3D Printing Info

Filament comparison

PC-ABS vs PSU

Compare printing settings, strength, heat resistance, dated prices and sources.

PC/ABS blend guidePSU guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-ABS comparisonsMore PSU comparisons
PC-ABS vs PSU — documented properties and sources
PropertyPC/ABS blendPCPSUHIGHTEMP
Market snapshot
Listing priceUSD/kg; dated snapshots$45.99/kg median; $34.99–$84.00/kg across 5 dated product listings$168.00/kg median; $168.00–$168.00/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryPolycarbonate/ABS alloy — PC stiffness and heat resistance with ABS processability[1][2]Polysulfone — the lowest-temperature and cheapest of the sulfone family[3]
Densityg/cm³1.10 (Polymaker) and 1.24 (3DXTech FR grade), ISO 1183; Stratasys specific gravity 1.10 (ASTM D792)[1][2][4]1.24 (ISO 1183)[3]
Typical priceUSD/kg1 kg spools cluster near 50[5][6]1 kg-equivalent spools cluster near 250[6]
Price range across brandsUSD/kg35–84 across brands; Reli3D 35, SUNLU 46, Polymaker 50, 3DXMAX 84[5][6][7][8]168-250 across formats; 250 g spool $42 (168/kg), 500 g $125 (250/kg) — 3DXTech is the only filament supplier found[6]
Market availability1–5Available from several mainstream brands[5][6]Special order, 1–2 makers worldwide[6]
Spool sizes & diameters1.75 and 2.85 mm; 0.5 and 1 kg spools[5][6]1.75 mm; 250 g and 500 g spools[6]
Typical applicationsAutomotive interior and electronics housings that need PC heat resistance without PC's warping[1]Transparent high-temperature housings, medical trays and hot-water fittings[3]
Printing Parameters
Nozzle temperature°C250–270 (Polymaker)[1]Not documented
Bed temperature°C90–105 (Polymaker)[1]120–140 (3DXTech)[3]
Enclosure / chamber requirement1–5Enclosure required (passive) — Polymaker specifies a 90–100 °C chamber[1]Actively heated chamber required[9][10]
Recommended chamber temperature°C90–100 (Polymaker)[1]Not documented
Part cooling fanOff (Polymaker)[1]Not documented
Bed surface & adhesion aidPEI with a glue stick or a commercial adhesive[11]Not documented
Maximum volumetric flow (mm³/s; see test conditions)mm³/s20 at Polymaker's 250 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[1][12]Not documented
Warping tendency1–5High — enclosure needed for reliable large parts[1][13]Not documented
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[11][14]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[14]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[1][13]Expert / industrial hardware only[9][10]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[13]Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[9]
Abrasiveness1–5Non-abrasive[1]Non-abrasive when unfilled[3]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry of 4 h or more[15]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[16]
Heat-creep / jam sensitivity1–5Slightly sensitive[11]Not documented
Hotend requirementAll-metal hot end required (Simplify3D)[11]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h or more pre-dry[17][18][15]Not documented
Equilibrium moisture content at ~50 % RH%Not documented0.30 in 24 h on extruded stock (ASTM D570)[19]
Drying temperature & time75 °C for 6 h (Polymaker)[1]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[20]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[14][20]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[16]
Storage requirementAirtight containers with desiccant to prevent reabsorption[14]Not documented
Mechanical Properties
Tensile strength (XY)MPa39.9 ± 1.0 printed XY, ISO 527 (Polymaker); 3DXTech quotes 60 at break for its FR PC/ABS[1][2]52 (printed XY, ISO 527, 3DXTech); 81 at break on extruded stock (ASTM D638)[3][19]
Young's modulusMPa1835 ± 65 printed XY, ISO 527 (Polymaker); 3DXTech quotes 2250[1][2]2100 (printed XY, ISO 527)[3]
Elongation at break%4.2 ± 0.3 printed XY, ISO 527 (Polymaker); 3DXTech quotes 10 at break[1][2]8 (printed XY, ISO 527) against 50 on extruded stock — nearly three times PPSU's printed 3 %[3][21][19]
Flexural strengthMPa66.3 ± 0.9 printed XY, ISO 178 (Polymaker); 3DXTech quotes 85[1][2]87 (printed XY, ISO 178)[3]
Flexural modulusMPa2081 ± 106 printed XY, ISO 178 (Polymaker); 3DXTech quotes 2300[1][2]2050 (printed XY, ISO 178)[3]
Charpy impact, notchedkJ/m²25.8 ± 1.3 printed XY, ISO 179, notched (Polymaker) — above both unfilled PC and ABS[1]Not documented
Other impact dataNotched Charpy still 13 ± 2 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA), against 1.5 in Z. Stratasys prints Izod notched at 241 J/m XZ against 34.0 J/m ZX, and unnotched 655 against 101 J/m (ASTM D256, F900 T16).[1][4]Izod notched 69 J/m on extruded PSU stock, converted from 1.3 ft-lb/in (ASTM D256)[19]
Layer adhesion / Z tensileMPa25.9-30.2 at break printed ZX (Stratasys, ASTM D638 on the F900 and Fortus 450mc); 22.9 +/- 1.2 printed Z, ISO 527 (Polymaker)[1][4]Not documented
Brittleness1–5Tough — absorbs impact, yields before breaking[1]Moderate[3]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a PC/ABS filament[22]Rockwell M120 on extruded PSU stock (ASTM D785)[19]
Creep resistance / sustained load1–5Good. Room-temperature tensile creep of moulded PC/ABS was still running unbroken at 30 MPa when the experiment was stopped for time; specimens failed within the test window at 39-47 MPa (ASTM D638)[23]Good. Ensinger lists high creep resistance as a headline property of extruded PSU stock, which is rated to 173 °C heat deflection at 1.8 MPa[19]
Elasticity / flexibility1–5Rigid[1]Rigid[3]
Z strength as % of XY%75-86 (Stratasys ZX against XZ tensile at break, ASTM D638) against 57 (Polymaker, printed Z against XY tensile)[1][4]Not documented
Thermal Properties
HDT at 0.45 MPa°C112 (ISO 75 at 0.45 MPa, Polymaker); Stratasys prints 117.9 in XY and 126.1 in XZ (ASTM D648 Method B at 66 psi), against 125.0 moulded[1][4]172 (printed XY, ISO 75 at 0.45 MPa, 3DXTech); 181 on extruded stock, converted from 358 °F at 66 psi[3][19]
HDT at 1.8 MPa°C106 (ISO 75 at 1.8 MPa, Polymaker); Stratasys prints 107.5 in XY and 112.0 in XZ (ASTM D648 Method B at 264 psi), against 102.9 moulded[1][4]174 on extruded PSU stock, converted from 345 °F at 264 psi (ASTM D648)[19]
Glass transition (Tg)°C109 (Polymaker) and 137 (3DXTech FR grade), DSC; Stratasys measures 105.3 (ASTM D7426 inflection point)[1][2][4]187 (DSC, 3DXTech) and 185 on extruded stock (ASTM D3418), against 230 for PPSU[3][21][19]
Melting point / Vicat°CAmorphous — no melting point; Vicat 135 (Polymaker, ISO 306)[1]Not documented
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[18]141 long-term service on extruded PSU stock, converted from 285 °F[19]
Annealing response90 °C for 2 h (Polymaker)[1]Not documented
Thermal expansion (CTE)µm/m·K59.9 over -50 to 35 °C and 73.0 over -50 to 95 °C (printed XY, ASTM E831)[4]55.8 (extruded PSU stock, ASTM D696; source states 3.1e-5 in/in/°F)[19]
Flammability / UL 94Not documentedUL 94 V-0 on extruded PSU stock[19]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors[14]Not documented
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[14]Not documented
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[14]Not documented
Biodegradability / compostabilityNot biodegradable[14]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[14]Not documented
Electrical & ESD propertiesNot documentedSurface resistance above 10¹³ ohm/sq — an insulator (IEC 60093)[3]
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[24]Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[24]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[24]Not documented
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[24][13]Ventilated room or enclosure recommended[24]
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[11]Not documented
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[11]Not documented
Vapour / chemical smoothingAcetone attacks the ABS phase, so surface smoothing is partial rather than full[1]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[11]Not documented
Solvents & Solubility
Soluble inDichloromethane and chloroform dissolve the PC phase; acetone, MEK and THF dissolve the ABS phase.[25][26]Chlorinated hydrocarbons — dichloromethane, chloroform — dissolve polysulfone; ketones and esters attack it as well.[27][26]
Softened or crazed byPetrol, esters, ether and 1 % alkali stress-crack the PC phase; aromatics and esters soften the ABS phase.[25][26]Acetone, MEK, ethyl acetate, benzene and toluene craze or stress-crack it; methanol and isopropanol only marginally.[26][27]
Solvent welding & smoothing agentAcetone attacks only the ABS phase, so smoothing is partial; a dichloromethane cement welds the whole section.[1][28]Dichloromethane cement welds PSU and NMP softens residual resin. Both are laboratory reagents.[27]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Polymaker PC-ABS Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  2. Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
  3. ThermaX PSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  4. PC-ABS — FDM Material Data Sheet Stratasys · 2023-08 · tds
  5. Polymaker product catalogue Polymaker · 2026-08 · vendor
  6. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  7. Reli3D PC-ABS Filament, Black, 1000 g spool Reli3D (Amazon US) · 2026-08 · vendor
  8. SUNLU PC-ABS 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
  9. Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
  10. Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
  11. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  12. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  13. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  14. PC — material basics Polymaker Wiki · 2026-08 · doc
  15. 3DXTech 3DXMAX ABS product page 3DXTech · 2026-08 · vendor
  16. THERMAX PSU — product page (print recommendations) 3DXTech · 2026-08 · doc
  17. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  18. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  19. TECASON S natural (PSU) — stock shape properties Ensinger · 2026-08 · tds
  20. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  21. ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  22. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  23. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  24. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  25. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  26. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  27. Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
  28. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds