3D Printing Info

Filament comparison

HIPS vs PC-FR

Compare printing settings, strength, heat resistance, dated prices and sources.

HIPS guideFlame-retardant PC (PC-FR) guide

2 selected · all documented properties

Open these two in the interactive comparisonMore HIPS comparisonsMore PC-FR comparisons
HIPS vs PC-FR — documented properties and sources
PropertyHIPSABSFlame-retardant PC (PC-FR)PC
Market snapshot
Listing priceUSD/kg; dated snapshots$29.99/kg median; $27.99–$32.00/kg across 3 dated product listings$87.50/kg median; $54.99–$224.00/kg across 4 dated product listings
Identity & Market
Base polymer / chemistryHigh-impact polystyrene — polystyrene toughened with a butadiene rubber phase[1][2]Flame-retardant polycarbonate. Polymaker builds its grade on Covestro's Makrolon family and rates it UL 94 V-0[3][4]
Densityg/cm³1.04 (ISO 1183)[1]1.18 (Bambu Lab) and 1.2 (Polymaker), ISO 1183[4][3]
Typical priceUSD/kg1 kg spools cluster near 31[5][6]1 kg-equivalent spools span 55–224; the two mainstream 1 kg grades are 55 and the industrial grades 120–224[4][7]
Price range across brandsUSD/kg28–32 across brands; YXPOLYER 28, Push Plastic 30, 3DXTech 32[6][5][8]55–224 across brands; Bambu Lab and Polymaker 55, 3DXTech FR PC/ABS 120, 3DXLABS FR-PC 224[4][7][5]
Market availability1–5Available from several mainstream brands[5][6]Available from several mainstream brands[4][7][5]
Spool sizes & diameters1.75 and 2.85 mm; 1 and 3 kg spools[6][5]1.75 mm; 0.75 and 1 kg spools[7][5][4]
Typical applicationsBreak-away and d-limonene-soluble support for ABS and ASA, and a light model material in its own right[2]Electrical enclosures, transport interiors and battery housings that must meet a flammability rating[3][4]
Diameter tolerance± mmNot documented±0.03 (Bambu Lab PC FR)[4]
Printing Parameters
Nozzle temperature°C230–245 (Simplify3D)[9]260–280 (Bambu Lab); 250–270 (Polymaker)[4][3]
Bed temperature°C100–115 (Simplify3D)[9]90–110 (Bambu Lab); 90–105 (Polymaker)[4][3]
Enclosure / chamber requirement1–5Enclosure recommended[10]Enclosure required (passive) — Bambu Lab specifies a 45–60 °C chamber, Polymaker 70–100 °C[4][3]
Recommended chamber temperature°CNot documented45–60 (Bambu Lab); 70–100 (Polymaker)[4][3]
Part cooling fanPart cooling fan not required[9]0–60 % (Bambu Lab)[4]
Bed surface & adhesion aidGlue stick, glass plate, Kapton tape or PET sheets[9]Smooth or textured PEI plate (Bambu Lab)[4]
Maximum volumetric flow (mm³/s; see test conditions)mm³/sNot documented24 at Bambu Lab's 300 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[4][11]
Warping tendency1–5Moderate — needs adhesion aid or draught shield[10]Severe — heated chamber needed[3][10]
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[9]Needs a specific surface plus adhesive[12][13]
Stringing / oozing tendency1–5Slight — HIPS oozes less than ABS[9][14]Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[13]
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile[10]Advanced — enclosure, hardware upgrades, tuning[4][10]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[10]Brass fine indefinitely[10]
Abrasiveness1–5Non-abrasive[10]Non-abrasive[3]
Nozzle clog risk1–5Low — no special hot-end required, no drybox and no hardened nozzle, and 3DXTech states drying is not needed[9][15][2]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 6 h pre-dry at 80 °C[16]
Heat-creep / jam sensitivity1–5Slightly sensitive[9]Slightly sensitive[12]
Hotend requirementNo special hot-end required[9]All-metal hot end required (Simplify3D)[12]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — Simplify3D lists water resistance as a headline property[9]Low (0.1–0.3 %) — 0.12 % saturated at 25 °C / 55 % RH (Bambu Lab), half that of unfilled Bambu Lab PC[4][17]
Equilibrium moisture content at ~50 % RH%Not documented0.12 saturated at 25 °C / 55 % RH (Bambu Lab)[4]
Drying temperature & timeNot documented75 °C for 6 h (Polymaker)[3]
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[18]Bubbling and popping at the nozzle, stringing and a rough surface[18]
Effect of moisture on strengthPolymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam in the hotend and shows as bubbling and poor layer adhesion[18]No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[13][18]
Storage requirementSealed with desiccant; less critical than for the polyamides[18]Airtight containers with desiccant to prevent reabsorption[13]
Mechanical Properties
Tensile strength (XY)MPa40 at break (printed XY, ISO 527)[1]60 ± 4 (Bambu Lab) and 67 ± 4.5 (Polymaker) printed XY, ISO 527[4][3]
Young's modulusMPa1350 (printed XY, ISO 527) — the lowest modulus of the styrenics here[1]1670 ± 40 (Bambu Lab) and 2634 ± 182 (Polymaker) printed XY, ISO 527[4][3]
Elongation at break%18 at break (printed XY, ISO 527)[1]2.4 ± 0.3 (Bambu Lab) and 3.49 ± 0.7 (Polymaker) at break, printed XY, ISO 527 — the retardant roughly halves unfilled PC's elongation[4][3][19]
Flexural strengthMPa70 (printed XY, ISO 178)[1]96.6 ± 1.3 printed XY, ISO 178 (Polymaker)[3]
Flexural modulusMPa1600 (printed XY, ISO 178)[1]2518 ± 53 printed XY, ISO 178 (Polymaker)[3]
Charpy impact, notchedkJ/m²Not documented11.7 ± 1.6 printed XY, ISO 179, notched (Polymaker)[3]
Other impact dataNot documentedNotched Charpy 7.5 ± 1.6 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA)[3]
Layer adhesion / Z tensileMPaNot documented21 ± 3 (Bambu Lab) and 46 ± 4.8 (Polymaker) printed Z, ISO 527[4][3]
Brittleness1–5Tough — absorbs impact, yields before breaking[1]Moderate[4][3]
Hardness (scale-specific)Shore A / Shore D / RockwellNot documentedRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a flame-retardant filament[20]
Creep resistance / sustained load1–5Moderate — no printed-HIPS creep test found; Tg of 100 °C keeps room-temperature service far below softening[1][9]Good. Moulded unfilled PC sustained 41 MPa tensile creep at room temperature without breaking, but the retardant package drops the glass transition to 115 °C in Polymaker's grade, so the unfilled rating is not carried over in full[21][3]
Fatigue / repeated-flex resistance1–5Moderate[1]Not documented
Elasticity / flexibility1–5Rigid[1]Rigid[3]
Z strength as % of XY%Not documented35 (Bambu Lab) to 69 (Polymaker), printed[4][3]
Thermal Properties
HDT at 0.45 MPa°CNot documented110 (Polymaker) and 113 (Bambu Lab), ISO 75 at 0.45 MPa[3][4]
HDT at 1.8 MPa°CNot documented107 (Polymaker) and 108 (Bambu Lab), ISO 75 at 1.8 MPa[3][4]
Glass transition (Tg)°C100 (DSC)[1]115 (Polymaker) and 145 (Bambu Lab), DSC[3][4]
Melting point / Vicat°CAmorphous — no melting point[1]Amorphous — no melting point; Vicat 114 (Bambu Lab, ISO 306)[4]
Continuous service temperature°CBounded by a glass transition of 100 °C; no loaded-bar service figure is published for HIPS[1]113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[22]
Thermal expansion (CTE)µm/m·KNot documented68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a flame-retardant grade[20]
Flammability / UL 94Flammable; no UL 94 rating published[1]UL 94 V-0 (Polymaker PolyMax PC-FR); 3DXTech rates its FR PC/ABS V-0 at 1.5 mm on the base resin[3][23]
Environment & Chemical
UV resistance1–5Months outdoors before embrittlement — polystyrene yellows and chalks under UV[24]Degrades within weeks outdoors unless stabilised[13]
Chemical resistanceDissolves completely in d-limonene — the basis of its use as a soluble support[2]Withstands oils, solvents and fuels; Polymaker rates it good against weak acids[13]
Food contactNot food safe[24]Bisphenol-A polycarbonate is not offered as food-contact filament[13]
Biodegradability / compostabilityNot biodegradable[24]Not biodegradable[13]
RecyclabilityNot accepted in household plastic collection[24]Mechanically recyclable but not accepted in household plastic collection[13]
Electrical & ESD propertiesSurface resistance above 10¹³ ohm/sq — insulating (ASTM D257)[1]Not documented
Health & Safety
Fume toxicity1–5High — hazardous VOC such as styrene; enclosure and filtration needed[25]Moderate — measurable VOCs and UFPs, ventilation advised[25]
VOC emission rateµg/min12–113 styrene, the range measured across ABS and the one HIPS filament tested[25]Not documented
Ultrafine-particle emission rateparticles/min≈4 × 10⁹ median for the HIPS filament tested, an order of magnitude below ABS but forty times PLA[25]≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[25]
Hazardous species emittedStyrene was the only dominant VOC identified for the HIPS filament tested[25]Not documented
Ventilation / filtration requirement1–5Enclosure with carbon and HEPA filtration[25]Ventilated room or enclosure recommended[25][10]
Post-Processing
Sanding & machiningSands and paints readily, like ABS[24]Sands and machines well; the toughness means it cuts rather than chips[12]
Gluing & solvent weldingSolvent-welds with d-limonene, and with acetone via its polystyrene backbone[9][2]Cyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[12]
Vapour / chemical smoothingd-limonene attacks the surface; acetone smoothing is far less effective than on ABS[2][9]No practical vapour smoothing[12]
Support material pairingUsed as the support material itself — dissolves in d-limonene, or breaks away from ABS and ASA[2]Prints its own supports; 3DXTech sells a dedicated PC break-away support[12]
Solvents & Solubility
Soluble ind-limonene, 12–24 h submerged with occasional agitation; acetone also dissolves it, and xylene does so at 23 °C.[26][27][28]Dichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[29]
Softened or crazed byLimonene also disrupts layer adhesion in some ABS and ASA grades, so an ABS model can flake apart in the same bath.[30]Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[29]
Solvent welding & smoothing agentLimonene welds and lightly etches it; acetone welds through the polystyrene backbone but smooths less well than ABS.[26][30]Dichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[31]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. 3DXMAX HIPS Technical Data Sheet 3DXTech · 2026-08 · tds
  2. 3DXMAX HIPS — product page 3DXTech · 2026-08 · vendor
  3. PolyMax PC-FR Technical Data Sheet V5.5 Polymaker · 2024-11 · tds
  4. Bambu Filament Technical Data Sheet V1.0 — PC FR Bambu Lab · 2026-08 · tds
  5. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  6. Push Plastic product catalogue Push Plastic · 2026-08 · vendor
  7. Polymaker product catalogue Polymaker · 2026-08 · vendor
  8. YXPOLYER HIPS product page YXPOLYER · 2026-08 · vendor
  9. HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  10. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  11. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  12. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  13. PC — material basics Polymaker Wiki · 2026-08 · doc
  14. ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  15. Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
  16. 3DXTech Firewire FR-PC/ABS product page 3DXTech · 2026-08 · vendor
  17. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  18. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  19. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  20. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  21. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  22. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  23. Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
  24. ABS — material basics Polymaker Wiki · 2026-08 · doc
  25. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  26. D-Limonene — FDM post-processing guide Filament2Print · 2026-08 · review
  27. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  28. US 5,278,282 Polymer recycling by selective dissolution — xylene dissolution temperatures Nauman & Lynch, Rensselaer Polytechnic Institute · 1994-01 · paper
  29. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  30. HIPS — Knowledge Base Prusa Research · 2026-08 · doc
  31. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds