3D Printing Info

Filament comparison

PAHT-CF vs PLA Stone

Compare printing settings, strength, heat resistance, dated prices and sources.

High-temperature CF nylon (PAHT-CF) guideStone-filled PLA guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PAHT-CF comparisonsMore PLA Stone comparisons
PAHT-CF vs PLA Stone — documented properties and sources
PropertyHigh-temperature CF nylon (PAHT-CF)PAStone-filled PLAPLA
Market snapshot
Listing priceUSD/kg; dated snapshots$59.98/kg median; $49.99–$69.98/kg across 2 dated product listings$22.99/kg median; $15.99–$49.16/kg across 6 dated product listings
Identity & Market
Base polymer / chemistryHigh-temperature carbon-fibre nylon. Bambu Lab's PAHT-CF and Polymaker's PA612-CF15 both use a long-chain polyamide matrix for lower moisture uptake than PA6[1][2]PLA filled with stone or mineral powder — Formfutura StoneFil declares 40–50 wt% stone powder[3][4]
Densityg/cm³1.03 (Polymaker PA612-CF15) and 1.06 (Bambu Lab), ISO 1183[1][2]1.22 (Bambu Lab PLA Marble) and 1.50–1.70 (Formfutura StoneFil), ISO 1183[4][3]
Typical priceUSD/kg1 kg-equivalent spools cluster near 60[1][5]1 kg spools cluster near 21[6][5]
Price range across brandsUSD/kg50–70 across brands; Bambu Lab 50, Polymaker Fiberon PA612-CF15 70[1][5]16–49 across brands; SUNLU 16, ELEGOO 19, Polymaker 21, Bambu Lab 25, Prusament 38, Filament PM MarbleJet 49 on 0.5 kg spools[7][5][6][8][9][10]
Market availability1–5Available from several mainstream brands[1][5]Stocked by most mainstream brands[6][5][7]
Spool sizes & diameters1.75 mm; 0.5 and 1 kg spools[5][1]1.75 and 2.85 mm; 0.5 and 1 kg spools plus refills[5][3]
Typical applicationsUnder-bonnet and near-motor parts needing 170 °C-plus heat deflection with less humidity drift than PA6[1][2]Architectural models, sculpture and props with a matte mineral surface[4]
Printing Parameters
Nozzle temperature°C260–290 (Bambu Lab)[1]190–230 (Bambu Lab)[4]
Bed temperature°CNot documented35–45 (Bambu Lab)[4]
Enclosure / chamber requirement1–5Enclosure required (passive) — Bambu Lab specifies a 45–60 °C chamber[1]Open frame is fine[4]
Recommended chamber temperature°C45–60 (Bambu Lab)[1]Not documented
Part cooling fanNot documentedFan on[4]
Bed surface & adhesion aidPEI sheet with a glue stick, or a dedicated adhesive such as Magigoo[11][12]Not documented
Maximum volumetric flow (mm³/s; see test conditions)mm³/s8 at Bambu Lab's 100 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[1][13]Not documented
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[11]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed[12]Not documented
Overall printing difficulty1–5Expert / industrial hardware only[1][14]Easy — minor profile tuning; 0.2 mm nozzles are not usable[15]
Extruder requirement0.6 mm nozzle recommended by Bambu Lab; 0.4 and 0.8 also supported[1]Nozzles below 0.4 mm are not compatible (Bambu Lab)[15]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required — Polymaker measures brass nozzle life at about 9 h on PA612-CF15 and recommends hardened steel or ruby[2]Brass acceptable; hardened steel for volume work — Bambu Lab's compatibility table says no hardened nozzle is needed while the note under the same table groups PLA Marble with particle-filled materials that should always use one[15]
Abrasiveness1–5Highly abrasive — standard CF composite; Polymaker puts brass nozzle life at roughly 9 h on PA612-CF15[2]Moderately abrasive — stone fill[15][3]
Nozzle clog risk1–5High — jams from moisture, heat creep or particles[14]Moderate — needs dry filament and a clean nozzle[15]
Heat-creep / jam sensitivity1–5Moderate — good heatbreak cooling needed[11]Not documented
Hotend requirementMay require an all-metal hot end (Simplify3D)[11]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5High (0.8–2 %) — 0.88 % saturated at 25 °C / 55 % RH for Bambu Lab PAHT-CF, a third of its PA6-CF; Polymaker's PA612-CF15 reaches 2.2 % equilibrium[1][2][16]Moderate — 0.44 % saturated at 25 °C / 55 % RH[4]
Equilibrium moisture content at ~50 % RH%0.88 saturated at 25 °C / 55 % RH (Bambu Lab PAHT-CF); 2.2 equilibrium (Polymaker PA612-CF15)[1][2]0.44 saturated at 25 °C / 55 % RH (Bambu Lab)[4]
Drying temperature & time80 °C for 8–12 h (Bambu Lab)[1]Not documented
Effect of moisture on strengthPolymaker publishes dry and wet printed blocks for PA612-CF15 itself: at 2.57 % moisture tensile falls only 91.9 → 83.1 MPa and modulus 5137 → 3991 MPa — the PA612 backbone absorbs far less than PA6[2][17]Polymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures for this grade; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[14]
Storage requirementSealed below 20 % RH with desiccant[14]Not documented
Hydrolysis at melt temperaturePolymaker specifies an 80–100 °C dry and storage below 20 % RH; no molecular-weight loss figure is published, and the wet data it does publish is conditioning rather than melt hydrolysis[18][19]Not documented
Mechanical Properties
Tensile strength (XY)MPa92 ± 7 (Bambu Lab) and 91.9 ± 2.0 (Polymaker PA612-CF15, dry/annealed) printed XY, ISO 527; the Polymaker grade only falls to 83.1 ± 2.2 conditioned to 2.57 % moisture[1][2]33 ± 4 printed XY, ISO 527 (Bambu Lab)[4]
Young's modulusMPa3860 ± 230 (Bambu Lab) and 5137 ± 192 (Polymaker PA612-CF15, dry) printed XY, ISO 527; Polymaker 3991 ± 137 conditioned[1][2]2330 ± 240 printed XY, ISO 527 (Bambu Lab)[4]
Elongation at break%2.6 ± 0.2 dry (Polymaker PA612-CF15) to 8.4 ± 1.8 (Bambu Lab) printed XY, ISO 527; Polymaker 4.1 ± 0.3 conditioned[1][2]6.7 ± 0.5 printed XY, ISO 527 (Bambu Lab)[4]
Flexural strengthMPaNot documented75 ± 5 printed XY, ISO 178 (Bambu Lab)[4]
Flexural modulusMPa4230 ± 210 printed XY, ISO 178 (Bambu Lab)[1]2920 ± 180 printed XY, ISO 178 (Bambu Lab)[4]
Charpy impact, notchedkJ/m²8.1 ± 0.8 printed XY dry and 7.7 ± 0.5 conditioned, ISO 179 notched (Polymaker PA612-CF15)[2]9.5 ± 2.6 printed XY, ISO 179, notched (Bambu Lab)[4]
Other impact dataCharpy unnotched 57.5 ± 3.4 and notched 22.8 ± 1.8 printed XY (Bambu Lab, ISO 179)[1]Charpy unnotched 24.0 printed XY (Bambu Lab, ISO 179)[4]
Layer adhesion / Z tensileMPa47 ± 5 (Bambu Lab) and 48.3 ± 3.9 (Polymaker PA612-CF15, dry) printed Z, ISO 527; Polymaker 35.6 ± 3.0 conditioned[1][2]30 ± 4 printed Z, ISO 527 (Bambu Lab)[4]
Brittleness1–5Moderate[1]Brittle — snaps with little warning[4]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell M88 / R117 on extruded PA66-GF30 stock (ASTM D785); no figure is published for a carbon-fibre long-chain nylon filament[20]Not documented
Creep resistance / sustained load1–5Good. Ensinger rates its PA66-CF30 compound for sustained static and dynamic load with 110 °C continuous service; the long-chain PA612 matrix takes up 0.88 % at saturation, a third of the same maker's PA6-CF, so it holds dimension better[21][2]Poor — no stone-filled creep test; plain printed PLA sagged from 12 to 16.2–21.8 mm over 5 days at 1.25 kg[22][23][24]
Fatigue / repeated-flex resistance1–5Good. Ensinger states carbon-filled PA66 compounds have improved fatigue strength in tension, flexure and compression[21]Poor — no grade-specific S-N curve; plain printed PLA ran 38 000–49 000 cycles at 30 % of tensile strength and the mineral filler leaves a brittle compound[25][4]
Elasticity / flexibility1–5Rigid[1]Rigid[4]
Z strength as % of XY%51 (Bambu Lab) to 53 (Polymaker PA612-CF15), printed[1][2]91 by tensile, 73 by flexural (printed, Bambu Lab)[4]
Thermal Properties
HDT at 0.45 MPa°C175 (Polymaker PA612-CF15) and 194 (Bambu Lab), ISO 75 at 0.45 MPa[1][2]56 (ISO 75, 0.45 MPa)[4]
HDT at 1.8 MPa°C114 (Polymaker PA612-CF15) and 170 (Bambu Lab), ISO 75 at 1.8 MPa[1][2]53 (ISO 75, 1.8 MPa)[4]
Glass transition (Tg)°C70 (Bambu Lab, DSC)[1]56 (DSC)[4]
Melting point / Vicat°C210 (Polymaker PA612-CF15) and 225 (Bambu Lab) melting, DSC; Vicat 206 (Polymaker)[1][2]156 peak melt (DSC); Formfutura gives a 120–170 melting range for StoneFil[4][3]
Flammability / UL 94Flammable; no UL 94 rating published for the grades surveyed[18]Not documented
Environment & Chemical
UV resistance1–5Months outdoors before embrittlement — unstabilised polyamide yellows under UV[12]Degrades within weeks outdoors[26]
Chemical resistanceWithstands oils, fuels and alkalis[12]Not documented
Water / humidity resistance in service1–5Absorbs water, properties shift — less than PA6 but more than PA12[17][1]Not documented
Food contactNot food-contact certified as filament[12]Not documented
Biodegradability / compostabilityNot biodegradable[12]Not documented
RecyclabilityNot accepted in household plastic collection[12]Not documented
Electrical & ESD propertiesSurface resistivity above 10¹² ohm — insulating (Polymaker PA612-CF15, ANSI/ESD S11.11)[2]Not documented
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[27]Low hazard — minimal VOC and particle emission[27]
VOC emission rateµg/minUp to 180 caprolactam, the dominant VOC from nylon and the largest single-VOC rate in the study[27]Not documented
Ultrafine-particle emission rateparticles/min≈2 × 10⁸ median for nylon — low for particles despite the highest VOC mass measured[27]Not documented
Hazardous species emittedCaprolactam, at up to 180 µg/min from nylon filament[27]Not documented
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[27]None needed in a normal room[27]
Dust & fibre handling hazardFibre is bound in the matrix; sanding dust should not be inhaled[18]Formfutura's SDS sets an occupational limit of 1 mg/m³ for the stone powder and lists it as both a fibre and a particulate — do not dry-sand without extraction[3]
Post-Processing
Sanding & machiningSands poorly — gums rather than powders[11]Sands to a stone-like matte surface[3]
Gluing & solvent weldingCyanoacrylate; no common solvent welds polyamide[11]Not documented
Vapour / chemical smoothingNo practical vapour smoothing[11]Not documented
Support material pairingNot documentedSupport for PLA (Bambu Lab)[4]
Dimensional accuracy & detailNot documentedMatte mineral surface hides layer lines; 55° overhangs and 30 mm bridges as for plain PLA[4]
Solvents & Solubility
Soluble inFormic acid, phenol, m-cresol and hexafluoroisopropanol dissolve the matrix at 23 °C, leaving the fibre; laboratory reagents.[28]Chloroform dissolves the PLA matrix (10 % w/v, 2–4 h at 23 °C) and leaves the filler as loose sludge; laboratory reagent.[29]
Softened or crazed byZinc chloride solutions stress-crack the nylon matrix, alcoholic calcium chloride dissolves it, mineral acids attack it.[28]Acetone, ethyl acetate and toluene plasticise the matrix but dissolve <1 % even at 65 °C; acetone submersion crazes parts.[29][30]
Solvent welding & smoothing agentNone — nylon's only solvents (formic acid, phenol, HFIP) degrade the part, and the fibre blocks surface flow anyway.[28]Chloroform vapour attacks only the resin fraction, so the filler is left standing proud; no workshop-safe agent exists.[31][30]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Bambu Filament Technical Data Sheet — PAHT-CF Bambu Lab · 2026-08 · tds
  2. Fiberon PA612-CF15 Technical Data Sheet V1.1 Polymaker · 2024-12 · tds
  3. StoneFil safety data sheet Formfutura · 2026-08 · msds
  4. Bambu Filament Technical Data Sheet — PLA Marble Bambu Lab · 2026-08 · tds
  5. Polymaker product catalogue Polymaker · 2026-08 · vendor
  6. PLA Marble — product page Bambu Lab US Store · 2026-08 · vendor
  7. ELEGOO product catalogue ELEGOO · 2026-08 · vendor
  8. Printed Solid product catalogue Printed Solid · 2026-08 · vendor
  9. SUNLU High Speed PLA Marble 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
  10. Filament PM PLA MarbleJet technical data sheet Filament PM (Plasty Mladec) · 2026-08 · tds
  11. Nylon — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  12. PA (Nylon) — material basics Polymaker Wiki · 2026-08 · doc
  13. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  14. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  15. PLA Usage Guide Bambu Lab Wiki · 2026-08 · doc
  16. Bambu Filament Technical Data Sheet — PA6-CF Bambu Lab · 2026-08 · tds
  17. Moisture Conditioning — effect on printed nylon properties Polymaker Wiki · 2026-08 · doc
  18. Fiberon PA6-CF20 Technical Data Sheet V1.1 Polymaker · 2024-12 · tds
  19. PolyMide CoPA Technical Data Sheet V5.4 (dry and wet status blocks) Polymaker · 2024-11 · tds
  20. TECAMID 66 GF30 black (PA66-GF30) — stock shape properties Ensinger · 2026-08 · tds
  21. TECACOMP PA66 CF30 black — injection-moulding compound Ensinger · 2026-08 · tds
  22. BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  23. Polymaker PLA Pro vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  24. Carbon Fiber PLA vs META-PLA vs PLA+ vs PLA by Sunlu — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  25. Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
  26. PLA — material guide Prusa Knowledge Base · 2026-08 · doc
  27. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  28. Ultramid Nylon Chemical Resistance guide (unmodified PA6 B27E and PA66 A27E) BASF · 2026-08 · tds
  29. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  30. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  31. Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper