3D Printing Info

Filament comparison

HIPS vs HT soluble

Compare printing settings, strength, heat resistance, dated prices and sources.

2 selected · all documented properties

HIPS vs HT soluble — documented properties and sources
PropertyHIPSABSHigh-temperature supportSUPPORT
Market snapshot
Listing priceUSD/kg; dated snapshots$29.99/kg median; $27.99–$32.00/kg across 3 dated product listings$209.00/kg median; $100.00–$290.00/kg across 4 dated product listings
Identity & Market
Base polymer / chemistryHigh-impact polystyrene — polystyrene toughened with a butadiene rubber phase[1][2]Break-away support compounded to survive high-temperature print chambers; 3DXTech sells separate grades for PC/ABS and for the PAEK and PEI class[3][4]
Densityg/cm³1.04 (ISO 1183)[1]1.37 (3DXTech THERMAX HTS1, ISO 1183)[3]
Typical priceUSD/kg1 kg spools cluster near 31[5][6]1 kg-equivalent spools cluster near 168[5]
Price range across brandsUSD/kg28–32 across brands; YXPOLYER 28, Push Plastic 30, 3DXTech 32[6][5][7]100–290 across grades; 3DXTech THERMAX MTS1 100 at 2 kg, HTS2 168 at 250 g, HTS1 250 at 500 g, IEMAI 3D HT-SP 290 at 1 kg[5][8]
Market availability1–5Available from several mainstream brands[5][6]Niche, a handful of specialist brands[5][8]
Spool sizes & diameters1.75 and 2.85 mm; 1 and 3 kg spools[6][5]1.75 mm; 250 g, 500 g, 1 kg and 2 kg spools[5]
Typical applicationsBreak-away and d-limonene-soluble support for ABS and ASA, and a light model material in its own right[2]Support for PEEK, PEI and PC-class prints, where PVA and PLA-based supports would decompose[3][4]
Printing Parameters
Nozzle temperature°C230–245 (Simplify3D)[9]Not documented
Bed temperature°C100–115 (Simplify3D)[9]Not documented
Enclosure / chamber requirement1–5Enclosure recommended[10]Actively heated chamber required — it is used inside high-temperature builds[3]
Part cooling fanPart cooling fan not required[9]Not documented
Bed surface & adhesion aidGlue stick, glass plate, Kapton tape or PET sheets[9]Not documented
Warping tendency1–5Moderate — needs adhesion aid or draught shield[10]Not documented
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[9]Not documented
Stringing / oozing tendency1–5Slight — HIPS oozes less than ABS[9][11]Not documented
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile[10]Expert / industrial hardware only[3]
Extruder requirementNot documentedA dual-extruder machine rated for high-temperature materials; 3DXTech states the grade is intended for dual-extruder printers designed to print high-temp materials[12]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[10]Brass fine indefinitely[3]
Abrasiveness1–5Non-abrasive[10]Non-abrasive[3]
Nozzle clog risk1–5Low — no special hot-end required, no drybox and no hardened nozzle, and 3DXTech states drying is not needed[9][13][2]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry for HTS1 and 80 °C for MTS1[12][14]
Heat-creep / jam sensitivity1–5Slightly sensitive[9]Not documented
Hotend requirementNo special hot-end required[9]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — Simplify3D lists water resistance as a headline property[9]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[15]Not documented
Effect of moisture on strengthPolymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam in the hotend and shows as bubbling and poor layer adhesion[15]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry for HTS1 and 80 °C for MTS1 because trapped water flashes to steam at these nozzle temperatures[12][14]
Storage requirementSealed with desiccant; less critical than for the polyamides[15]Not documented
Mechanical Properties
Tensile strength (XY)MPa40 at break (printed XY, ISO 527)[1]Not documented
Young's modulusMPa1350 (printed XY, ISO 527) — the lowest modulus of the styrenics here[1]Not documented
Elongation at break%18 at break (printed XY, ISO 527)[1]Not documented
Flexural strengthMPa70 (printed XY, ISO 178)[1]Not documented
Flexural modulusMPa1600 (printed XY, ISO 178)[1]Not documented
Brittleness1–5Tough — absorbs impact, yields before breaking[1]Not documented
Creep resistance / sustained load1–5Moderate — no printed-HIPS creep test found; Tg of 100 °C keeps room-temperature service far below softening[1][9]Not documented
Fatigue / repeated-flex resistance1–5Moderate[1]Not documented
Elasticity / flexibility1–5Rigid[1]Not documented
Wear resistance & frictionNot documented3DXTech marks tensile strength, modulus and elongation as not applicable for its support grades — they are not characterised as structural materials[3]
Thermal Properties
HDT at 1.8 MPa°CNot documented205 (THERMAX HTS1, printed XY, ISO 75 at 1.8 MPa)[3]
Glass transition (Tg)°C100 (DSC)[1]225 (3DXTech THERMAX HTS1, DSC) — high enough to stay solid inside a PEI or PEEK build[3]
Melting point / Vicat°CAmorphous — no melting point[1]Not documented
Continuous service temperature°CBounded by a glass transition of 100 °C; no loaded-bar service figure is published for HIPS[1]Not documented
Flammability / UL 94Flammable; no UL 94 rating published[1]Not documented
Environment & Chemical
UV resistance1–5Months outdoors before embrittlement — polystyrene yellows and chalks under UV[16]Not documented
Chemical resistanceDissolves completely in d-limonene — the basis of its use as a soluble support[2]Not documented
Food contactNot food safe[16]Not documented
Biodegradability / compostabilityNot biodegradable[16]Not documented
RecyclabilityNot accepted in household plastic collection[16]Not documented
Electrical & ESD propertiesSurface resistance above 10¹³ ohm/sq — insulating (ASTM D257)[1]Surface resistance above 10^13 ohm/sq on all three THERMAX support grades (ASTM D257) — insulating[3][17][4]
Health & Safety
Fume toxicity1–5High — hazardous VOC such as styrene; enclosure and filtration needed[18]Low hazard — minimal VOC and particle emission; none of these materials was in the chamber study[18]
VOC emission rateµg/min12–113 styrene, the range measured across ABS and the one HIPS filament tested[18]Not documented
Ultrafine-particle emission rateparticles/min≈4 × 10⁹ median for the HIPS filament tested, an order of magnitude below ABS but forty times PLA[18]Not documented
Hazardous species emittedStyrene was the only dominant VOC identified for the HIPS filament tested[18]Not documented
Ventilation / filtration requirement1–5Enclosure with carbon and HEPA filtration[18]Open a window / occasional ventilation[18]
Post-Processing
Sanding & machiningSands and paints readily, like ABS[16]Not documented
Gluing & solvent weldingSolvent-welds with d-limonene, and with acetone via its polystyrene backbone[9][2]Not documented
Vapour / chemical smoothingd-limonene attacks the surface; acetone smoothing is far less effective than on ABS[2][9]Not documented
Support material pairingUsed as the support material itself — dissolves in d-limonene, or breaks away from ABS and ASA[2]This is the support material. MTS1 is matched to PC/ABS and PC; HTS1 and HTS2 to the higher-temperature classes[4][3]
Solvents & Solubility
Soluble ind-limonene, 12–24 h submerged with occasional agitation; acetone also dissolves it, and xylene does so at 23 °C.[19][20][21]Aqueous alkali, not water: IEMAI specifies an alkaline bath in an ultrasonic cleaner until the support dissolves.[8]
Softened or crazed byLimonene also disrupts layer adhesion in some ABS and ASA grades, so an ABS model can flake apart in the same bath.[22]Not documented
Solvent welding & smoothing agentLimonene welds and lightly etches it; acetone welds through the polystyrene backbone but smooths less well than ABS.[19][22]None — the alkaline bath dissolves the support rather than welding anything.[8]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. 3DXMAX HIPS Technical Data Sheet 3DXTech · 2026-08 · tds
  2. 3DXMAX HIPS — product page 3DXTech · 2026-08 · vendor
  3. THERMAX HTS1 Break Away Support Technical Data Sheet v1.0 3DXTech · 2026-08 · tds
  4. THERMAX MTS1 Break Away Support Technical Data Sheet v1.0 3DXTech · 2026-08 · tds
  5. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  6. Push Plastic product catalogue Push Plastic · 2026-08 · vendor
  7. YXPOLYER HIPS product page YXPOLYER · 2026-08 · vendor
  8. IEMAI 3D HT-SP alkaline-soluble support filament — store page IEMAI 3D · 2026-08 · vendor
  9. HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  10. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  11. ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  12. THERMAX HTS1 — product page 3DXTech · 2026-08 · vendor
  13. Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
  14. THERMAX MTS1 — product page 3DXTech · 2026-08 · vendor
  15. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  16. ABS — material basics Polymaker Wiki · 2026-08 · doc
  17. THERMAX HTS2 Break Away Support Technical Data Sheet v1.0 3DXTech · 2026-08 · tds
  18. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  19. D-Limonene — FDM post-processing guide Filament2Print · 2026-08 · review
  20. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  21. US 5,278,282 Polymer recycling by selective dissolution — xylene dissolution temperatures Nauman & Lynch, Rensselaer Polytechnic Institute · 1994-01 · paper
  22. HIPS — Knowledge Base Prusa Research · 2026-08 · doc