemical resistance, particularly to bases; Apium lists resistance to bases as a headline property[2][3] |
| Water / humidity resistance in service1–5 | Not documented | Good — minor absorption; 0.80 % water at saturation (ASTM D570, extruded stock)[2] |
| Food contact | Bisphenol-A polycarbonate is not offered as food-contact filament[12] | Not documented |
| Biodegradability / compostability | Not biodegradable[12] | Not documented |
| Recyclability | Mechanically recyclable but not accepted in household plastic collection[12] | Not documented |
| Electrical & ESD properties | Surface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[1][17] | Volume resistance 1e14 ohm-cm, dielectric strength 500 V/mil and dielectric constant 3.7 at 60 Hz on extruded stock (ASTM D257, D149, D150); Apium's filament grade adds antistatic agents[2][3] |
| Health & Safety | ||
| Fume toxicity1–5 | Moderate — measurable VOCs and UFPs, ventilation advised[20] | Not documented |
| Ultrafine-particle emission rateparticles/min | ≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[20] | Not documented |
| Ventilation / filtration requirement1–5 | Ventilated room or enclosure recommended[20][9] | Not documented |
| Dust & fibre handling hazard | Conductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1] | Not documented |
| Post-Processing | ||
| Sanding & machining | Sands and machines well; the toughness means it cuts rather than chips[11] | Easy to machine — Ensinger lists machinability as a headline property of POM-C stock[2] |
| Gluing & solvent welding | Cyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[11] | Not documented |
| Vapour / chemical smoothing | No practical vapour smoothing[11] | Not documented |
| Support material pairing | Prints its own supports; 3DXTech sells a dedicated PC break-away support[11] | Not documented |
| Solvents & Solubility | ||
| Soluble in | Dichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[21] | Hexafluoroisopropanol dissolves it at room temperature; NMP and DMF only when hot. Laboratory reagents.[22] |
| Softened or crazed by | Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[21] | Acids, oxidants, halogens and hot concentrated zinc chloride attack it; alcohols, ketones and esters do not.[22][23] |
| Solvent welding & smoothing agent | Dichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[24] | None — no solvent softens POM below its melting point, which is why it is bolted or heat-welded rather than glued.[22] |
Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
- TECAFORM AH natural (POM-C) — stock shape properties Ensinger · 2026-08 · tds
- POM-C ESD 3D printing — material page Apium 3D Technologies · 2026-08 · doc
- PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
- 3DXTech product catalogue 3DXTech · 2026-08 · vendor
- 3DJAKE product catalogue 3DJAKE · 2026-08 · vendor
- igo3d product sitemap (17452 product URLs) igo3d · 2026-08 · vendor
- Printed Solid product catalogue Printed Solid · 2026-08 · vendor
- ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
- PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
- Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- PC — material basics Polymaker Wiki · 2026-08 · doc
- 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
- Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
- Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
- Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
- ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
- TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
- Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
- Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
- Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
- Resistance of Ultramid, Ultraform and Ultradur to chemicals (TI-KTU/AS-28 e) BASF · 2000-10 · tds
- Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
- Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds