3D Printing Info

Filament comparison

ABS vs PC-ESD

Compare printing settings, strength, heat resistance, dated prices and sources.

ABS guideESD-safe PC guide

2 selected · all documented properties

Open these two in the interactive comparisonMore ABS comparisonsMore PC-ESD comparisons
ABS vs PC-ESD — documented properties and sources
PropertyABSABSESD-safe PCPC
Market snapshot
Listing priceUSD/kg; dated snapshots$19.99/kg median; $11.99–$45.00/kg across 16 dated product listings$180.00/kg median; $180.00–$180.00/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryAcrylonitrile butadiene styrene — a styrenic terpolymer with a butadiene rubber phase[1][2]Polycarbonate compounded with a conductive filler for static-dissipative parts[3]
Densityg/cm³1.04 (Polymaker PolyLite ABS and ABS Pro) to 1.06 (ABS Max), ISO 1183; Bambu Lab 1.05[4][1][5][6]1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[3][7]
Typical priceUSD/kg1 kg spools cluster near 20[8][9][10][11][12]1 kg-equivalent spools cluster near 180[13]
Price range across brandsUSD/kg12–45 across brands; IEMAI 12, SUNLU 12 at a 3 kg minimum, ELEGOO 15 in a 5 kg pack, Polymaker 19, YXPOLYER 20, Bambu Lab 20, Push Plastic 25, 3DXTech 45[8][9][13][14][10][11][12][15]180 at 3DXTech's 750 g pricing — the most expensive material in this group[13]
Market availability1–5Ubiquitous, every brand and retailer[8][9][13][14]Special order, 1–2 makers worldwide[13]
Spool sizes & diameters1.75 and 2.85 mm; 1, 5 and 10 kg spools[13][14]1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[13]
Typical applicationsEnclosures, automotive interior parts and tooling that must hold shape above PLA's 55 °C ceiling[1][16]Electronics fixtures and trays that need PC heat resistance and static dissipation together[3]
Printing Parameters
Nozzle temperature°C240–270 (Bambu Lab); 245–265 (Polymaker PolyLite)[4][1]Not documented
Bed temperature°C80–100 (Bambu Lab); 90–100 (Polymaker)[4][1]Not documented
Enclosure / chamber requirement1–5Enclosure recommended — Polymaker calls a chamber needed at ambient temperature, Bambu Lab requires an enclosed printer and rules out its P1P and A-series machines[1][17]Enclosure required (passive)[17][18]
Recommended chamber temperature°C45–60 (Bambu Lab)[4]Not documented
Part cooling fan0–80 % (Bambu Lab); off (Polymaker PolyLite)[4][1]Not documented
Bed surface & adhesion aidClean the plate and apply glue — Bambu Lab lists glue as the way to improve adhesion and prevent warping[17]PEI with a glue stick or a commercial adhesive[19]
Maximum volumetric flow (mm³/s; see test conditions)mm³/s10–16 (PrusaSlicer guidance for ABS/ASA)[20]Not documented
Warping tendency1–5High — enclosure needed for reliable large parts; Bambu Lab attributes surface cracking to cooling stress exceeding interlayer adhesion[17]Severe — heated chamber needed[17][18]
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[17]Needs a specific surface plus adhesive[19][21]
Stringing / oozing tendency1–5Slight[1]Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[21]
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile[17][1]Advanced — enclosure, hardware upgrades, tuning[17]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[17]Hardened steel required[3]
Abrasiveness1–5Non-abrasive[17]Moderately abrasive — conductive carbon filler[3]
Nozzle clog risk1–5Low — no special hot-end required and clogging is not among the listed drawbacks; Prusa lists no drybox and no hardened nozzle[22][23]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[24]
Heat-creep / jam sensitivity1–5Slightly sensitive[22]Slightly sensitive[19]
Hotend requirementNo special hot-end required[22]All-metal hot end required (Simplify3D)[19]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Moderate — 0.65 % saturated at 25 °C / 55 % RH (Bambu Lab); Polymaker measures 0.51 % maximum uptake for ABS Pro[4][5]Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[25][26][24]
Equilibrium moisture content at ~50 % RH%0.65 saturated at 25 °C / 55 % RH (Bambu Lab); 0.51 maximum (Polymaker ABS Pro)[4][5]Not documented
Drying temperature & time80 °C for 8 h (Bambu Lab); 70 °C for 6 h (Polymaker)[4][1]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing, rough surface and weak layers[27]Bubbling and popping at the nozzle, stringing and a rough surface[27]
Effect of moisture on strengthPolymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures; the loss appears as poor layer adhesion and surface defects rather than a stated strength delta[27]No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[21][27]
Storage requirementSealed with desiccant; Polymaker rates ABS moderate-sensitivity and advises periodic drying in humid climates[27]Airtight containers with desiccant to prevent reabsorption[21]
Mechanical Properties
Tensile strength (XY)MPa33 ± 3 (Bambu Lab) to 35 (Polymaker ABS Pro and Max) printed XY, ISO 527; 3DXTech quotes 42 at break[4][5][6][28]68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[3][29][7]
Young's modulusMPa2200 ± 190 (Bambu Lab) to 2330 (Polymaker ABS Pro) printed XY, ISO 527; 3DXTech quotes 1950[4][5][28]2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[3][7]
Elongation at break%6.7 (ABS Max) to 10.5 (Bambu Lab) at break, printed XY, ISO 527[4][5][6]6 at break (printed XY, ISO 527), against 14 for the unfilled grade[3][29]
Flexural strengthMPa60 (ABS Pro) to 63 (ABS Max) printed XY, ISO 178; Bambu Lab 62 ± 4; 3DXTech quotes 76[4][5][6][28]95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[3][7]
Flexural modulusMPa1880 ± 110 (Bambu Lab) to 2500 (ABS Max) printed XY, ISO 178[4][6]2310 (printed XY, ISO 178)[3]
Charpy impact, notchedkJ/m²10.5 (ABS Max) and 14.5 (ABS Pro) printed XY, ISO 179, notched; PolyLite ABS 18.0 ± 0.9 and Bambu Lab 21.5 ± 2.2[1][5][6][4]Not documented
Other impact dataCharpy unnotched 39.3 ± 3.6 printed XY (Bambu Lab, ISO 179); notched 21.5 ± 2.2[4]Not documented
Layer adhesion / Z tensileMPa21.9 (ABS Pro) to 29.7 (PolyLite) printed Z, ISO 527; Bambu Lab 28 ± 2[4][1][5]32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[7]
Brittleness1–5Tough — absorbs impact, yields before breaking[4][1]Moderate[3]
Hardness (scale-specific)Shore A / Shore D / RockwellNot documentedRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[30]
Creep resistance / sustained load1–5Moderate — no printed-ABS creep test found; Tg of 101–126 °C keeps room-temperature service far below softening, unlike PLA[1][5][6]Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[31][7]
Fatigue / repeated-flex resistance1–5Moderate — no printed-ABS S-N curve found; 10.5 % elongation and 21.5 kJ/m² notched Charpy give far more cyclic tolerance than PLA[4][32]Not documented
Elasticity / flexibility1–5Rigid[4]Rigid[3]
Z strength as % of XY%85 (Bambu Lab, printed Z against XY tensile); 63 for Polymaker ABS Pro[4][5]68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[7]
Thermal Properties
HDT at 0.45 MPa°C87 (Bambu Lab) to 118 (Polymaker ABS Max), ISO 75 at 0.45 MPa; PolyLite ABS 100[4][1][6]143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[7]
HDT at 1.8 MPa°C84 (Bambu Lab) to 113 (Polymaker ABS Max), ISO 75 at 1.8 MPa; PolyLite ABS 98[4][1][6]140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[7]
Glass transition (Tg)°C101 (PolyLite) to 126 (ABS Max), DSC; 105 quoted by 3DXTech[1][6][28]143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[3][7]
Melting point / Vicat°CAmorphous — no melting point; Vicat 104 (PolyLite) to 127 (ABS Max), ISO 306[1][6]Not documented
Continuous service temperature°C101 measured on a loaded glass-filled ABS bar (My Tech Fun); unfilled ABS is bounded by its 84–98 °C heat deflection[33][4][1]113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[26]
Annealing responseDecomposition above 380 °C (PolyLite ABS, TGA)[1]Not documented
Thermal expansion (CTE)µm/m·K86 ± 3 at 0° and 89 ± 3 at 90° raster (printed, fibre Bragg grating, 25–50 °C); 82 for a neat large-format bead at 30 °C[34][35]68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[30]
Flammability / UL 94Flammable; no UL 94 rating published for standard ABS, though V-0 grades exist[36][4]Not documented
Environment & Chemical
UV resistance1–5Months outdoors before embrittlement[16]Not documented
Chemical resistanceGood against weak acids, weak alkalis, oils and grease; poor against strong acids; dissolved by acetone[1]Withstands oils, solvents and fuels; Polymaker rates it good against weak acids[21]
Water / humidity resistance in service1–5Good — minor absorption[4]Not documented
Food contactNot food safe — Polymaker cites potential chemical leaching[16]Bisphenol-A polycarbonate is not offered as food-contact filament[21]
Biodegradability / compostabilityNot biodegradable[16]Not biodegradable[21]
RecyclabilityMechanically recyclable as resin code 9, but not accepted in household plastic collection[16]Mechanically recyclable but not accepted in household plastic collection[21]
Electrical & ESD propertiesSurface resistance above 10¹³ ohm/sq — insulating (3DXTech, ASTM D257)[28]Surface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[3][29]
Health & Safety
Fume toxicity1–5High — hazardous VOC such as styrene; enclosure and filtration needed[37][17]Moderate — measurable VOCs and UFPs, ventilation advised[37]
VOC emission rateµg/min12–113 styrene, the dominant VOC from every ABS and HIPS combination tested[37]Not documented
Ultrafine-particle emission rateparticles/min2 × 10¹⁰ to 9 × 10¹⁰ median across all ABS printers, two orders of magnitude above PLA's ≈1 × 10⁸[37]≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[37]
Hazardous species emittedStyrene dominates. Bambu Lab states ABS and ASA release harmful gases such as styrene at printing temperature, which can be toxic and cause dizziness or nausea[37][17]Not documented
Ventilation / filtration requirement1–5Enclosure with carbon and HEPA filtration — an enclosure alone cut measured UFP by only about 35 %[37][17]Ventilated room or enclosure recommended[37][17]
Dust & fibre handling hazardNot documentedConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[3]
Post-Processing
Sanding & machiningSands well and takes filler; the usual preparation before painting[16]Sands and machines well; the toughness means it cuts rather than chips[19]
Gluing & solvent weldingSolvent-welds with acetone[1]Cyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[19]
Vapour / chemical smoothingAcetone vapour smoothing works — ABS dissolves in acetone[1]No practical vapour smoothing[19]
Support material pairingHIPS breaks away or dissolves in d-limonene; Bambu Lab sells a dedicated Support for ABS[38][17]Prints its own supports; 3DXTech sells a dedicated PC break-away support[19]
Dimensional accuracy & detailWarping and cooling-stress cracking are the accuracy limits, not shrinkage of the melt[17]Not documented
Solvents & Solubility
Soluble inAcetone dissolves it — the basis of ABS slurry; so do MEK, THF, ethyl acetate, chloroform, dichloromethane and toluene.[39][1]Dichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[40]
Softened or crazed byPetrol and perchloroethylene soften it and benzene attacks it; d-limonene disrupts layer adhesion in some ABS and ASA grades.[39][41]Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[40]
Solvent welding & smoothing agentAcetone: about 20 min of vapour at 80 °C over 5 mm of liquid. Prusa measured layer adhesion more than doubled.[42]Dichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[43]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. PolyLite ABS Technical Data Sheet (V5.5 served at this URL) Polymaker · 2024-11 · tds
  2. Safety Data Sheet SDS20250724B00 — Bambu ABS Bambu Lab · 2025-07 · msds
  3. 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
  4. Bambu Filament Technical Data Sheet V3.0 — ABS Bambu Lab · 2026-08 · tds
  5. Polymaker ABS Pro Technical Data Sheet V1 (2026-05-29) Polymaker · 2026-05 · tds
  6. Polymaker ABS Max Technical Data Sheet V1.1 (2026-06-01) Polymaker · 2026-06 · tds
  7. PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
  8. ABS — product page Bambu Lab US Store · 2026-08 · vendor
  9. Polymaker product catalogue Polymaker · 2026-08 · vendor
  10. Push Plastic product catalogue Push Plastic · 2026-08 · vendor
  11. SUNLU ABS 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
  12. IEMAI ABS 3D Printing Filament product page IEMAI 3D · 2026-08 · vendor
  13. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  14. ELEGOO product catalogue ELEGOO · 2026-08 · vendor
  15. YXPOLYER ABS Squirrel Grey product page YXPOLYER · 2026-08 · vendor
  16. ABS — material basics Polymaker Wiki · 2026-08 · doc
  17. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  18. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  19. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  20. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  21. PC — material basics Polymaker Wiki · 2026-08 · doc
  22. ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  23. Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
  24. 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
  25. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  26. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  27. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  28. 3DXMAX ABS Technical Data Sheet 3DXTech · 2026-08 · tds
  29. ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
  30. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  31. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  32. Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
  33. ABS-GF vs PET-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  34. Characterization of Thermal Expansion Coefficient of 3D Printing Polymeric Materials Using Fiber Bragg Grating Sensors Materials 17(18):4668 · 2024-09 · paper
  35. Effects of Fiber Orientation on the Coefficient of Thermal Expansion of Fiber-Filled Polymer Systems in Large Format Polymer Extrusion-Based Additive Manufacturing Materials 15(8):2764 · 2022-04 · paper
  36. Firewire Flame Retardant ABS Technical Data Sheet 3DXTech · 2026-08 · tds
  37. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  38. HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  39. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  40. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  41. HIPS — Knowledge Base Prusa Research · 2026-08 · doc
  42. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  43. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds