Filament comparison
PC-ABS vs PC-FR
Compare printing settings, strength, heat resistance, dated prices and sources.
2 selected · all documented properties
| Property | PC/ABS blendPC | Flame-retardant PC (PC-FR)PC |
|---|---|---|
| Market snapshot | ||
| Listing priceUSD/kg; dated snapshots | $45.99/kg median; $34.99–$84.00/kg across 5 dated product listings | $87.50/kg median; $54.99–$224.00/kg across 4 dated product listings |
| Identity & Market | ||
| Base polymer / chemistry | Polycarbonate/ABS alloy — PC stiffness and heat resistance with ABS processability[1][2] | Flame-retardant polycarbonate. Polymaker builds its grade on Covestro's Makrolon family and rates it UL 94 V-0[3][4] |
| Densityg/cm³ | 1.10 (Polymaker) and 1.24 (3DXTech FR grade), ISO 1183; Stratasys specific gravity 1.10 (ASTM D792)[1][2][5] | 1.18 (Bambu Lab) and 1.2 (Polymaker), ISO 1183[4][3] |
| Typical priceUSD/kg | 1 kg spools cluster near 50[6][7] | 1 kg-equivalent spools span 55–224; the two mainstream 1 kg grades are 55 and the industrial grades 120–224[4][6] |
| Price range across brandsUSD/kg | 35–84 across brands; Reli3D 35, SUNLU 46, Polymaker 50, 3DXMAX 84[6][7][8][9] | 55–224 across brands; Bambu Lab and Polymaker 55, 3DXTech FR PC/ABS 120, 3DXLABS FR-PC 224[4][6][7] |
| Market availability1–5 | Available from several mainstream brands[6][7] | Available from several mainstream brands[4][6][7] |
| Spool sizes & diameters | 1.75 and 2.85 mm; 0.5 and 1 kg spools[6][7] | 1.75 mm; 0.75 and 1 kg spools[6][7][4] |
| Typical applications | Automotive interior and electronics housings that need PC heat resistance without PC's warping[1] | Electrical enclosures, transport interiors and battery housings that must meet a flammability rating[3][4] |
| Diameter tolerance± mm | Not documented | ±0.03 (Bambu Lab PC FR)[4] |
| Printing Parameters | ||
| Nozzle temperature°C | 250–270 (Polymaker)[1] | 260–280 (Bambu Lab); 250–270 (Polymaker)[4][3] |
| Bed temperature°C | 90–105 (Polymaker)[1] | 90–110 (Bambu Lab); 90–105 (Polymaker)[4][3] |
| Enclosure / chamber requirement1–5 | Enclosure required (passive) — Polymaker specifies a 90–100 °C chamber[1] | Enclosure required (passive) — Bambu Lab specifies a 45–60 °C chamber, Polymaker 70–100 °C[4][3] |
| Recommended chamber temperature°C | 90–100 (Polymaker)[1] | 45–60 (Bambu Lab); 70–100 (Polymaker)[4][3] |
| Part cooling fan | Off (Polymaker)[1] | 0–60 % (Bambu Lab)[4] |
| Bed surface & adhesion aid | PEI with a glue stick or a commercial adhesive[10] | Smooth or textured PEI plate (Bambu Lab)[4] |
| Maximum volumetric flow (mm³/s; see test conditions)mm³/s | 20 at Polymaker's 250 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[1][11] | 24 at Bambu Lab's 300 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[4][11] |
| Warping tendency1–5 | High — enclosure needed for reliable large parts[1][12] | Severe — heated chamber needed[3][12] |
| Bed-adhesion difficulty1–5 | Needs a specific surface plus adhesive[10][13] | Needs a specific surface plus adhesive[10][13] |
| Stringing / oozing tendency1–5 | Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[13] | Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[13] |
| Overall printing difficulty1–5 | Advanced — enclosure, hardware upgrades, tuning[1][12] | Advanced — enclosure, hardware upgrades, tuning[4][12] |
| Hardware Wear & Reliability | ||
| Nozzle hardness required1–4 | Brass fine indefinitely[12] | Brass fine indefinitely[12] |
| Abrasiveness1–5 | Non-abrasive[1] | Non-abrasive[3] |
| Nozzle clog risk1–5 | Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry of 4 h or more[14] | Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 6 h pre-dry at 80 °C[15] |
| Heat-creep / jam sensitivity1–5 | Slightly sensitive[10] | Slightly sensitive[10] |
| Hotend requirement | All-metal hot end required (Simplify3D)[10] | All-metal hot end required (Simplify3D)[10] |
| Moisture Behaviour | ||
| Moisture absorption (hygroscopicity)1–5 | Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h or more pre-dry[16][17][14] | Low (0.1–0.3 %) — 0.12 % saturated at 25 °C / 55 % RH (Bambu Lab), half that of unfilled Bambu Lab PC[4][16] |
| Equilibrium moisture content at ~50 % RH% | Not documented | 0.12 saturated at 25 °C / 55 % RH (Bambu Lab)[4] |
| Drying temperature & time | 75 °C for 6 h (Polymaker)[1] | 75 °C for 6 h (Polymaker)[3] |
| Symptoms when wet | Bubbling and popping at the nozzle, stringing and a rough surface[18] | Bubbling and popping at the nozzle, stringing and a rough surface[18] |
| Effect of moisture on strength | No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[13][18] | No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[13][18] |
| Storage requirement | Airtight containers with desiccant to prevent reabsorption[13] | Airtight containers with desiccant to prevent reabsorption[13] |
| Mechanical Properties | ||
| Tensile strength (XY)MPa | 39.9 ± 1.0 printed XY, ISO 527 (Polymaker); 3DXTech quotes 60 at break for its FR PC/ABS[1][2] | 60 ± 4 (Bambu Lab) and 67 ± 4.5 (Polymaker) printed XY, ISO 527[4][3] |
| Young's modulusMPa | 1835 ± 65 printed XY, ISO 527 (Polymaker); 3DXTech quotes 2250[1][2] | 1670 ± 40 (Bambu Lab) and 2634 ± 182 (Polymaker) printed XY, ISO 527[4][3] |
| Elongation at break% | 4.2 ± 0.3 printed XY, ISO 527 (Polymaker); 3DXTech quotes 10 at break[1][2] | 2.4 ± 0.3 (Bambu Lab) and 3.49 ± 0.7 (Polymaker) at break, printed XY, ISO 527 — the retardant roughly halves unfilled PC's elongation[4][3][19] |
| Flexural strengthMPa | 66.3 ± 0.9 printed XY, ISO 178 (Polymaker); 3DXTech quotes 85[1][2] | 96.6 ± 1.3 printed XY, ISO 178 (Polymaker)[3] |
| Flexural modulusMPa | 2081 ± 106 printed XY, ISO 178 (Polymaker); 3DXTech quotes 2300[1][2] | 2518 ± 53 printed XY, ISO 178 (Polymaker)[3] |
| Charpy impact, notchedkJ/m² | 25.8 ± 1.3 printed XY, ISO 179, notched (Polymaker) — above both unfilled PC and ABS[1] | 11.7 ± 1.6 printed XY, ISO 179, notched (Polymaker)[3] |
| Other impact data | Notched Charpy still 13 ± 2 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA), against 1.5 in Z. Stratasys prints Izod notched at 241 J/m XZ against 34.0 J/m ZX, and unnotched 655 against 101 J/m (ASTM D256, F900 T16).[1][5] | Notched Charpy 7.5 ± 1.6 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA)[3] |
| Layer adhesion / Z tensileMPa | 25.9-30.2 at break printed ZX (Stratasys, ASTM D638 on the F900 and Fortus 450mc); 22.9 +/- 1.2 printed Z, ISO 527 (Polymaker)[1][5] | 21 ± 3 (Bambu Lab) and 46 ± 4.8 (Polymaker) printed Z, ISO 527[4][3] |
| Brittleness1–5 | Tough — absorbs impact, yields before breaking[1] | Moderate[4][3] |
| Hardness (scale-specific)Shore A / Shore D / Rockwell | Rockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a PC/ABS filament[20] | Rockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a flame-retardant filament[20] |
| Creep resistance / sustained load1–5 | Good. Room-temperature tensile creep of moulded PC/ABS was still running unbroken at 30 MPa when the experiment was stopped for time; specimens failed within the test window at 39-47 MPa (ASTM D638)[21] | Good. Moulded unfilled PC sustained 41 MPa tensile creep at room temperature without breaking, but the retardant package drops the glass transition to 115 °C in Polymaker's grade, so the unfilled rating is not carried over in full[21][3] |
| Elasticity / flexibility1–5 | Rigid[1] | Rigid[3] |
| Z strength as % of XY% | 75-86 (Stratasys ZX against XZ tensile at break, ASTM D638) against 57 (Polymaker, printed Z against XY tensile)[1][5] | 35 (Bambu Lab) to 69 (Polymaker), printed[4][3] |
| Thermal Properties | ||
| HDT at 0.45 MPa°C | 112 (ISO 75 at 0.45 MPa, Polymaker); Stratasys prints 117.9 in XY and 126.1 in XZ (ASTM D648 Method B at 66 psi), against 125.0 moulded[1][5] | 110 (Polymaker) and 113 (Bambu Lab), ISO 75 at 0.45 MPa[3][4] |
| HDT at 1.8 MPa°C | 106 (ISO 75 at 1.8 MPa, Polymaker); Stratasys prints 107.5 in XY and 112.0 in XZ (ASTM D648 Method B at 264 psi), against 102.9 moulded[1][5] | 107 (Polymaker) and 108 (Bambu Lab), ISO 75 at 1.8 MPa[3][4] |
| Glass transition (Tg)°C | 109 (Polymaker) and 137 (3DXTech FR grade), DSC; Stratasys measures 105.3 (ASTM D7426 inflection point)[1][2][5] | 115 (Polymaker) and 145 (Bambu Lab), DSC[3][4] |
| Melting point / Vicat°C | Amorphous — no melting point; Vicat 135 (Polymaker, ISO 306)[1] | Amorphous — no melting point; Vicat 114 (Bambu Lab, ISO 306)[4] |
| Continuous service temperature°C | 113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[17] | 113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[17] |
| Annealing response | 90 °C for 2 h (Polymaker)[1] | Not documented |
| Thermal expansion (CTE)µm/m·K | 59.9 over -50 to 35 °C and 73.0 over -50 to 95 °C (printed XY, ASTM E831)[5] | 68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a flame-retardant grade[20] |
| Flammability / UL 94 | Not documented | UL 94 V-0 (Polymaker PolyMax PC-FR); 3DXTech rates its FR PC/ABS V-0 at 1.5 mm on the base resin[3][2] |
| Environment & Chemical | ||
| UV resistance1–5 | Degrades within weeks outdoors[13] | Degrades within weeks outdoors unless stabilised[13] |
| Chemical resistance | Withstands oils, solvents and fuels; Polymaker rates it good against weak acids[13] | Withstands oils, solvents and fuels; Polymaker rates it good against weak acids[13] |
| Food contact | Bisphenol-A polycarbonate is not offered as food-contact filament[13] | Bisphenol-A polycarbonate is not offered as food-contact filament[13] |
| Biodegradability / compostability | Not biodegradable[13] | Not biodegradable[13] |
| Recyclability | Mechanically recyclable but not accepted in household plastic collection[13] | Mechanically recyclable but not accepted in household plastic collection[13] |
| Health & Safety | ||
| Fume toxicity1–5 | Moderate — measurable VOCs and UFPs, ventilation advised[22] | Moderate — measurable VOCs and UFPs, ventilation advised[22] |
| Ultrafine-particle emission rateparticles/min | ≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[22] | ≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[22] |
| Ventilation / filtration requirement1–5 | Ventilated room or enclosure recommended[22][12] | Ventilated room or enclosure recommended[22][12] |
| Post-Processing | ||
| Sanding & machining | Sands and machines well; the toughness means it cuts rather than chips[10] | Sands and machines well; the toughness means it cuts rather than chips[10] |
| Gluing & solvent welding | Cyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[10] | Cyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[10] |
| Vapour / chemical smoothing | Acetone attacks the ABS phase, so surface smoothing is partial rather than full[1] | No practical vapour smoothing[10] |
| Support material pairing | Prints its own supports; 3DXTech sells a dedicated PC break-away support[10] | Prints its own supports; 3DXTech sells a dedicated PC break-away support[10] |
| Solvents & Solubility | ||
| Soluble in | Dichloromethane and chloroform dissolve the PC phase; acetone, MEK and THF dissolve the ABS phase.[23][24] | Dichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[23] |
| Softened or crazed by | Petrol, esters, ether and 1 % alkali stress-crack the PC phase; aromatics and esters soften the ABS phase.[23][24] | Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[23] |
| Solvent welding & smoothing agent | Acetone attacks only the ABS phase, so smoothing is partial; a dichloromethane cement welds the whole section.[1][25] | Dichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[25] |
Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- Polymaker PC-ABS Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
- Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
- PolyMax PC-FR Technical Data Sheet V5.5 Polymaker · 2024-11 · tds
- Bambu Filament Technical Data Sheet V1.0 — PC FR Bambu Lab · 2026-08 · tds
- PC-ABS — FDM Material Data Sheet Stratasys · 2023-08 · tds
- Polymaker product catalogue Polymaker · 2026-08 · vendor
- 3DXTech product catalogue 3DXTech · 2026-08 · vendor
- Reli3D PC-ABS Filament, Black, 1000 g spool Reli3D (Amazon US) · 2026-08 · vendor
- SUNLU PC-ABS 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
- Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
- ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
- PC — material basics Polymaker Wiki · 2026-08 · doc
- 3DXTech 3DXMAX ABS product page 3DXTech · 2026-08 · vendor
- 3DXTech Firewire FR-PC/ABS product page 3DXTech · 2026-08 · vendor
- Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
- Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
- Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
- PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
- TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
- Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
- Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
- Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
- Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
- Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds