3D Printing Info

Filament comparison

HIPS vs PLA Stone

Compare printing settings, strength, heat resistance, dated prices and sources.

2 selected · all documented properties

HIPS vs PLA Stone — documented properties and sources
PropertyHIPSABSStone-filled PLAPLA
Market snapshot
Listing priceUSD/kg; dated snapshots$29.99/kg median; $27.99–$32.00/kg across 3 dated product listings$22.99/kg median; $15.99–$49.16/kg across 6 dated product listings
Identity & Market
Base polymer / chemistryHigh-impact polystyrene — polystyrene toughened with a butadiene rubber phase[1][2]PLA filled with stone or mineral powder — Formfutura StoneFil declares 40–50 wt% stone powder[3][4]
Densityg/cm³1.04 (ISO 1183)[1]1.22 (Bambu Lab PLA Marble) and 1.50–1.70 (Formfutura StoneFil), ISO 1183[4][3]
Typical priceUSD/kg1 kg spools cluster near 31[5][6]1 kg spools cluster near 21[7][8]
Price range across brandsUSD/kg28–32 across brands; YXPOLYER 28, Push Plastic 30, 3DXTech 32[6][5][9]16–49 across brands; SUNLU 16, ELEGOO 19, Polymaker 21, Bambu Lab 25, Prusament 38, Filament PM MarbleJet 49 on 0.5 kg spools[10][8][7][11][12][13]
Market availability1–5Available from several mainstream brands[5][6]Stocked by most mainstream brands[7][8][10]
Spool sizes & diameters1.75 and 2.85 mm; 1 and 3 kg spools[6][5]1.75 and 2.85 mm; 0.5 and 1 kg spools plus refills[8][3]
Typical applicationsBreak-away and d-limonene-soluble support for ABS and ASA, and a light model material in its own right[2]Architectural models, sculpture and props with a matte mineral surface[4]
Printing Parameters
Nozzle temperature°C230–245 (Simplify3D)[14]190–230 (Bambu Lab)[4]
Bed temperature°C100–115 (Simplify3D)[14]35–45 (Bambu Lab)[4]
Enclosure / chamber requirement1–5Enclosure recommended[15]Open frame is fine[4]
Part cooling fanPart cooling fan not required[14]Fan on[4]
Bed surface & adhesion aidGlue stick, glass plate, Kapton tape or PET sheets[14]Not documented
Warping tendency1–5Moderate — needs adhesion aid or draught shield[15]Not documented
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[14]Not documented
Stringing / oozing tendency1–5Slight — HIPS oozes less than ABS[14][16]Not documented
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile[15]Easy — minor profile tuning; 0.2 mm nozzles are not usable[17]
Extruder requirementNot documentedNozzles below 0.4 mm are not compatible (Bambu Lab)[17]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[15]Brass acceptable; hardened steel for volume work — Bambu Lab's compatibility table says no hardened nozzle is needed while the note under the same table groups PLA Marble with particle-filled materials that should always use one[17]
Abrasiveness1–5Non-abrasive[15]Moderately abrasive — stone fill[17][3]
Nozzle clog risk1–5Low — no special hot-end required, no drybox and no hardened nozzle, and 3DXTech states drying is not needed[14][18][2]Moderate — needs dry filament and a clean nozzle[17]
Heat-creep / jam sensitivity1–5Slightly sensitive[14]Not documented
Hotend requirementNo special hot-end required[14]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — Simplify3D lists water resistance as a headline property[14]Moderate — 0.44 % saturated at 25 °C / 55 % RH[4]
Equilibrium moisture content at ~50 % RH%Not documented0.44 saturated at 25 °C / 55 % RH (Bambu Lab)[4]
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[19]Not documented
Effect of moisture on strengthPolymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam in the hotend and shows as bubbling and poor layer adhesion[19]Polymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures for this grade; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[19]
Storage requirementSealed with desiccant; less critical than for the polyamides[19]Not documented
Mechanical Properties
Tensile strength (XY)MPa40 at break (printed XY, ISO 527)[1]33 ± 4 printed XY, ISO 527 (Bambu Lab)[4]
Young's modulusMPa1350 (printed XY, ISO 527) — the lowest modulus of the styrenics here[1]2330 ± 240 printed XY, ISO 527 (Bambu Lab)[4]
Elongation at break%18 at break (printed XY, ISO 527)[1]6.7 ± 0.5 printed XY, ISO 527 (Bambu Lab)[4]
Flexural strengthMPa70 (printed XY, ISO 178)[1]75 ± 5 printed XY, ISO 178 (Bambu Lab)[4]
Flexural modulusMPa1600 (printed XY, ISO 178)[1]2920 ± 180 printed XY, ISO 178 (Bambu Lab)[4]
Charpy impact, notchedkJ/m²Not documented9.5 ± 2.6 printed XY, ISO 179, notched (Bambu Lab)[4]
Other impact dataNot documentedCharpy unnotched 24.0 printed XY (Bambu Lab, ISO 179)[4]
Layer adhesion / Z tensileMPaNot documented30 ± 4 printed Z, ISO 527 (Bambu Lab)[4]
Brittleness1–5Tough — absorbs impact, yields before breaking[1]Brittle — snaps with little warning[4]
Creep resistance / sustained load1–5Moderate — no printed-HIPS creep test found; Tg of 100 °C keeps room-temperature service far below softening[1][14]Poor — no stone-filled creep test; plain printed PLA sagged from 12 to 16.2–21.8 mm over 5 days at 1.25 kg[20][21][22]
Fatigue / repeated-flex resistance1–5Moderate[1]Poor — no grade-specific S-N curve; plain printed PLA ran 38 000–49 000 cycles at 30 % of tensile strength and the mineral filler leaves a brittle compound[23][4]
Elasticity / flexibility1–5Rigid[1]Rigid[4]
Z strength as % of XY%Not documented91 by tensile, 73 by flexural (printed, Bambu Lab)[4]
Thermal Properties
HDT at 0.45 MPa°CNot documented56 (ISO 75, 0.45 MPa)[4]
HDT at 1.8 MPa°CNot documented53 (ISO 75, 1.8 MPa)[4]
Glass transition (Tg)°C100 (DSC)[1]56 (DSC)[4]
Melting point / Vicat°CAmorphous — no melting point[1]156 peak melt (DSC); Formfutura gives a 120–170 melting range for StoneFil[4][3]
Continuous service temperature°CBounded by a glass transition of 100 °C; no loaded-bar service figure is published for HIPS[1]Not documented
Flammability / UL 94Flammable; no UL 94 rating published[1]Not documented
Environment & Chemical
UV resistance1–5Months outdoors before embrittlement — polystyrene yellows and chalks under UV[24]Degrades within weeks outdoors[25]
Chemical resistanceDissolves completely in d-limonene — the basis of its use as a soluble support[2]Not documented
Food contactNot food safe[24]Not documented
Biodegradability / compostabilityNot biodegradable[24]Not documented
RecyclabilityNot accepted in household plastic collection[24]Not documented
Electrical & ESD propertiesSurface resistance above 10¹³ ohm/sq — insulating (ASTM D257)[1]Not documented
Health & Safety
Fume toxicity1–5High — hazardous VOC such as styrene; enclosure and filtration needed[26]Low hazard — minimal VOC and particle emission[26]
VOC emission rateµg/min12–113 styrene, the range measured across ABS and the one HIPS filament tested[26]Not documented
Ultrafine-particle emission rateparticles/min≈4 × 10⁹ median for the HIPS filament tested, an order of magnitude below ABS but forty times PLA[26]Not documented
Hazardous species emittedStyrene was the only dominant VOC identified for the HIPS filament tested[26]Not documented
Ventilation / filtration requirement1–5Enclosure with carbon and HEPA filtration[26]None needed in a normal room[26]
Dust & fibre handling hazardNot documentedFormfutura's SDS sets an occupational limit of 1 mg/m³ for the stone powder and lists it as both a fibre and a particulate — do not dry-sand without extraction[3]
Post-Processing
Sanding & machiningSands and paints readily, like ABS[24]Sands to a stone-like matte surface[3]
Gluing & solvent weldingSolvent-welds with d-limonene, and with acetone via its polystyrene backbone[14][2]Not documented
Vapour / chemical smoothingd-limonene attacks the surface; acetone smoothing is far less effective than on ABS[2][14]Not documented
Support material pairingUsed as the support material itself — dissolves in d-limonene, or breaks away from ABS and ASA[2]Support for PLA (Bambu Lab)[4]
Dimensional accuracy & detailNot documentedMatte mineral surface hides layer lines; 55° overhangs and 30 mm bridges as for plain PLA[4]
Solvents & Solubility
Soluble ind-limonene, 12–24 h submerged with occasional agitation; acetone also dissolves it, and xylene does so at 23 °C.[27][28][29]Chloroform dissolves the PLA matrix (10 % w/v, 2–4 h at 23 °C) and leaves the filler as loose sludge; laboratory reagent.[30]
Softened or crazed byLimonene also disrupts layer adhesion in some ABS and ASA grades, so an ABS model can flake apart in the same bath.[31]Acetone, ethyl acetate and toluene plasticise the matrix but dissolve <1 % even at 65 °C; acetone submersion crazes parts.[30][32]
Solvent welding & smoothing agentLimonene welds and lightly etches it; acetone welds through the polystyrene backbone but smooths less well than ABS.[27][31]Chloroform vapour attacks only the resin fraction, so the filler is left standing proud; no workshop-safe agent exists.[33][32]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. 3DXMAX HIPS Technical Data Sheet 3DXTech · 2026-08 · tds
  2. 3DXMAX HIPS — product page 3DXTech · 2026-08 · vendor
  3. StoneFil safety data sheet Formfutura · 2026-08 · msds
  4. Bambu Filament Technical Data Sheet — PLA Marble Bambu Lab · 2026-08 · tds
  5. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  6. Push Plastic product catalogue Push Plastic · 2026-08 · vendor
  7. PLA Marble — product page Bambu Lab US Store · 2026-08 · vendor
  8. Polymaker product catalogue Polymaker · 2026-08 · vendor
  9. YXPOLYER HIPS product page YXPOLYER · 2026-08 · vendor
  10. ELEGOO product catalogue ELEGOO · 2026-08 · vendor
  11. Printed Solid product catalogue Printed Solid · 2026-08 · vendor
  12. SUNLU High Speed PLA Marble 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
  13. Filament PM PLA MarbleJet technical data sheet Filament PM (Plasty Mladec) · 2026-08 · tds
  14. HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  15. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  16. ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  17. PLA Usage Guide Bambu Lab Wiki · 2026-08 · doc
  18. Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
  19. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  20. BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  21. Polymaker PLA Pro vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  22. Carbon Fiber PLA vs META-PLA vs PLA+ vs PLA by Sunlu — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  23. Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
  24. ABS — material basics Polymaker Wiki · 2026-08 · doc
  25. PLA — material guide Prusa Knowledge Base · 2026-08 · doc
  26. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  27. D-Limonene — FDM post-processing guide Filament2Print · 2026-08 · review
  28. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  29. US 5,278,282 Polymer recycling by selective dissolution — xylene dissolution temperatures Nauman & Lynch, Rensselaer Polytechnic Institute · 1994-01 · paper
  30. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  31. HIPS — Knowledge Base Prusa Research · 2026-08 · doc
  32. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  33. Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper