3D Printing Info

Filament comparison

LW-PLA vs PC-ESD

Compare printing settings, strength, heat resistance, dated prices and sources.

2 selected · all documented properties

LW-PLA vs PC-ESD — documented properties and sources
PropertyLightweight / foaming PLA (LW-PLA)PLAESD-safe PCPC
Market snapshot
Listing priceUSD/kg; dated snapshots$47.48/kg median; $37.49–$50.00/kg across 4 dated product listings$180.00/kg median; $180.00–$180.00/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryPLA with a blowing agent. Two distinct types: active-foaming grades that expand at the nozzle (Bambu Lab PLA Aero, colorFabb LW-PLA) and pre-foamed grades that do not (Polymaker PolyLite LW-PLA, PolyWood)[1][2][3][4]Polycarbonate compounded with a conductive filler for static-dissipative parts[5]
Densityg/cm³Filament 1.21 (Bambu Lab) and 1.24 (colorFabb); pre-foamed filament 0.8 (PolyWood, at 21.5 °C) and 0.9 (Polymaker LW-PLA); foamed prints reach 0.40[1][2][3][4]1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[5][6]
Typical priceUSD/kg1 kg-equivalent spools cluster near 45[7][2][8]1 kg-equivalent spools cluster near 180[9]
Price range across brandsUSD/kg37–50 across brands; Polymaker LW-PLA 37, Bambu Lab Aero 45, colorFabb 50, PolyWood 50[8][7][2]180 at 3DXTech's 750 g pricing — the most expensive material in this group[9]
Market availability1–5Available from several mainstream brands[7][8][2]Special order, 1–2 makers worldwide[9]
Spool sizes & diameters1.75 and 2.85 mm; 0.6, 0.75, 0.8 and 1 kg spools[8][2]1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[9]
Typical applicationsRC aircraft, drone airframes and large props where mass matters more than strength[1][2]Electronics fixtures and trays that need PC heat resistance and static dissipation together[5]
Printing Parameters
Nozzle temperature°C210–260 (Bambu Lab, foaming); 195–260 (colorFabb, foaming); 190–210 (Polymaker, pre-foamed)[1][2][3]Not documented
Bed temperature°C35–45 (Bambu Lab); 50–60 (colorFabb); 25–60 (Polymaker)[1][2][3]Not documented
Enclosure / chamber requirement1–5Open frame is fine[3]Enclosure required (passive)[10][11]
Part cooling fanFan on[1][3]Not documented
Bed surface & adhesion aidNot documentedPEI with a glue stick or a commercial adhesive[12]
Maximum volumetric flow (mm³/s; see test conditions)mm³/s3.2–8 at the 40–100 mm/s colorFabb specifies and the 50–100 mm/s Polymaker specifies, on a 0.4 mm nozzle at 0.2 mm layer[3][2][13]Not documented
Warping tendency1–5Not documentedSevere — heated chamber needed[10][11]
Bed-adhesion difficulty1–5Not documentedNeeds a specific surface plus adhesive[12][14]
Stringing / oozing tendency1–5Not documentedModerate — retraction tuning needed; Polymaker flags stringing as a common PC problem[14]
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile; flow has to be cut to match the expansion[2]Advanced — enclosure, hardware upgrades, tuning[10]
Extruder requirementBambu Lab PLA Aero is 0.4 mm nozzle only on the store and wiki, while its own TDS lists 0.4, 0.6 and 0.8[1][15]Not documented
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[3][4]Hardened steel required[5]
Abrasiveness1–5Non-abrasive[3][4]Moderately abrasive — conductive carbon filler[5]
Nozzle clog risk1–5High — jams from moisture, heat creep or particles; Bambu Lab warns the foamed extrudate swells and easily clogs the nozzle, and rules out 0.2 mm nozzles[15]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[16]
Heat-creep / jam sensitivity1–5Not documentedSlightly sensitive[12]
Hotend requirementNot documentedAll-metal hot end required (Simplify3D)[12]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Moderate — 0.45 % saturated at 25 °C / 55 % RH (Bambu Lab); 0.40 % equilibrium (Polymaker)[1][3]Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[17][18][16]
Equilibrium moisture content at ~50 % RH%0.45 saturated at 25 °C / 55 % RH (Bambu Lab); 0.40 equilibrium (Polymaker)[1][3]Not documented
Drying temperature & time55 °C for 6–8 h[1][3]Not documented
Symptoms when wetNot documentedBubbling and popping at the nozzle, stringing and a rough surface[19]
Effect of moisture on strengthPolymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures for this grade; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[19]No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[14][19]
Storage requirementNot documentedAirtight containers with desiccant to prevent reabsorption[14]
Mechanical Properties
Tensile strength (XY)MPa24 ± 2 (Bambu Lab) and 24.4 (Polymaker) printed XY, ISO 527; colorFabb falls from 43.1 unfoamed to 10.8 at 45 % flow[1][3][2]68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[5][20][6]
Young's modulusMPa1350 ± 250 (Bambu Lab) and 1689 (Polymaker) printed XY, ISO 527; colorFabb falls from 3334 unfoamed to 864 foamed[1][3][2]2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[5][6]
Elongation at break%2.6 ± 0.7 (Bambu Lab) and 8.8 (Polymaker) printed XY, ISO 527[1][3]6 at break (printed XY, ISO 527), against 14 for the unfilled grade[5][20]
Flexural strengthMPa45 ± 4 (Bambu Lab) and 50.2 (Polymaker) printed XY, ISO 178[1][3]95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[5][6]
Flexural modulusMPa1690 ± 120 (Bambu Lab) and 1959 (Polymaker) printed XY, ISO 178[1][3]2310 (printed XY, ISO 178)[5]
Charpy impact, notchedkJ/m²8.2 ± 0.7 printed XY, ISO 179, notched (Bambu Lab); colorFabb 3.67 foamed[1][2]Not documented
Other impact dataCharpy unnotched 28.8 printed XY (Bambu Lab); colorFabb 5.46 foamed[1][2]Not documented
Layer adhesion / Z tensileMPa18 ± 3 printed Z, ISO 527 (Bambu Lab); flexural Z collapses to 17 against 45 in XY[1]32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[6]
Brittleness1–5Brittle — snaps with little warning; elongation at break 2.6 % in XY and 1.2 % in Z[1]Moderate[5]
Hardness (scale-specific)Shore A / Shore D / RockwellNot documentedRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[21]
Creep resistance / sustained load1–5Poor — no foamed-grade creep test; plain printed PLA sagged from 12 to 16.2–21.8 mm over 5 days at 1.25 kg, and the foam carries less solid[22][23][24]Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[25][6]
Fatigue / repeated-flex resistance1–5Poor — no grade-specific S-N curve; plain printed PLA ran 38 000–49 000 cycles at 30 % of tensile strength and elongation at break falls to 2.6 % in XY and 1.2 % in Z[26][1]Not documented
Elasticity / flexibility1–5Rigid[1]Rigid[5]
Z strength as % of XY%75 by tensile, 38 by flexural (printed, Bambu Lab)[1]68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[6]
Thermal Properties
HDT at 0.45 MPa°C53 (Bambu Lab) and 54 (Polymaker), ISO 75 at 0.45 MPa[1][3]143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[6]
HDT at 1.8 MPa°C48 (Bambu Lab) and 50 (Polymaker), ISO 75 at 1.8 MPa[1][3]140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[6]
Glass transition (Tg)°C55 (Bambu Lab) and 59 (Polymaker), DSC[1][3]143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[5][6]
Melting point / Vicat°C150 peak melt (Polymaker, DSC); Vicat 60 °C[3]Not documented
Continuous service temperature°CNot documented113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[18]
Annealing responseBambu Lab advises against annealing thin, low-infill Aero prints[1]Not documented
Thermal expansion (CTE)µm/m·KNot documented68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[21]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors[27]Not documented
Chemical resistanceNot documentedWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[14]
Food contactNot documentedBisphenol-A polycarbonate is not offered as food-contact filament[14]
Biodegradability / compostabilityNot documentedNot biodegradable[14]
RecyclabilityNot documentedMechanically recyclable but not accepted in household plastic collection[14]
Electrical & ESD propertiesNot documentedSurface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[5][20]
Health & Safety
Fume toxicity1–5Low hazard — minimal VOC and particle emission[28]Moderate — measurable VOCs and UFPs, ventilation advised[28]
Ultrafine-particle emission rateparticles/minNot documented≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[28]
Ventilation / filtration requirement1–5None needed in a normal room[28]Ventilated room or enclosure recommended[28][10]
Dust & fibre handling hazardNot documentedConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[5]
Post-Processing
Sanding & machiningNot documentedSands and machines well; the toughness means it cuts rather than chips[12]
Gluing & solvent weldingNot documentedCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[12]
Vapour / chemical smoothingNot documentedNo practical vapour smoothing[12]
Support material pairingNot documentedPrints its own supports; 3DXTech sells a dedicated PC break-away support[12]
Dimensional accuracy & detailFoamed surfaces are rough and matte; dimensional accuracy depends on holding the foaming temperature steady[1][2]Not documented
Solvents & Solubility
Soluble inChloroform dissolves the PLA matrix; the foamed wall wicks solvent right through instead of only skinning over.[29]Dichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[30]
Softened or crazed byAcetone, ethyl acetate and toluene plasticise the matrix but dissolve <1 % even at 65 °C; acetone submersion crazes parts.[29][31]Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[30]
Solvent welding & smoothing agentChloroform vapour reaches only the resin skin; no workshop-safe smoothing agent exists for PLA of any kind.[32][31]Dichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[33]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Bambu Filament Technical Data Sheet V4.0 — PLA Aero Bambu Lab · 2026-08 · tds
  2. LW-PLA technical data sheet colorFabb · 2026-08 · tds
  3. PolyLite LW-PLA Technical Data Sheet (V7.0) Polymaker · 2026-08 · tds
  4. PolyWood Technical Data Sheet Version 4.0 (Nov 2018) Polymaker (copy hosted by 3Dee) · 2018-11 · tds
  5. 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
  6. PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
  7. PLA Aero — product page Bambu Lab US Store · 2026-08 · vendor
  8. Polymaker product catalogue Polymaker · 2026-08 · vendor
  9. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  10. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  11. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  12. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  13. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  14. PC — material basics Polymaker Wiki · 2026-08 · doc
  15. PLA Usage Guide Bambu Lab Wiki · 2026-08 · doc
  16. 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
  17. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  18. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  19. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  20. ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
  21. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  22. BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  23. Polymaker PLA Pro vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  24. Carbon Fiber PLA vs META-PLA vs PLA+ vs PLA by Sunlu — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  25. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  26. Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
  27. PLA — material guide Prusa Knowledge Base · 2026-08 · doc
  28. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  29. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  30. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  31. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  32. Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper
  33. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds