3D Printing Info

Filament comparison

PC-ABS vs HT soluble

Compare printing settings, strength, heat resistance, dated prices and sources.

PC/ABS blend guideHigh-temperature support guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-ABS comparisonsMore HT soluble comparisons
PC-ABS vs HT soluble — documented properties and sources
PropertyPC/ABS blendPCHigh-temperature supportSUPPORT
Market snapshot
Listing priceUSD/kg; dated snapshots$45.99/kg median; $34.99–$84.00/kg across 5 dated product listings$209.00/kg median; $100.00–$290.00/kg across 4 dated product listings
Identity & Market
Base polymer / chemistryPolycarbonate/ABS alloy — PC stiffness and heat resistance with ABS processability[1][2]Break-away support compounded to survive high-temperature print chambers; 3DXTech sells separate grades for PC/ABS and for the PAEK and PEI class[3][4]
Densityg/cm³1.10 (Polymaker) and 1.24 (3DXTech FR grade), ISO 1183; Stratasys specific gravity 1.10 (ASTM D792)[1][2][5]1.37 (3DXTech THERMAX HTS1, ISO 1183)[3]
Typical priceUSD/kg1 kg spools cluster near 50[6][7]1 kg-equivalent spools cluster near 168[7]
Price range across brandsUSD/kg35–84 across brands; Reli3D 35, SUNLU 46, Polymaker 50, 3DXMAX 84[6][7][8][9]100–290 across grades; 3DXTech THERMAX MTS1 100 at 2 kg, HTS2 168 at 250 g, HTS1 250 at 500 g, IEMAI 3D HT-SP 290 at 1 kg[7][10]
Market availability1–5Available from several mainstream brands[6][7]Niche, a handful of specialist brands[7][10]
Spool sizes & diameters1.75 and 2.85 mm; 0.5 and 1 kg spools[6][7]1.75 mm; 250 g, 500 g, 1 kg and 2 kg spools[7]
Typical applicationsAutomotive interior and electronics housings that need PC heat resistance without PC's warping[1]Support for PEEK, PEI and PC-class prints, where PVA and PLA-based supports would decompose[3][4]
Printing Parameters
Nozzle temperature°C250–270 (Polymaker)[1]Not documented
Bed temperature°C90–105 (Polymaker)[1]Not documented
Enclosure / chamber requirement1–5Enclosure required (passive) — Polymaker specifies a 90–100 °C chamber[1]Actively heated chamber required — it is used inside high-temperature builds[3]
Recommended chamber temperature°C90–100 (Polymaker)[1]Not documented
Part cooling fanOff (Polymaker)[1]Not documented
Bed surface & adhesion aidPEI with a glue stick or a commercial adhesive[11]Not documented
Maximum volumetric flow (mm³/s; see test conditions)mm³/s20 at Polymaker's 250 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[1][12]Not documented
Warping tendency1–5High — enclosure needed for reliable large parts[1][13]Not documented
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[11][14]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[14]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[1][13]Expert / industrial hardware only[3]
Extruder requirementNot documentedA dual-extruder machine rated for high-temperature materials; 3DXTech states the grade is intended for dual-extruder printers designed to print high-temp materials[15]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[13]Brass fine indefinitely[3]
Abrasiveness1–5Non-abrasive[1]Non-abrasive[3]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry of 4 h or more[16]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry for HTS1 and 80 °C for MTS1[15][17]
Heat-creep / jam sensitivity1–5Slightly sensitive[11]Not documented
Hotend requirementAll-metal hot end required (Simplify3D)[11]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h or more pre-dry[18][19][16]Not documented
Drying temperature & time75 °C for 6 h (Polymaker)[1]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[20]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[14][20]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry for HTS1 and 80 °C for MTS1 because trapped water flashes to steam at these nozzle temperatures[15][17]
Storage requirementAirtight containers with desiccant to prevent reabsorption[14]Not documented
Mechanical Properties
Tensile strength (XY)MPa39.9 ± 1.0 printed XY, ISO 527 (Polymaker); 3DXTech quotes 60 at break for its FR PC/ABS[1][2]Not documented
Young's modulusMPa1835 ± 65 printed XY, ISO 527 (Polymaker); 3DXTech quotes 2250[1][2]Not documented
Elongation at break%4.2 ± 0.3 printed XY, ISO 527 (Polymaker); 3DXTech quotes 10 at break[1][2]Not documented
Flexural strengthMPa66.3 ± 0.9 printed XY, ISO 178 (Polymaker); 3DXTech quotes 85[1][2]Not documented
Flexural modulusMPa2081 ± 106 printed XY, ISO 178 (Polymaker); 3DXTech quotes 2300[1][2]Not documented
Charpy impact, notchedkJ/m²25.8 ± 1.3 printed XY, ISO 179, notched (Polymaker) — above both unfilled PC and ABS[1]Not documented
Other impact dataNotched Charpy still 13 ± 2 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA), against 1.5 in Z. Stratasys prints Izod notched at 241 J/m XZ against 34.0 J/m ZX, and unnotched 655 against 101 J/m (ASTM D256, F900 T16).[1][5]Not documented
Layer adhesion / Z tensileMPa25.9-30.2 at break printed ZX (Stratasys, ASTM D638 on the F900 and Fortus 450mc); 22.9 +/- 1.2 printed Z, ISO 527 (Polymaker)[1][5]Not documented
Brittleness1–5Tough — absorbs impact, yields before breaking[1]Not documented
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a PC/ABS filament[21]Not documented
Creep resistance / sustained load1–5Good. Room-temperature tensile creep of moulded PC/ABS was still running unbroken at 30 MPa when the experiment was stopped for time; specimens failed within the test window at 39-47 MPa (ASTM D638)[22]Not documented
Elasticity / flexibility1–5Rigid[1]Not documented
Z strength as % of XY%75-86 (Stratasys ZX against XZ tensile at break, ASTM D638) against 57 (Polymaker, printed Z against XY tensile)[1][5]Not documented
Wear resistance & frictionNot documented3DXTech marks tensile strength, modulus and elongation as not applicable for its support grades — they are not characterised as structural materials[3]
Thermal Properties
HDT at 0.45 MPa°C112 (ISO 75 at 0.45 MPa, Polymaker); Stratasys prints 117.9 in XY and 126.1 in XZ (ASTM D648 Method B at 66 psi), against 125.0 moulded[1][5]Not documented
HDT at 1.8 MPa°C106 (ISO 75 at 1.8 MPa, Polymaker); Stratasys prints 107.5 in XY and 112.0 in XZ (ASTM D648 Method B at 264 psi), against 102.9 moulded[1][5]205 (THERMAX HTS1, printed XY, ISO 75 at 1.8 MPa)[3]
Glass transition (Tg)°C109 (Polymaker) and 137 (3DXTech FR grade), DSC; Stratasys measures 105.3 (ASTM D7426 inflection point)[1][2][5]225 (3DXTech THERMAX HTS1, DSC) — high enough to stay solid inside a PEI or PEEK build[3]
Melting point / Vicat°CAmorphous — no melting point; Vicat 135 (Polymaker, ISO 306)[1]Not documented
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[19]Not documented
Annealing response90 °C for 2 h (Polymaker)[1]Not documented
Thermal expansion (CTE)µm/m·K59.9 over -50 to 35 °C and 73.0 over -50 to 95 °C (printed XY, ASTM E831)[5]Not documented
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors[14]Not documented
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[14]Not documented
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[14]Not documented
Biodegradability / compostabilityNot biodegradable[14]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[14]Not documented
Electrical & ESD propertiesNot documentedSurface resistance above 10^13 ohm/sq on all three THERMAX support grades (ASTM D257) — insulating[3][23][4]
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[24]Low hazard — minimal VOC and particle emission; none of these materials was in the chamber study[24]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[24]Not documented
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[24][13]Open a window / occasional ventilation[24]
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[11]Not documented
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[11]Not documented
Vapour / chemical smoothingAcetone attacks the ABS phase, so surface smoothing is partial rather than full[1]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[11]This is the support material. MTS1 is matched to PC/ABS and PC; HTS1 and HTS2 to the higher-temperature classes[4][3]
Solvents & Solubility
Soluble inDichloromethane and chloroform dissolve the PC phase; acetone, MEK and THF dissolve the ABS phase.[25][26]Aqueous alkali, not water: IEMAI specifies an alkaline bath in an ultrasonic cleaner until the support dissolves.[10]
Softened or crazed byPetrol, esters, ether and 1 % alkali stress-crack the PC phase; aromatics and esters soften the ABS phase.[25][26]Not documented
Solvent welding & smoothing agentAcetone attacks only the ABS phase, so smoothing is partial; a dichloromethane cement welds the whole section.[1][27]None — the alkaline bath dissolves the support rather than welding anything.[10]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Polymaker PC-ABS Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  2. Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
  3. THERMAX HTS1 Break Away Support Technical Data Sheet v1.0 3DXTech · 2026-08 · tds
  4. THERMAX MTS1 Break Away Support Technical Data Sheet v1.0 3DXTech · 2026-08 · tds
  5. PC-ABS — FDM Material Data Sheet Stratasys · 2023-08 · tds
  6. Polymaker product catalogue Polymaker · 2026-08 · vendor
  7. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  8. Reli3D PC-ABS Filament, Black, 1000 g spool Reli3D (Amazon US) · 2026-08 · vendor
  9. SUNLU PC-ABS 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
  10. IEMAI 3D HT-SP alkaline-soluble support filament — store page IEMAI 3D · 2026-08 · vendor
  11. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  12. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  13. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  14. PC — material basics Polymaker Wiki · 2026-08 · doc
  15. THERMAX HTS1 — product page 3DXTech · 2026-08 · vendor
  16. 3DXTech 3DXMAX ABS product page 3DXTech · 2026-08 · vendor
  17. THERMAX MTS1 — product page 3DXTech · 2026-08 · vendor
  18. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  19. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  20. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  21. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  22. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  23. THERMAX HTS2 Break Away Support Technical Data Sheet v1.0 3DXTech · 2026-08 · tds
  24. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  25. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  26. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  27. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds