Filament comparison
ABS-FR vs PSU
Compare printing settings, strength, heat resistance, dated prices and sources.
2 selected · all documented properties
| Property | Flame-retardant ABS (FR-ABS)ABS | PSUHIGHTEMP |
|---|---|---|
| Market snapshot | ||
| Listing priceUSD/kg; dated snapshots | $52.00/kg median; $44.99–$120.00/kg across 5 dated product listings | $168.00/kg median; $168.00–$168.00/kg across 1 dated product listings |
| Identity & Market | ||
| Base polymer / chemistry | ABS with a flame-retardant package; 3DXTech rates the base resin UL 94 V-0[1] | Polysulfone — the lowest-temperature and cheapest of the sulfone family[2] |
| Densityg/cm³ | 1.18 (ISO 1183) — above unfilled ABS at 1.05 because of the retardant loading[1][3] | 1.24 (ISO 1183)[2] |
| Typical priceUSD/kg | 1 kg-equivalent spools span 45–120; the middle of the market is about 52[4][5][6][7] | 1 kg-equivalent spools cluster near 250[4] |
| Price range across brandsUSD/kg | 45–120 across brands; SUNLU 45, YXPOLYER 50, Coex 3D 52, 3DXTech 107 at 750 g pricing; the FR PC/ABS grade runs 120[4][5][6][7] | 168-250 across formats; 250 g spool $42 (168/kg), 500 g $125 (250/kg) — 3DXTech is the only filament supplier found[4] |
| Market availability1–5 | Niche, a handful of specialist brands[4] | Special order, 1–2 makers worldwide[4] |
| Spool sizes & diameters | 1.75 and 2.85 mm; 750 g spools[4] | 1.75 mm; 250 g and 500 g spools[4] |
| Typical applications | Electrical enclosures and transport interiors that must meet a flammability rating[1] | Transparent high-temperature housings, medical trays and hot-water fittings[2] |
| Printing Parameters | ||
| Bed temperature°C | Not documented | 120–140 (3DXTech)[2] |
| Enclosure / chamber requirement1–5 | Enclosure recommended[8] | Actively heated chamber required[9][10] |
| Bed surface & adhesion aid | Clean the plate and apply glue; Simplify3D also lists Kapton tape and ABS slurry[8][11] | Not documented |
| Warping tendency1–5 | High — enclosure needed for reliable large parts[8] | Not documented |
| Bed-adhesion difficulty1–5 | Needs a specific surface plus adhesive[8] | Not documented |
| Stringing / oozing tendency1–5 | Slight — Polymaker advises 1–2 mm retraction at 20–30 mm/s[12] | Not documented |
| Overall printing difficulty1–5 | Intermediate — dry filament and a tuned profile[8] | Expert / industrial hardware only[9][10] |
| Hardware Wear & Reliability | ||
| Nozzle hardness required1–4 | Brass fine indefinitely[8] | Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[9] |
| Abrasiveness1–5 | Non-abrasive[1] | Non-abrasive when unfilled[2] |
| Nozzle clog risk1–5 | Low — 3DXTech lists no special nozzle concerns and no minimum layer height for its FR-ABS, only an 80 °C pre-dry[13] | Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[14] |
| Heat-creep / jam sensitivity1–5 | Slightly sensitive[11] | Not documented |
| Hotend requirement | No special hot-end required[11] | Not documented |
| Moisture Behaviour | ||
| Moisture absorption (hygroscopicity)1–5 | Moderate — the ABS matrix takes up 0.51–0.65 % saturated at 25 °C / 55 % RH and 3DXTech specifies a 80 °C, 4 h pre-dry[3][15][13] | Not documented |
| Equilibrium moisture content at ~50 % RH% | Not documented | 0.30 in 24 h on extruded stock (ASTM D570)[16] |
| Symptoms when wet | Bubbling and popping at the nozzle, stringing and a rough surface[17] | Not documented |
| Effect of moisture on strength | Polymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam in the hotend and shows as bubbling and poor layer adhesion[17] | No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[14] |
| Storage requirement | Sealed with desiccant; Polymaker rates ABS moderate-sensitivity[17] | Not documented |
| Mechanical Properties | ||
| Tensile strength (XY)MPa | 45 at break (printed XY, ISO 527)[1] | 52 (printed XY, ISO 527, 3DXTech); 81 at break on extruded stock (ASTM D638)[2][16] |
| Young's modulusMPa | 1990 (printed XY, ISO 527)[1] | 2100 (printed XY, ISO 527)[2] |
| Elongation at break% | 4 at break (printed XY, ISO 527) — well below the 10 % of unfilled 3DXTech ABS[1][18] | 8 (printed XY, ISO 527) against 50 on extruded stock — nearly three times PPSU's printed 3 %[2][19][16] |
| Flexural strengthMPa | 80 (printed XY, ISO 178)[1] | 87 (printed XY, ISO 178)[2] |
| Flexural modulusMPa | 2250 (printed XY, ISO 178)[1] | 2050 (printed XY, ISO 178)[2] |
| Other impact data | Not documented | Izod notched 69 J/m on extruded PSU stock, converted from 1.3 ft-lb/in (ASTM D256)[16] |
| Brittleness1–5 | Moderate — elongation at break falls to 4 % from 10 % for the unfilled grade[1][18] | Moderate[2] |
| Hardness (scale-specific)Shore A / Shore D / Rockwell | Not documented | Rockwell M120 on extruded PSU stock (ASTM D785)[16] |
| Creep resistance / sustained load1–5 | Moderate — no creep test found; Tg of 105 °C keeps room-temperature service far below softening[1][18] | Good. Ensinger lists high creep resistance as a headline property of extruded PSU stock, which is rated to 173 °C heat deflection at 1.8 MPa[16] |
| Fatigue / repeated-flex resistance1–5 | Below average — no S-N curve found; elongation at break falls to 4 % against 10 % for unfilled 3DXTech ABS[1][18] | Not documented |
| Elasticity / flexibility1–5 | Rigid[1] | Rigid[2] |
| Thermal Properties | ||
| HDT at 0.45 MPa°C | Not documented | 172 (printed XY, ISO 75 at 0.45 MPa, 3DXTech); 181 on extruded stock, converted from 358 °F at 66 psi[2][16] |
| HDT at 1.8 MPa°C | Not documented | 174 on extruded PSU stock, converted from 345 °F at 264 psi (ASTM D648)[16] |
| Glass transition (Tg)°C | 105 (DSC)[1] | 187 (DSC, 3DXTech) and 185 on extruded stock (ASTM D3418), against 230 for PPSU[2][19][16] |
| Continuous service temperature°C | Not documented | 141 long-term service on extruded PSU stock, converted from 285 °F[16] |
| Thermal expansion (CTE)µm/m·K | Not documented | 55.8 (extruded PSU stock, ASTM D696; source states 3.1e-5 in/in/°F)[16] |
| Flammability / UL 94 | UL 94 V-0 at 1.5 mm, rated on the base resin rather than the printed part[1] | UL 94 V-0 on extruded PSU stock[16] |
| Environment & Chemical | ||
| Chemical resistance | Good against weak acids, weak alkalis, oils and grease; dissolved by acetone[20] | Not documented |
| Food contact | Not food safe — Polymaker cites potential chemical leaching[12] | Not documented |
| Biodegradability / compostability | Not biodegradable[12] | Not documented |
| Recyclability | Mechanically recyclable but not accepted in household plastic collection[12] | Not documented |
| Electrical & ESD properties | Not documented | Surface resistance above 10¹³ ohm/sq — an insulator (IEC 60093)[2] |
| Health & Safety | ||
| Fume toxicity1–5 | High — hazardous VOC such as styrene; enclosure and filtration needed[21][8] | Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[21] |
| VOC emission rateµg/min | 12–113 styrene, the dominant VOC from every ABS and HIPS combination tested[21] | Not documented |
| Ultrafine-particle emission rateparticles/min | 2 × 10¹⁰ to 9 × 10¹⁰ median across all ABS printers, two orders of magnitude above PLA's ≈1 × 10⁸[21] | Not documented |
| Hazardous species emitted | Styrene dominates. Bambu Lab states ABS and ASA release harmful gases such as styrene at printing temperature, which can be toxic and cause dizziness or nausea[21][8] | Not documented |
| Ventilation / filtration requirement1–5 | Enclosure with carbon and HEPA filtration — an enclosure alone cut measured UFP by only about 35 %[21][8] | Ventilated room or enclosure recommended[21] |
| Post-Processing | ||
| Sanding & machining | Sands well and takes filler before painting[12] | Not documented |
| Painting & finishing | Paints readily after light abrasion[12] | Not documented |
| Support material pairing | HIPS breaks away or dissolves in d-limonene; Bambu Lab sells a dedicated Support for ABS[22][8] | Not documented |
| Solvents & Solubility | ||
| Soluble in | Acetone dissolves it — the basis of ABS slurry; so do MEK, THF, ethyl acetate, chloroform, dichloromethane and toluene.[23][20] | Chlorinated hydrocarbons — dichloromethane, chloroform — dissolve polysulfone; ketones and esters attack it as well.[24][23] |
| Softened or crazed by | Petrol and perchloroethylene soften it and benzene attacks it; d-limonene disrupts layer adhesion in some ABS and ASA grades.[23][25] | Acetone, MEK, ethyl acetate, benzene and toluene craze or stress-crack it; methanol and isopropanol only marginally.[23][24] |
| Solvent welding & smoothing agent | Acetone: about 20 min of vapour at 80 °C over 5 mm of liquid. Prusa measured layer adhesion more than doubled.[26] | Dichloromethane cement welds PSU and NMP softens residual resin. Both are laboratory reagents.[24] |
Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- Firewire Flame Retardant ABS Technical Data Sheet 3DXTech · 2026-08 · tds
- ThermaX PSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
- Bambu Filament Technical Data Sheet V3.0 — ABS Bambu Lab · 2026-08 · tds
- 3DXTech product catalogue 3DXTech · 2026-08 · vendor
- SUNLU ABS-FR (ABS Flame Retardant) 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
- YXPOLYER ABS Flame-Retardant product page YXPOLYER · 2026-08 · vendor
- Flame Retardant Black ABS Coex 3D · 2026-08 · vendor
- ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
- Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
- Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
- ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- ABS — material basics Polymaker Wiki · 2026-08 · doc
- FIREWIRE FR-ABS — product page (print recommendations) 3DXTech · 2026-08 · doc
- THERMAX PSU — product page (print recommendations) 3DXTech · 2026-08 · doc
- Polymaker ABS Pro Technical Data Sheet V1 (2026-05-29) Polymaker · 2026-05 · tds
- TECASON S natural (PSU) — stock shape properties Ensinger · 2026-08 · tds
- Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
- 3DXMAX ABS Technical Data Sheet 3DXTech · 2026-08 · tds
- ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
- PolyLite ABS Technical Data Sheet (V5.5 served at this URL) Polymaker · 2024-11 · tds
- Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
- HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
- Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
- HIPS — Knowledge Base Prusa Research · 2026-08 · doc
- Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc