3D Printing Info

Filament comparison

ABS+ vs PC-ESD

Compare printing settings, strength, heat resistance, dated prices and sources.

2 selected · all documented properties

ABS+ vs PC-ESD — documented properties and sources
PropertyABS+ / Tough ABSABSESD-safe PCPC
Market snapshot
Listing priceUSD/kg; dated snapshots$26.49/kg median; $15.99–$29.99/kg across 4 dated product listings$180.00/kg median; $180.00–$180.00/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryABS reformulated for lower warping and a higher glass transition; Polymaker's ABS Pro and ABS Max reach Tg 114.9 and 126.3 °C against 101 °C for PolyLite ABS[1][2][3]Polycarbonate compounded with a conductive filler for static-dissipative parts[4]
Densityg/cm³1.04 (ABS Pro) and 1.06 (ABS Max), ISO 1183[1][2]1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[4][5]
Typical priceUSD/kg1 kg spools cluster near 27[6]1 kg-equivalent spools cluster near 180[7]
Price range across brandsUSD/kg16–30 across brands; SUNLU E-ABS 16, Polymaker ABS Pro 25, YXPOLYER ABS Enhanced 28, Polymaker ABS Max 30[6][8][9]180 at 3DXTech's 750 g pricing — the most expensive material in this group[7]
Market availability1–5Available from several mainstream brands[6]Special order, 1–2 makers worldwide[7]
Spool sizes & diameters1.75 and 2.85 mm; 1 kg spools[6]1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[7]
Typical applicationsLarge enclosure and automotive parts where plain ABS warps or softens too early[1][2]Electronics fixtures and trays that need PC heat resistance and static dissipation together[4]
Printing Parameters
Nozzle temperature°C270–290 (ABS Pro); 270–300 (ABS Max) — 25–35 °C above plain ABS[1][2]Not documented
Bed temperature°C120 (ABS Max)[2]Not documented
Enclosure / chamber requirement1–5Enclosure required (passive)[1][2][10]Enclosure required (passive)[10][11]
Bed surface & adhesion aidClean the plate and apply glue; Simplify3D also lists Kapton tape and ABS slurry[10][12]PEI with a glue stick or a commercial adhesive[13]
Maximum volumetric flow (mm³/s; see test conditions)mm³/sUp to 250 mm/s (ABS Pro) and 200 mm/s (ABS Max), equivalent to 20 and 16 on a 0.4 mm nozzle at 0.2 mm layer[1][2][14]Not documented
Warping tendency1–5High — enclosure needed for reliable large parts[10]Severe — heated chamber needed[10][11]
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[10]Needs a specific surface plus adhesive[13][15]
Stringing / oozing tendency1–5Slight — Polymaker advises 1–2 mm retraction at 20–30 mm/s[16]Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[15]
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile; the hotter nozzle rules out PTFE-lined hotends[1][2]Advanced — enclosure, hardware upgrades, tuning[10]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[10]Hardened steel required[4]
Abrasiveness1–5Non-abrasive[10]Moderately abrasive — conductive carbon filler[4]
Nozzle clog risk1–5Low — unfilled ABS compound; no special hot-end required and clogging is not among the listed drawbacks[12][17]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[18]
Heat-creep / jam sensitivity1–5Slightly sensitive[12]Slightly sensitive[13]
Hotend requirementNo special hot-end required[12]All-metal hot end required (Simplify3D)[13]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Moderate — 0.51 % maximum water absorption (ABS Pro)[1]Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[19][20][18]
Equilibrium moisture content at ~50 % RH%0.51 maximum water absorption (Polymaker ABS Pro)[1]Not documented
Drying temperature & time70 °C for 6 h (ABS Max)[2]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[21]Bubbling and popping at the nozzle, stringing and a rough surface[21]
Effect of moisture on strengthPolymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures[21]No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[15][21]
Storage requirementSealed with desiccant; Polymaker rates ABS moderate-sensitivity[21]Airtight containers with desiccant to prevent reabsorption[15]
Mechanical Properties
Tensile strength (XY)MPa34.9 (ABS Pro) and 35.7 (ABS Max) printed XY, ISO 527[1][2]68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[4][22][5]
Young's modulusMPa2330 (ABS Pro) and 2320 (ABS Max) printed XY, ISO 527[1][2]2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[4][5]
Elongation at break%6.7 (ABS Max) and 7.3 (ABS Pro) at break, printed XY, ISO 527[1][2]6 at break (printed XY, ISO 527), against 14 for the unfilled grade[4][22]
Flexural strengthMPa60.1 (ABS Pro) and 63.3 (ABS Max) printed XY, ISO 178[1][2]95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[4][5]
Flexural modulusMPa2330 (ABS Pro) and 2500 (ABS Max) printed XY, ISO 178[1][2]2310 (printed XY, ISO 178)[4]
Charpy impact, notchedkJ/m²10.5 (ABS Max) and 14.5 (ABS Pro) printed XY, ISO 179, notched[1][2]Not documented
Layer adhesion / Z tensileMPa21.9 (ABS Pro) and 25.4 (ABS Max) printed Z, ISO 527[1][2]32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[5]
Brittleness1–5Tough — absorbs impact, yields before breaking[1][2]Moderate[4]
Hardness (scale-specific)Shore A / Shore D / RockwellNot documentedRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[23]
Creep resistance / sustained load1–5Moderate — no creep test found; Tg of 115 °C (ABS Pro) and 126 °C (ABS Max) keeps room-temperature service far below softening[1][2]Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[24][5]
Fatigue / repeated-flex resistance1–5Moderate — no S-N curve found; 6.7–7.3 % elongation and 10.5–14.5 kJ/m² notched Charpy, below unfilled Bambu Lab ABS[1][2][25]Not documented
Elasticity / flexibility1–5Rigid[1]Rigid[4]
Z strength as % of XY%63 (ABS Pro) and 71 (ABS Max), printed[1][2]68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[5]
Thermal Properties
HDT at 0.45 MPa°C106.4 (ABS Pro) and 118.1 (ABS Max), ISO 75 at 0.45 MPa[1][2]143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[5]
HDT at 1.8 MPa°C101.4 (ABS Pro) and 113.1 (ABS Max), ISO 75 at 1.8 MPa[1][2]140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[5]
Glass transition (Tg)°C114.9 (ABS Pro) and 126.3 (ABS Max), DSC[1][2]143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[4][5]
Melting point / Vicat°CAmorphous — no melting point; Vicat 116.1 (ABS Pro) and 127.4 (ABS Max), ISO 306[1][2]Not documented
Continuous service temperature°CNot documented113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[20]
Thermal expansion (CTE)µm/m·K86–89 for printed unfilled ABS (fibre Bragg grating, 25–50 °C); no grade-specific measurement published[26]68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[23]
Environment & Chemical
UV resistance1–5Months outdoors before embrittlement[16]Not documented
Chemical resistanceGood against weak acids, weak alkalis, oils and grease; dissolved by acetone[3]Withstands oils, solvents and fuels; Polymaker rates it good against weak acids[15]
Food contactNot food safe — Polymaker cites potential chemical leaching[16]Bisphenol-A polycarbonate is not offered as food-contact filament[15]
Biodegradability / compostabilityNot biodegradable[16]Not biodegradable[15]
RecyclabilityMechanically recyclable but not accepted in household plastic collection[16]Mechanically recyclable but not accepted in household plastic collection[15]
Electrical & ESD propertiesNot documentedSurface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[4][22]
Health & Safety
Fume toxicity1–5High — hazardous VOC such as styrene; enclosure and filtration needed[27][10]Moderate — measurable VOCs and UFPs, ventilation advised[27]
VOC emission rateµg/min12–113 styrene, the dominant VOC from every ABS and HIPS combination tested[27]Not documented
Ultrafine-particle emission rateparticles/min2 × 10¹⁰ to 9 × 10¹⁰ median across all ABS printers, two orders of magnitude above PLA's ≈1 × 10⁸[27]≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[27]
Hazardous species emittedStyrene dominates. Bambu Lab states ABS and ASA release harmful gases such as styrene at printing temperature, which can be toxic and cause dizziness or nausea[27][10]Not documented
Ventilation / filtration requirement1–5Enclosure with carbon and HEPA filtration — an enclosure alone cut measured UFP by only about 35 %[27][10]Ventilated room or enclosure recommended[27][10]
Dust & fibre handling hazardNot documentedConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[4]
Post-Processing
Sanding & machiningSands well and takes filler before painting[16]Sands and machines well; the toughness means it cuts rather than chips[13]
Painting & finishingPaints readily after light abrasion[16]Not documented
Gluing & solvent weldingNot documentedCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[13]
Vapour / chemical smoothingAcetone vapour smoothing works[3]No practical vapour smoothing[13]
Support material pairingHIPS breaks away or dissolves in d-limonene; Bambu Lab sells a dedicated Support for ABS[28][10]Prints its own supports; 3DXTech sells a dedicated PC break-away support[13]
Solvents & Solubility
Soluble inAcetone dissolves it — the basis of ABS slurry; so do MEK, THF, ethyl acetate, chloroform, dichloromethane and toluene.[29][3]Dichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[30]
Softened or crazed byPetrol and perchloroethylene soften it and benzene attacks it; d-limonene disrupts layer adhesion in some ABS and ASA grades.[29][31]Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[30]
Solvent welding & smoothing agentAcetone: about 20 min of vapour at 80 °C over 5 mm of liquid. Prusa measured layer adhesion more than doubled.[32]Dichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[33]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Polymaker ABS Pro Technical Data Sheet V1 (2026-05-29) Polymaker · 2026-05 · tds
  2. Polymaker ABS Max Technical Data Sheet V1.1 (2026-06-01) Polymaker · 2026-06 · tds
  3. PolyLite ABS Technical Data Sheet (V5.5 served at this URL) Polymaker · 2024-11 · tds
  4. 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
  5. PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
  6. Polymaker product catalogue Polymaker · 2026-08 · vendor
  7. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  8. SUNLU E-ABS (Easy ABS) 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
  9. YXPOLYER ABS Enhanced product page YXPOLYER · 2026-08 · vendor
  10. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  11. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  12. ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  13. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  14. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  15. PC — material basics Polymaker Wiki · 2026-08 · doc
  16. ABS — material basics Polymaker Wiki · 2026-08 · doc
  17. Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
  18. 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
  19. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  20. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  21. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  22. ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
  23. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  24. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  25. Bambu Filament Technical Data Sheet V3.0 — ABS Bambu Lab · 2026-08 · tds
  26. Characterization of Thermal Expansion Coefficient of 3D Printing Polymeric Materials Using Fiber Bragg Grating Sensors Materials 17(18):4668 · 2024-09 · paper
  27. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  28. HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  29. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  30. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  31. HIPS — Knowledge Base Prusa Research · 2026-08 · doc
  32. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  33. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds