3D Printing Info

Filament comparison

PC-ESD vs PC-FR

Compare printing settings, strength, heat resistance, dated prices and sources.

ESD-safe PC guideFlame-retardant PC (PC-FR) guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-ESD comparisonsMore PC-FR comparisons
PC-ESD vs PC-FR — documented properties and sources
PropertyESD-safe PCPCFlame-retardant PC (PC-FR)PC
Market snapshot
Listing priceUSD/kg; dated snapshots$180.00/kg median; $180.00–$180.00/kg across 1 dated product listings$87.50/kg median; $54.99–$224.00/kg across 4 dated product listings
Identity & Market
Base polymer / chemistryPolycarbonate compounded with a conductive filler for static-dissipative parts[1]Flame-retardant polycarbonate. Polymaker builds its grade on Covestro's Makrolon family and rates it UL 94 V-0[2][3]
Densityg/cm³1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[1][4]1.18 (Bambu Lab) and 1.2 (Polymaker), ISO 1183[3][2]
Typical priceUSD/kg1 kg-equivalent spools cluster near 180[5]1 kg-equivalent spools span 55–224; the two mainstream 1 kg grades are 55 and the industrial grades 120–224[3][6]
Price range across brandsUSD/kg180 at 3DXTech's 750 g pricing — the most expensive material in this group[5]55–224 across brands; Bambu Lab and Polymaker 55, 3DXTech FR PC/ABS 120, 3DXLABS FR-PC 224[3][6][5]
Market availability1–5Special order, 1–2 makers worldwide[5]Available from several mainstream brands[3][6][5]
Spool sizes & diameters1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[5]1.75 mm; 0.75 and 1 kg spools[6][5][3]
Typical applicationsElectronics fixtures and trays that need PC heat resistance and static dissipation together[1]Electrical enclosures, transport interiors and battery housings that must meet a flammability rating[2][3]
Diameter tolerance± mmNot documented±0.03 (Bambu Lab PC FR)[3]
Printing Parameters
Nozzle temperature°CNot documented260–280 (Bambu Lab); 250–270 (Polymaker)[3][2]
Bed temperature°CNot documented90–110 (Bambu Lab); 90–105 (Polymaker)[3][2]
Enclosure / chamber requirement1–5Enclosure required (passive)[7][8]Enclosure required (passive) — Bambu Lab specifies a 45–60 °C chamber, Polymaker 70–100 °C[3][2]
Recommended chamber temperature°CNot documented45–60 (Bambu Lab); 70–100 (Polymaker)[3][2]
Part cooling fanNot documented0–60 % (Bambu Lab)[3]
Bed surface & adhesion aidPEI with a glue stick or a commercial adhesive[9]Smooth or textured PEI plate (Bambu Lab)[3]
Maximum volumetric flow (mm³/s; see test conditions)mm³/sNot documented24 at Bambu Lab's 300 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[3][10]
Warping tendency1–5Severe — heated chamber needed[7][8]Severe — heated chamber needed[2][7]
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[9][11]Needs a specific surface plus adhesive[9][11]
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[11]Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[11]
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[7]Advanced — enclosure, hardware upgrades, tuning[3][7]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required[1]Brass fine indefinitely[7]
Abrasiveness1–5Moderately abrasive — conductive carbon filler[1]Non-abrasive[2]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[12]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 6 h pre-dry at 80 °C[13]
Heat-creep / jam sensitivity1–5Slightly sensitive[9]Slightly sensitive[9]
Hotend requirementAll-metal hot end required (Simplify3D)[9]All-metal hot end required (Simplify3D)[9]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[14][15][12]Low (0.1–0.3 %) — 0.12 % saturated at 25 °C / 55 % RH (Bambu Lab), half that of unfilled Bambu Lab PC[3][14]
Equilibrium moisture content at ~50 % RH%Not documented0.12 saturated at 25 °C / 55 % RH (Bambu Lab)[3]
Drying temperature & timeNot documented75 °C for 6 h (Polymaker)[2]
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[16]Bubbling and popping at the nozzle, stringing and a rough surface[16]
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[11][16]No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[11][16]
Storage requirementAirtight containers with desiccant to prevent reabsorption[11]Airtight containers with desiccant to prevent reabsorption[11]
Mechanical Properties
Tensile strength (XY)MPa68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[1][17][4]60 ± 4 (Bambu Lab) and 67 ± 4.5 (Polymaker) printed XY, ISO 527[3][2]
Young's modulusMPa2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[1][4]1670 ± 40 (Bambu Lab) and 2634 ± 182 (Polymaker) printed XY, ISO 527[3][2]
Elongation at break%6 at break (printed XY, ISO 527), against 14 for the unfilled grade[1][17]2.4 ± 0.3 (Bambu Lab) and 3.49 ± 0.7 (Polymaker) at break, printed XY, ISO 527 — the retardant roughly halves unfilled PC's elongation[3][2][8]
Flexural strengthMPa95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[1][4]96.6 ± 1.3 printed XY, ISO 178 (Polymaker)[2]
Flexural modulusMPa2310 (printed XY, ISO 178)[1]2518 ± 53 printed XY, ISO 178 (Polymaker)[2]
Charpy impact, notchedkJ/m²Not documented11.7 ± 1.6 printed XY, ISO 179, notched (Polymaker)[2]
Other impact dataNot documentedNotched Charpy 7.5 ± 1.6 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA)[2]
Layer adhesion / Z tensileMPa32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[4]21 ± 3 (Bambu Lab) and 46 ± 4.8 (Polymaker) printed Z, ISO 527[3][2]
Brittleness1–5Moderate[1]Moderate[3][2]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[18]Rockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a flame-retardant filament[18]
Creep resistance / sustained load1–5Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[19][4]Good. Moulded unfilled PC sustained 41 MPa tensile creep at room temperature without breaking, but the retardant package drops the glass transition to 115 °C in Polymaker's grade, so the unfilled rating is not carried over in full[19][2]
Elasticity / flexibility1–5Rigid[1]Rigid[2]
Z strength as % of XY%68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[4]35 (Bambu Lab) to 69 (Polymaker), printed[3][2]
Thermal Properties
HDT at 0.45 MPa°C143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[4]110 (Polymaker) and 113 (Bambu Lab), ISO 75 at 0.45 MPa[2][3]
HDT at 1.8 MPa°C140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[4]107 (Polymaker) and 108 (Bambu Lab), ISO 75 at 1.8 MPa[2][3]
Glass transition (Tg)°C143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[1][4]115 (Polymaker) and 145 (Bambu Lab), DSC[2][3]
Melting point / Vicat°CNot documentedAmorphous — no melting point; Vicat 114 (Bambu Lab, ISO 306)[3]
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[15]113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[15]
Thermal expansion (CTE)µm/m·K68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[18]68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a flame-retardant grade[18]
Flammability / UL 94Not documentedUL 94 V-0 (Polymaker PolyMax PC-FR); 3DXTech rates its FR PC/ABS V-0 at 1.5 mm on the base resin[2][20]
Environment & Chemical
UV resistance1–5Not documentedDegrades within weeks outdoors unless stabilised[11]
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[11]Withstands oils, solvents and fuels; Polymaker rates it good against weak acids[11]
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[11]Bisphenol-A polycarbonate is not offered as food-contact filament[11]
Biodegradability / compostabilityNot biodegradable[11]Not biodegradable[11]
RecyclabilityMechanically recyclable but not accepted in household plastic collection[11]Mechanically recyclable but not accepted in household plastic collection[11]
Electrical & ESD propertiesSurface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[1][17]Not documented
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[21]Moderate — measurable VOCs and UFPs, ventilation advised[21]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[21]≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[21]
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[21][7]Ventilated room or enclosure recommended[21][7]
Dust & fibre handling hazardConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1]Not documented
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[9]Sands and machines well; the toughness means it cuts rather than chips[9]
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[9]Cyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[9]
Vapour / chemical smoothingNo practical vapour smoothing[9]No practical vapour smoothing[9]
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[9]Prints its own supports; 3DXTech sells a dedicated PC break-away support[9]
Solvents & Solubility
Soluble inDichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[22]Dichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[22]
Softened or crazed byMethanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[22]Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[22]
Solvent welding & smoothing agentDichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[23]Dichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[23]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
  2. PolyMax PC-FR Technical Data Sheet V5.5 Polymaker · 2024-11 · tds
  3. Bambu Filament Technical Data Sheet V1.0 — PC FR Bambu Lab · 2026-08 · tds
  4. PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
  5. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  6. Polymaker product catalogue Polymaker · 2026-08 · vendor
  7. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  8. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  9. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  10. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  11. PC — material basics Polymaker Wiki · 2026-08 · doc
  12. 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
  13. 3DXTech Firewire FR-PC/ABS product page 3DXTech · 2026-08 · vendor
  14. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  15. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  16. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  17. ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
  18. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  19. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  20. Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
  21. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  22. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  23. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds