3D Printing Info

Filament comparison

PC-ABS vs PC-ESD

Compare printing settings, strength, heat resistance, dated prices and sources.

PC/ABS blend guideESD-safe PC guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-ABS comparisonsMore PC-ESD comparisons
PC-ABS vs PC-ESD — documented properties and sources
PropertyPC/ABS blendPCESD-safe PCPC
Market snapshot
Listing priceUSD/kg; dated snapshots$45.99/kg median; $34.99–$84.00/kg across 5 dated product listings$180.00/kg median; $180.00–$180.00/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryPolycarbonate/ABS alloy — PC stiffness and heat resistance with ABS processability[1][2]Polycarbonate compounded with a conductive filler for static-dissipative parts[3]
Densityg/cm³1.10 (Polymaker) and 1.24 (3DXTech FR grade), ISO 1183; Stratasys specific gravity 1.10 (ASTM D792)[1][2][4]1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[3][5]
Typical priceUSD/kg1 kg spools cluster near 50[6][7]1 kg-equivalent spools cluster near 180[7]
Price range across brandsUSD/kg35–84 across brands; Reli3D 35, SUNLU 46, Polymaker 50, 3DXMAX 84[6][7][8][9]180 at 3DXTech's 750 g pricing — the most expensive material in this group[7]
Market availability1–5Available from several mainstream brands[6][7]Special order, 1–2 makers worldwide[7]
Spool sizes & diameters1.75 and 2.85 mm; 0.5 and 1 kg spools[6][7]1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[7]
Typical applicationsAutomotive interior and electronics housings that need PC heat resistance without PC's warping[1]Electronics fixtures and trays that need PC heat resistance and static dissipation together[3]
Printing Parameters
Nozzle temperature°C250–270 (Polymaker)[1]Not documented
Bed temperature°C90–105 (Polymaker)[1]Not documented
Enclosure / chamber requirement1–5Enclosure required (passive) — Polymaker specifies a 90–100 °C chamber[1]Enclosure required (passive)[10][11]
Recommended chamber temperature°C90–100 (Polymaker)[1]Not documented
Part cooling fanOff (Polymaker)[1]Not documented
Bed surface & adhesion aidPEI with a glue stick or a commercial adhesive[12]PEI with a glue stick or a commercial adhesive[12]
Maximum volumetric flow (mm³/s; see test conditions)mm³/s20 at Polymaker's 250 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[1][13]Not documented
Warping tendency1–5High — enclosure needed for reliable large parts[1][10]Severe — heated chamber needed[10][11]
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[12][14]Needs a specific surface plus adhesive[12][14]
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[14]Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[14]
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[1][10]Advanced — enclosure, hardware upgrades, tuning[10]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[10]Hardened steel required[3]
Abrasiveness1–5Non-abrasive[1]Moderately abrasive — conductive carbon filler[3]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry of 4 h or more[15]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[16]
Heat-creep / jam sensitivity1–5Slightly sensitive[12]Slightly sensitive[12]
Hotend requirementAll-metal hot end required (Simplify3D)[12]All-metal hot end required (Simplify3D)[12]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h or more pre-dry[17][18][15]Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[17][18][16]
Drying temperature & time75 °C for 6 h (Polymaker)[1]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[19]Bubbling and popping at the nozzle, stringing and a rough surface[19]
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[14][19]No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[14][19]
Storage requirementAirtight containers with desiccant to prevent reabsorption[14]Airtight containers with desiccant to prevent reabsorption[14]
Mechanical Properties
Tensile strength (XY)MPa39.9 ± 1.0 printed XY, ISO 527 (Polymaker); 3DXTech quotes 60 at break for its FR PC/ABS[1][2]68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[3][20][5]
Young's modulusMPa1835 ± 65 printed XY, ISO 527 (Polymaker); 3DXTech quotes 2250[1][2]2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[3][5]
Elongation at break%4.2 ± 0.3 printed XY, ISO 527 (Polymaker); 3DXTech quotes 10 at break[1][2]6 at break (printed XY, ISO 527), against 14 for the unfilled grade[3][20]
Flexural strengthMPa66.3 ± 0.9 printed XY, ISO 178 (Polymaker); 3DXTech quotes 85[1][2]95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[3][5]
Flexural modulusMPa2081 ± 106 printed XY, ISO 178 (Polymaker); 3DXTech quotes 2300[1][2]2310 (printed XY, ISO 178)[3]
Charpy impact, notchedkJ/m²25.8 ± 1.3 printed XY, ISO 179, notched (Polymaker) — above both unfilled PC and ABS[1]Not documented
Other impact dataNotched Charpy still 13 ± 2 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA), against 1.5 in Z. Stratasys prints Izod notched at 241 J/m XZ against 34.0 J/m ZX, and unnotched 655 against 101 J/m (ASTM D256, F900 T16).[1][4]Not documented
Layer adhesion / Z tensileMPa25.9-30.2 at break printed ZX (Stratasys, ASTM D638 on the F900 and Fortus 450mc); 22.9 +/- 1.2 printed Z, ISO 527 (Polymaker)[1][4]32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[5]
Brittleness1–5Tough — absorbs impact, yields before breaking[1]Moderate[3]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a PC/ABS filament[21]Rockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[21]
Creep resistance / sustained load1–5Good. Room-temperature tensile creep of moulded PC/ABS was still running unbroken at 30 MPa when the experiment was stopped for time; specimens failed within the test window at 39-47 MPa (ASTM D638)[22]Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[22][5]
Elasticity / flexibility1–5Rigid[1]Rigid[3]
Z strength as % of XY%75-86 (Stratasys ZX against XZ tensile at break, ASTM D638) against 57 (Polymaker, printed Z against XY tensile)[1][4]68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[5]
Thermal Properties
HDT at 0.45 MPa°C112 (ISO 75 at 0.45 MPa, Polymaker); Stratasys prints 117.9 in XY and 126.1 in XZ (ASTM D648 Method B at 66 psi), against 125.0 moulded[1][4]143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[5]
HDT at 1.8 MPa°C106 (ISO 75 at 1.8 MPa, Polymaker); Stratasys prints 107.5 in XY and 112.0 in XZ (ASTM D648 Method B at 264 psi), against 102.9 moulded[1][4]140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[5]
Glass transition (Tg)°C109 (Polymaker) and 137 (3DXTech FR grade), DSC; Stratasys measures 105.3 (ASTM D7426 inflection point)[1][2][4]143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[3][5]
Melting point / Vicat°CAmorphous — no melting point; Vicat 135 (Polymaker, ISO 306)[1]Not documented
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[18]113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[18]
Annealing response90 °C for 2 h (Polymaker)[1]Not documented
Thermal expansion (CTE)µm/m·K59.9 over -50 to 35 °C and 73.0 over -50 to 95 °C (printed XY, ASTM E831)[4]68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[21]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors[14]Not documented
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[14]Withstands oils, solvents and fuels; Polymaker rates it good against weak acids[14]
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[14]Bisphenol-A polycarbonate is not offered as food-contact filament[14]
Biodegradability / compostabilityNot biodegradable[14]Not biodegradable[14]
RecyclabilityMechanically recyclable but not accepted in household plastic collection[14]Mechanically recyclable but not accepted in household plastic collection[14]
Electrical & ESD propertiesNot documentedSurface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[3][20]
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[23]Moderate — measurable VOCs and UFPs, ventilation advised[23]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[23]≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[23]
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[23][10]Ventilated room or enclosure recommended[23][10]
Dust & fibre handling hazardNot documentedConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[3]
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[12]Sands and machines well; the toughness means it cuts rather than chips[12]
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[12]Cyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[12]
Vapour / chemical smoothingAcetone attacks the ABS phase, so surface smoothing is partial rather than full[1]No practical vapour smoothing[12]
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[12]Prints its own supports; 3DXTech sells a dedicated PC break-away support[12]
Solvents & Solubility
Soluble inDichloromethane and chloroform dissolve the PC phase; acetone, MEK and THF dissolve the ABS phase.[24][25]Dichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[24]
Softened or crazed byPetrol, esters, ether and 1 % alkali stress-crack the PC phase; aromatics and esters soften the ABS phase.[24][25]Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[24]
Solvent welding & smoothing agentAcetone attacks only the ABS phase, so smoothing is partial; a dichloromethane cement welds the whole section.[1][26]Dichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[26]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Polymaker PC-ABS Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  2. Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
  3. 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
  4. PC-ABS — FDM Material Data Sheet Stratasys · 2023-08 · tds
  5. PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
  6. Polymaker product catalogue Polymaker · 2026-08 · vendor
  7. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  8. Reli3D PC-ABS Filament, Black, 1000 g spool Reli3D (Amazon US) · 2026-08 · vendor
  9. SUNLU PC-ABS 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
  10. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  11. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  12. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  13. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  14. PC — material basics Polymaker Wiki · 2026-08 · doc
  15. 3DXTech 3DXMAX ABS product page 3DXTech · 2026-08 · vendor
  16. 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
  17. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  18. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  19. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  20. ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
  21. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  22. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  23. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  24. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  25. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  26. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds