3D Printing Info

Filament comparison

PC-ESD vs PLA Stone

Compare printing settings, strength, heat resistance, dated prices and sources.

ESD-safe PC guideStone-filled PLA guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-ESD comparisonsMore PLA Stone comparisons
PC-ESD vs PLA Stone — documented properties and sources
PropertyESD-safe PCPCStone-filled PLAPLA
Market snapshot
Listing priceUSD/kg; dated snapshots$180.00/kg median; $180.00–$180.00/kg across 1 dated product listings$22.99/kg median; $15.99–$49.16/kg across 6 dated product listings
Identity & Market
Base polymer / chemistryPolycarbonate compounded with a conductive filler for static-dissipative parts[1]PLA filled with stone or mineral powder — Formfutura StoneFil declares 40–50 wt% stone powder[2][3]
Densityg/cm³1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[1][4]1.22 (Bambu Lab PLA Marble) and 1.50–1.70 (Formfutura StoneFil), ISO 1183[3][2]
Typical priceUSD/kg1 kg-equivalent spools cluster near 180[5]1 kg spools cluster near 21[6][7]
Price range across brandsUSD/kg180 at 3DXTech's 750 g pricing — the most expensive material in this group[5]16–49 across brands; SUNLU 16, ELEGOO 19, Polymaker 21, Bambu Lab 25, Prusament 38, Filament PM MarbleJet 49 on 0.5 kg spools[8][7][6][9][10][11]
Market availability1–5Special order, 1–2 makers worldwide[5]Stocked by most mainstream brands[6][7][8]
Spool sizes & diameters1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[5]1.75 and 2.85 mm; 0.5 and 1 kg spools plus refills[7][2]
Typical applicationsElectronics fixtures and trays that need PC heat resistance and static dissipation together[1]Architectural models, sculpture and props with a matte mineral surface[3]
Printing Parameters
Nozzle temperature°CNot documented190–230 (Bambu Lab)[3]
Bed temperature°CNot documented35–45 (Bambu Lab)[3]
Enclosure / chamber requirement1–5Enclosure required (passive)[12][13]Open frame is fine[3]
Part cooling fanNot documentedFan on[3]
Bed surface & adhesion aidPEI with a glue stick or a commercial adhesive[14]Not documented
Warping tendency1–5Severe — heated chamber needed[12][13]Not documented
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[14][15]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[15]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[12]Easy — minor profile tuning; 0.2 mm nozzles are not usable[16]
Extruder requirementNot documentedNozzles below 0.4 mm are not compatible (Bambu Lab)[16]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required[1]Brass acceptable; hardened steel for volume work — Bambu Lab's compatibility table says no hardened nozzle is needed while the note under the same table groups PLA Marble with particle-filled materials that should always use one[16]
Abrasiveness1–5Moderately abrasive — conductive carbon filler[1]Moderately abrasive — stone fill[16][2]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[17]Moderate — needs dry filament and a clean nozzle[16]
Heat-creep / jam sensitivity1–5Slightly sensitive[14]Not documented
Hotend requirementAll-metal hot end required (Simplify3D)[14]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[18][19][17]Moderate — 0.44 % saturated at 25 °C / 55 % RH[3]
Equilibrium moisture content at ~50 % RH%Not documented0.44 saturated at 25 °C / 55 % RH (Bambu Lab)[3]
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[20]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[15][20]Polymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures for this grade; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[20]
Storage requirementAirtight containers with desiccant to prevent reabsorption[15]Not documented
Mechanical Properties
Tensile strength (XY)MPa68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[1][21][4]33 ± 4 printed XY, ISO 527 (Bambu Lab)[3]
Young's modulusMPa2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[1][4]2330 ± 240 printed XY, ISO 527 (Bambu Lab)[3]
Elongation at break%6 at break (printed XY, ISO 527), against 14 for the unfilled grade[1][21]6.7 ± 0.5 printed XY, ISO 527 (Bambu Lab)[3]
Flexural strengthMPa95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[1][4]75 ± 5 printed XY, ISO 178 (Bambu Lab)[3]
Flexural modulusMPa2310 (printed XY, ISO 178)[1]2920 ± 180 printed XY, ISO 178 (Bambu Lab)[3]
Charpy impact, notchedkJ/m²Not documented9.5 ± 2.6 printed XY, ISO 179, notched (Bambu Lab)[3]
Other impact dataNot documentedCharpy unnotched 24.0 printed XY (Bambu Lab, ISO 179)[3]
Layer adhesion / Z tensileMPa32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[4]30 ± 4 printed Z, ISO 527 (Bambu Lab)[3]
Brittleness1–5Moderate[1]Brittle — snaps with little warning[3]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[22]Not documented
Creep resistance / sustained load1–5Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[23][4]Poor — no stone-filled creep test; plain printed PLA sagged from 12 to 16.2–21.8 mm over 5 days at 1.25 kg[24][25][26]
Fatigue / repeated-flex resistance1–5Not documentedPoor — no grade-specific S-N curve; plain printed PLA ran 38 000–49 000 cycles at 30 % of tensile strength and the mineral filler leaves a brittle compound[27][3]
Elasticity / flexibility1–5Rigid[1]Rigid[3]
Z strength as % of XY%68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[4]91 by tensile, 73 by flexural (printed, Bambu Lab)[3]
Thermal Properties
HDT at 0.45 MPa°C143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[4]56 (ISO 75, 0.45 MPa)[3]
HDT at 1.8 MPa°C140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[4]53 (ISO 75, 1.8 MPa)[3]
Glass transition (Tg)°C143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[1][4]56 (DSC)[3]
Melting point / Vicat°CNot documented156 peak melt (DSC); Formfutura gives a 120–170 melting range for StoneFil[3][2]
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[19]Not documented
Thermal expansion (CTE)µm/m·K68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[22]Not documented
Environment & Chemical
UV resistance1–5Not documentedDegrades within weeks outdoors[28]
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[15]Not documented
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[15]Not documented
Biodegradability / compostabilityNot biodegradable[15]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[15]Not documented
Electrical & ESD propertiesSurface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[1][21]Not documented
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[29]Low hazard — minimal VOC and particle emission[29]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[29]Not documented
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[29][12]None needed in a normal room[29]
Dust & fibre handling hazardConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1]Formfutura's SDS sets an occupational limit of 1 mg/m³ for the stone powder and lists it as both a fibre and a particulate — do not dry-sand without extraction[2]
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[14]Sands to a stone-like matte surface[2]
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[14]Not documented
Vapour / chemical smoothingNo practical vapour smoothing[14]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[14]Support for PLA (Bambu Lab)[3]
Dimensional accuracy & detailNot documentedMatte mineral surface hides layer lines; 55° overhangs and 30 mm bridges as for plain PLA[3]
Solvents & Solubility
Soluble inDichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[30]Chloroform dissolves the PLA matrix (10 % w/v, 2–4 h at 23 °C) and leaves the filler as loose sludge; laboratory reagent.[31]
Softened or crazed byMethanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[30]Acetone, ethyl acetate and toluene plasticise the matrix but dissolve <1 % even at 65 °C; acetone submersion crazes parts.[31][32]
Solvent welding & smoothing agentDichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[33]Chloroform vapour attacks only the resin fraction, so the filler is left standing proud; no workshop-safe agent exists.[34][32]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
  2. StoneFil safety data sheet Formfutura · 2026-08 · msds
  3. Bambu Filament Technical Data Sheet — PLA Marble Bambu Lab · 2026-08 · tds
  4. PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
  5. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  6. PLA Marble — product page Bambu Lab US Store · 2026-08 · vendor
  7. Polymaker product catalogue Polymaker · 2026-08 · vendor
  8. ELEGOO product catalogue ELEGOO · 2026-08 · vendor
  9. Printed Solid product catalogue Printed Solid · 2026-08 · vendor
  10. SUNLU High Speed PLA Marble 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
  11. Filament PM PLA MarbleJet technical data sheet Filament PM (Plasty Mladec) · 2026-08 · tds
  12. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  13. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  14. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  15. PC — material basics Polymaker Wiki · 2026-08 · doc
  16. PLA Usage Guide Bambu Lab Wiki · 2026-08 · doc
  17. 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
  18. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  19. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  20. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  21. ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
  22. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  23. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  24. BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  25. Polymaker PLA Pro vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  26. Carbon Fiber PLA vs META-PLA vs PLA+ vs PLA by Sunlu — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  27. Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
  28. PLA — material guide Prusa Knowledge Base · 2026-08 · doc
  29. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  30. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  31. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  32. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  33. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds
  34. Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper