3D Printing Info

Filament comparison

Conductive vs PC-FR

Compare printing settings, strength, heat resistance, dated prices and sources.

Conductive filament guideFlame-retardant PC (PC-FR) guide

2 selected · all documented properties

Open these two in the interactive comparisonMore Conductive comparisonsMore PC-FR comparisons
Conductive vs PC-FR — documented properties and sources
PropertyConductive filamentSPECIALTYFlame-retardant PC (PC-FR)PC
Market snapshot
Listing priceUSD/kg; dated snapshots$170.36/kg median; $89.99–$796.00/kg across 4 dated product listings$87.50/kg median; $54.99–$224.00/kg across 4 dated product listings
Identity & Market
Base polymer / chemistryA carbon-filled compound conductive by volume rather than merely dissipative; Proto-pasta's is PLA-based, Recreus's and NinjaTek's are TPU, and add:north's Koltron G1 does not state its base polymer[1][2][3][4]Flame-retardant polycarbonate. Polymaker builds its grade on Covestro's Makrolon family and rates it UL 94 V-0[5][6]
Densityg/cm³Not documented1.18 (Bambu Lab) and 1.2 (Polymaker), ISO 1183[6][5]
Typical priceUSD/kg1 kg-equivalent spools span 90–181 for the carbon-filled grades; add:north's Koltron G1 sits far above at 796 because it is sold only in 100 and 250 g coils[7][8][9]1 kg-equivalent spools span 55–224; the two mainstream 1 kg grades are 55 and the industrial grades 120–224[6][10]
Price range across brandsUSD/kg90–796 across brands; Proto-pasta conductive PLA 90 at 1 kg, Recreus Conductive Filaflex 160 at 500 g, NinjaTek Eel 181 at 1 kg, add:north Koltron G1 796 at 250 g[7][2][8][9]55–224 across brands; Bambu Lab and Polymaker 55, 3DXTech FR PC/ABS 120, 3DXLABS FR-PC 224[6][10][11]
Market availability1–5Niche, a handful of specialist brands[7][2]Available from several mainstream brands[6][10][11]
Spool sizes & diameters1.75 and 2.85 mm; 0.05, 0.1, 0.25, 0.5, 1 and 2 kg spools[7][2][8][9]1.75 mm; 0.75 and 1 kg spools[10][11][6]
Typical applicationsCapacitive touch surfaces, low-current traces, EMI shielding and static-safe fixtures[1]Electrical enclosures, transport interiors and battery housings that must meet a flammability rating[5][6]
Diameter tolerance± mmNot documented±0.03 (Bambu Lab PC FR)[6]
Printing Parameters
Nozzle temperature°CNot documented260–280 (Bambu Lab); 250–270 (Polymaker)[6][5]
Bed temperature°CNot documented90–110 (Bambu Lab); 90–105 (Polymaker)[6][5]
Enclosure / chamber requirement1–5Open frame is fine[1]Enclosure required (passive) — Bambu Lab specifies a 45–60 °C chamber, Polymaker 70–100 °C[6][5]
Recommended chamber temperature°CNot documented45–60 (Bambu Lab); 70–100 (Polymaker)[6][5]
Part cooling fanNot documented0–60 % (Bambu Lab)[6]
Bed surface & adhesion aidNot documentedSmooth or textured PEI plate (Bambu Lab)[6]
Maximum volumetric flow (mm³/s; see test conditions)mm³/sNot documented24 at Bambu Lab's 300 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[6][12]
Warping tendency1–5Not documentedSevere — heated chamber needed[5][13]
Bed-adhesion difficulty1–5Not documentedNeeds a specific surface plus adhesive[14][15]
Stringing / oozing tendency1–5Not documentedModerate — retraction tuning needed; Polymaker flags stringing as a common PC problem[15]
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile[1]Advanced — enclosure, hardware upgrades, tuning[6][13]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass acceptable; hardened steel for volume work[1]Brass fine indefinitely[13]
Abrasiveness1–5Moderately abrasive — conductive carbon filler[1]Non-abrasive[5]
Nozzle clog risk1–5Low — Proto-pasta states the carbon-filled grade prints on standard PLA settings with no special nozzle required[1]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 6 h pre-dry at 80 °C[16]
Heat-creep / jam sensitivity1–5Not documentedSlightly sensitive[14]
Hotend requirementNot documentedAll-metal hot end required (Simplify3D)[14]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Not documentedLow (0.1–0.3 %) — 0.12 % saturated at 25 °C / 55 % RH (Bambu Lab), half that of unfilled Bambu Lab PC[6][17]
Equilibrium moisture content at ~50 % RH%Not documented0.12 saturated at 25 °C / 55 % RH (Bambu Lab)[6]
Drying temperature & timeNot documented75 °C for 6 h (Polymaker)[5]
Symptoms when wetNot documentedBubbling and popping at the nozzle, stringing and a rough surface[18]
Effect of moisture on strengthPolymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[18]No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[15][18]
Storage requirementNot documentedAirtight containers with desiccant to prevent reabsorption[15]
Mechanical Properties
Tensile strength (XY)MPaNot documented60 ± 4 (Bambu Lab) and 67 ± 4.5 (Polymaker) printed XY, ISO 527[6][5]
Young's modulusMPaNot documented1670 ± 40 (Bambu Lab) and 2634 ± 182 (Polymaker) printed XY, ISO 527[6][5]
Elongation at break%Not documented2.4 ± 0.3 (Bambu Lab) and 3.49 ± 0.7 (Polymaker) at break, printed XY, ISO 527 — the retardant roughly halves unfilled PC's elongation[6][5][19]
Flexural strengthMPaNot documented96.6 ± 1.3 printed XY, ISO 178 (Polymaker)[5]
Flexural modulusMPaNot documented2518 ± 53 printed XY, ISO 178 (Polymaker)[5]
Charpy impact, notchedkJ/m²Not documented11.7 ± 1.6 printed XY, ISO 179, notched (Polymaker)[5]
Other impact dataNot documentedNotched Charpy 7.5 ± 1.6 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA)[5]
Layer adhesion / Z tensileMPaNot documented21 ± 3 (Bambu Lab) and 46 ± 4.8 (Polymaker) printed Z, ISO 527[6][5]
Brittleness1–5Brittle — snaps with little warning; carbon-black loading at conductive levels embrittles PLA[1]Moderate[6][5]
Hardness (scale-specific)Shore A / Shore D / RockwellNot documentedRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a flame-retardant filament[20]
Creep resistance / sustained load1–5Not documentedGood. Moulded unfilled PC sustained 41 MPa tensile creep at room temperature without breaking, but the retardant package drops the glass transition to 115 °C in Polymaker's grade, so the unfilled rating is not carried over in full[21][5]
Elasticity / flexibility1–5Rigid[1]Rigid[5]
Z strength as % of XY%Not documented35 (Bambu Lab) to 69 (Polymaker), printed[6][5]
Thermal Properties
HDT at 0.45 MPa°CNot documented110 (Polymaker) and 113 (Bambu Lab), ISO 75 at 0.45 MPa[5][6]
HDT at 1.8 MPa°CNot documented107 (Polymaker) and 108 (Bambu Lab), ISO 75 at 1.8 MPa[5][6]
Glass transition (Tg)°CNot documented115 (Polymaker) and 145 (Bambu Lab), DSC[5][6]
Melting point / Vicat°CNot documentedAmorphous — no melting point; Vicat 114 (Bambu Lab, ISO 306)[6]
Continuous service temperature°CNot documented113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[22]
Thermal expansion (CTE)µm/m·KNot documented68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a flame-retardant grade[20]
Flammability / UL 94Not documentedUL 94 V-0 (Polymaker PolyMax PC-FR); 3DXTech rates its FR PC/ABS V-0 at 1.5 mm on the base resin[5][23]
Environment & Chemical
UV resistance1–5Not documentedDegrades within weeks outdoors unless stabilised[15]
Chemical resistanceNot documentedWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[15]
Food contactNot documentedBisphenol-A polycarbonate is not offered as food-contact filament[15]
Biodegradability / compostabilityNot documentedNot biodegradable[15]
RecyclabilityNot documentedMechanically recyclable but not accepted in household plastic collection[15]
Electrical & ESD propertiesConductive rather than dissipative — Proto-pasta sells the grade as electrically conductive composite PLA[1]Not documented
Health & Safety
Fume toxicity1–5Low hazard — minimal VOC and particle emission; none of these materials was in the chamber study[24]Moderate — measurable VOCs and UFPs, ventilation advised[24]
Ultrafine-particle emission rateparticles/minNot documented≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[24]
Ventilation / filtration requirement1–5Open a window / occasional ventilation[24]Ventilated room or enclosure recommended[24][13]
Dust & fibre handling hazardConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1]Not documented
Post-Processing
Sanding & machiningNot documentedSands and machines well; the toughness means it cuts rather than chips[14]
Gluing & solvent weldingNot documentedCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[14]
Vapour / chemical smoothingNot documentedNo practical vapour smoothing[14]
Support material pairingNot documentedPrints its own supports; 3DXTech sells a dedicated PC break-away support[14]
Solvents & Solubility
Soluble inChloroform dissolves PLA-based grades, leaving the carbon black; TPU-based grades need DMF, NMP or THF. Laboratory reagents.[25][26]Dichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[27]
Softened or crazed byAcetone and ethyl acetate plasticise a PLA-based grade; a TPU-based grade swells in toluene, esters and alcohols.[25][26]Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[27]
Solvent welding & smoothing agentNone — neither PLA nor TPU has a workshop-safe welding or smoothing solvent.[25][26]Dichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[28]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Electrically Conductive Composite PLA — product page and technical data Proto-pasta · 2026-08 · tds
  2. Recreus product catalogue Recreus · 2026-08 · vendor
  3. Eel 3D Printing Filament Technical Specifications NinjaTek · 2026-08 · tds
  4. Koltron G1 Technical Data Sheet add:north · 2026-08 · tds
  5. PolyMax PC-FR Technical Data Sheet V5.5 Polymaker · 2024-11 · tds
  6. Bambu Filament Technical Data Sheet V1.0 — PC FR Bambu Lab · 2026-08 · tds
  7. Proto-pasta product catalogue Proto-pasta · 2026-08 · vendor
  8. Eel product page — durometer, print guidelines and price NinjaTek · 2026-08 · vendor
  9. add:north Koltron G1 product page add:north · 2026-08 · vendor
  10. Polymaker product catalogue Polymaker · 2026-08 · vendor
  11. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  12. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  13. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  14. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  15. PC — material basics Polymaker Wiki · 2026-08 · doc
  16. 3DXTech Firewire FR-PC/ABS product page 3DXTech · 2026-08 · vendor
  17. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  18. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  19. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  20. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  21. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  22. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  23. Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
  24. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  25. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  26. Elastollan — Chemical properties: swelling and chemical resistance BASF · 2026-08 · tds
  27. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  28. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds