3D Printing Info

Filament comparison

Conductive vs HIPS

Compare printing settings, strength, heat resistance, dated prices and sources.

2 selected · all documented properties

Conductive vs HIPS — documented properties and sources
PropertyConductive filamentSPECIALTYHIPSABS
Market snapshot
Listing priceUSD/kg; dated snapshots$170.36/kg median; $89.99–$796.00/kg across 4 dated product listings$29.99/kg median; $27.99–$32.00/kg across 3 dated product listings
Identity & Market
Base polymer / chemistryA carbon-filled compound conductive by volume rather than merely dissipative; Proto-pasta's is PLA-based, Recreus's and NinjaTek's are TPU, and add:north's Koltron G1 does not state its base polymer[1][2][3][4]High-impact polystyrene — polystyrene toughened with a butadiene rubber phase[5][6]
Densityg/cm³Not documented1.04 (ISO 1183)[5]
Typical priceUSD/kg1 kg-equivalent spools span 90–181 for the carbon-filled grades; add:north's Koltron G1 sits far above at 796 because it is sold only in 100 and 250 g coils[7][8][9]1 kg spools cluster near 31[10][11]
Price range across brandsUSD/kg90–796 across brands; Proto-pasta conductive PLA 90 at 1 kg, Recreus Conductive Filaflex 160 at 500 g, NinjaTek Eel 181 at 1 kg, add:north Koltron G1 796 at 250 g[7][2][8][9]28–32 across brands; YXPOLYER 28, Push Plastic 30, 3DXTech 32[11][10][12]
Market availability1–5Niche, a handful of specialist brands[7][2]Available from several mainstream brands[10][11]
Spool sizes & diameters1.75 and 2.85 mm; 0.05, 0.1, 0.25, 0.5, 1 and 2 kg spools[7][2][8][9]1.75 and 2.85 mm; 1 and 3 kg spools[11][10]
Typical applicationsCapacitive touch surfaces, low-current traces, EMI shielding and static-safe fixtures[1]Break-away and d-limonene-soluble support for ABS and ASA, and a light model material in its own right[6]
Printing Parameters
Nozzle temperature°CNot documented230–245 (Simplify3D)[13]
Bed temperature°CNot documented100–115 (Simplify3D)[13]
Enclosure / chamber requirement1–5Open frame is fine[1]Enclosure recommended[14]
Part cooling fanNot documentedPart cooling fan not required[13]
Bed surface & adhesion aidNot documentedGlue stick, glass plate, Kapton tape or PET sheets[13]
Warping tendency1–5Not documentedModerate — needs adhesion aid or draught shield[14]
Bed-adhesion difficulty1–5Not documentedNeeds a specific surface plus adhesive[13]
Stringing / oozing tendency1–5Not documentedSlight — HIPS oozes less than ABS[13][15]
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile[1]Intermediate — dry filament and a tuned profile[14]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass acceptable; hardened steel for volume work[1]Brass fine indefinitely[14]
Abrasiveness1–5Moderately abrasive — conductive carbon filler[1]Non-abrasive[14]
Nozzle clog risk1–5Low — Proto-pasta states the carbon-filled grade prints on standard PLA settings with no special nozzle required[1]Low — no special hot-end required, no drybox and no hardened nozzle, and 3DXTech states drying is not needed[13][16][6]
Heat-creep / jam sensitivity1–5Not documentedSlightly sensitive[13]
Hotend requirementNot documentedNo special hot-end required[13]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Not documentedLow (0.1–0.3 %) — Simplify3D lists water resistance as a headline property[13]
Symptoms when wetNot documentedBubbling and popping at the nozzle, stringing and a rough surface[17]
Effect of moisture on strengthPolymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[17]Polymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam in the hotend and shows as bubbling and poor layer adhesion[17]
Storage requirementNot documentedSealed with desiccant; less critical than for the polyamides[17]
Mechanical Properties
Tensile strength (XY)MPaNot documented40 at break (printed XY, ISO 527)[5]
Young's modulusMPaNot documented1350 (printed XY, ISO 527) — the lowest modulus of the styrenics here[5]
Elongation at break%Not documented18 at break (printed XY, ISO 527)[5]
Flexural strengthMPaNot documented70 (printed XY, ISO 178)[5]
Flexural modulusMPaNot documented1600 (printed XY, ISO 178)[5]
Brittleness1–5Brittle — snaps with little warning; carbon-black loading at conductive levels embrittles PLA[1]Tough — absorbs impact, yields before breaking[5]
Creep resistance / sustained load1–5Not documentedModerate — no printed-HIPS creep test found; Tg of 100 °C keeps room-temperature service far below softening[5][13]
Fatigue / repeated-flex resistance1–5Not documentedModerate[5]
Elasticity / flexibility1–5Rigid[1]Rigid[5]
Thermal Properties
Glass transition (Tg)°CNot documented100 (DSC)[5]
Melting point / Vicat°CNot documentedAmorphous — no melting point[5]
Continuous service temperature°CNot documentedBounded by a glass transition of 100 °C; no loaded-bar service figure is published for HIPS[5]
Flammability / UL 94Not documentedFlammable; no UL 94 rating published[5]
Environment & Chemical
UV resistance1–5Not documentedMonths outdoors before embrittlement — polystyrene yellows and chalks under UV[18]
Chemical resistanceNot documentedDissolves completely in d-limonene — the basis of its use as a soluble support[6]
Food contactNot documentedNot food safe[18]
Biodegradability / compostabilityNot documentedNot biodegradable[18]
RecyclabilityNot documentedNot accepted in household plastic collection[18]
Electrical & ESD propertiesConductive rather than dissipative — Proto-pasta sells the grade as electrically conductive composite PLA[1]Surface resistance above 10¹³ ohm/sq — insulating (ASTM D257)[5]
Health & Safety
Fume toxicity1–5Low hazard — minimal VOC and particle emission; none of these materials was in the chamber study[19]High — hazardous VOC such as styrene; enclosure and filtration needed[19]
VOC emission rateµg/minNot documented12–113 styrene, the range measured across ABS and the one HIPS filament tested[19]
Ultrafine-particle emission rateparticles/minNot documented≈4 × 10⁹ median for the HIPS filament tested, an order of magnitude below ABS but forty times PLA[19]
Hazardous species emittedNot documentedStyrene was the only dominant VOC identified for the HIPS filament tested[19]
Ventilation / filtration requirement1–5Open a window / occasional ventilation[19]Enclosure with carbon and HEPA filtration[19]
Dust & fibre handling hazardConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1]Not documented
Post-Processing
Sanding & machiningNot documentedSands and paints readily, like ABS[18]
Gluing & solvent weldingNot documentedSolvent-welds with d-limonene, and with acetone via its polystyrene backbone[13][6]
Vapour / chemical smoothingNot documentedd-limonene attacks the surface; acetone smoothing is far less effective than on ABS[6][13]
Support material pairingNot documentedUsed as the support material itself — dissolves in d-limonene, or breaks away from ABS and ASA[6]
Solvents & Solubility
Soluble inChloroform dissolves PLA-based grades, leaving the carbon black; TPU-based grades need DMF, NMP or THF. Laboratory reagents.[20][21]d-limonene, 12–24 h submerged with occasional agitation; acetone also dissolves it, and xylene does so at 23 °C.[22][23][24]
Softened or crazed byAcetone and ethyl acetate plasticise a PLA-based grade; a TPU-based grade swells in toluene, esters and alcohols.[20][21]Limonene also disrupts layer adhesion in some ABS and ASA grades, so an ABS model can flake apart in the same bath.[25]
Solvent welding & smoothing agentNone — neither PLA nor TPU has a workshop-safe welding or smoothing solvent.[20][21]Limonene welds and lightly etches it; acetone welds through the polystyrene backbone but smooths less well than ABS.[22][25]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Electrically Conductive Composite PLA — product page and technical data Proto-pasta · 2026-08 · tds
  2. Recreus product catalogue Recreus · 2026-08 · vendor
  3. Eel 3D Printing Filament Technical Specifications NinjaTek · 2026-08 · tds
  4. Koltron G1 Technical Data Sheet add:north · 2026-08 · tds
  5. 3DXMAX HIPS Technical Data Sheet 3DXTech · 2026-08 · tds
  6. 3DXMAX HIPS — product page 3DXTech · 2026-08 · vendor
  7. Proto-pasta product catalogue Proto-pasta · 2026-08 · vendor
  8. Eel product page — durometer, print guidelines and price NinjaTek · 2026-08 · vendor
  9. add:north Koltron G1 product page add:north · 2026-08 · vendor
  10. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  11. Push Plastic product catalogue Push Plastic · 2026-08 · vendor
  12. YXPOLYER HIPS product page YXPOLYER · 2026-08 · vendor
  13. HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  14. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  15. ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  16. Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
  17. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  18. ABS — material basics Polymaker Wiki · 2026-08 · doc
  19. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  20. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  21. Elastollan — Chemical properties: swelling and chemical resistance BASF · 2026-08 · tds
  22. D-Limonene — FDM post-processing guide Filament2Print · 2026-08 · review
  23. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  24. US 5,278,282 Polymer recycling by selective dissolution — xylene dissolution temperatures Nauman & Lynch, Rensselaer Polytechnic Institute · 1994-01 · paper
  25. HIPS — Knowledge Base Prusa Research · 2026-08 · doc