3D Printing Info

Filament comparison

ABS-ESD vs PPSU

Compare printing settings, strength, heat resistance, dated prices and sources.

2 selected · all documented properties

ABS-ESD vs PPSU — documented properties and sources
PropertyESD-safe ABSABSPPSUHIGHTEMP
Market snapshot
Listing priceUSD/kg; dated snapshots$102.50/kg median; $47.00–$166.67/kg across 4 dated product listings$337.40/kg median; $223.00–$732.56/kg across 4 dated product listings
Identity & Market
Base polymer / chemistryABS compounded with a conductive carbon filler for static-dissipative parts[1]Polyphenylsulfone — an amorphous high-temperature sulfone polymer[2]
Densityg/cm³1.09 (ISO 1183)[1]1.28 (ISO 1183, 3DXTech; ASTM D792, Stratasys PPSF)[2][3]
Typical priceUSD/kg1 kg-equivalent spools span 47–167; the middle of the market is about 103[4][5][6]1 kg-equivalent spools span 223–733; the middle of the market is about 425[4][7][8][9]
Price range across brandsUSD/kg47–167 across brands; IEMAI 47, YXPOLYER 65, 3DXTech 140 at 750 g pricing; the EMI-shielding ABS grade runs 167[4][5][6]223-733 across brands; IEMAI 3D 223 at 1 kg, 3DXTech ThermaX PPSU 250 at 500 g, 3D4Makers 425 at 750 g, Kimya PPSU-S 733 at 500 g[4][7][8][9]
Market availability1–5Niche, a handful of specialist brands[4]Niche, a handful of specialist brands[4][7][8]
Spool sizes & diameters1.75 and 2.85 mm; 750 g spools[4]1.75 and 2.85 mm; 200 g to 750 g spools[4][7][8]
Typical applicationsElectronics handling fixtures, trays and jigs used around static-sensitive parts[1]Steam-sterilisable medical and dental tooling, and aircraft interior parts[2]
Printing Parameters
Bed temperature°CNot documented130–150 (3DXTech)[2]
Enclosure / chamber requirement1–5Enclosure recommended[10]Actively heated chamber required[11][12]
Bed surface & adhesion aidClean the plate and apply glue; Simplify3D also lists Kapton tape and ABS slurry[10][13]Not documented
Warping tendency1–5High — enclosure needed for reliable large parts[10]Severe — heated chamber needed[11]
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[10]Not documented
Stringing / oozing tendency1–5Slight — Polymaker advises 1–2 mm retraction at 20–30 mm/s[14]Not documented
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile[10]Expert / industrial hardware only[11][12]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required[1]Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[11]
Abrasiveness1–5Moderately abrasive — conductive carbon filler[1]Non-abrasive when unfilled[2]
Nozzle clog risk1–5Low — 3DXTech lists no special nozzle concerns and no minimum layer height for its ESD-ABS, only an 80 °C pre-dry[15]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[16]
Heat-creep / jam sensitivity1–5Slightly sensitive[13]Not documented
Hotend requirementNo special hot-end required[13]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Moderate — the ABS matrix takes up 0.51–0.65 % saturated at 25 °C / 55 % RH and 3DXTech specifies a 80 °C, 4 h pre-dry[17][18][15]Not documented
Equilibrium moisture content at ~50 % RH%Not documented0.37 in 24 h and 1.1 at saturation on extruded stock (ASTM D570)[19]
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[20]Not documented
Effect of moisture on strengthPolymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam in the hotend and shows as bubbling and poor layer adhesion[20]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[16]
Storage requirementSealed with desiccant; Polymaker rates ABS moderate-sensitivity[20]Not documented
Mechanical Properties
Tensile strength (XY)MPa58 at break (printed XY, ISO 527) — the conductive filler raises strength above the unfilled grade's 42[1][21]55 (printed XY, ISO 527, 3DXTech) and 55 (printed on side long edge, ASTM D638, Stratasys PPSF); 79 at yield on extruded stock[2][3][19]
Young's modulusMPa2130 (printed XY, ISO 527)[1]2100 (printed, ASTM D638, Stratasys PPSF) and 2310 (printed XY, ISO 527, 3DXTech); 2344 on extruded stock[2][3][19]
Elongation at break%4 at break (printed XY, ISO 527)[1]3 (printed, ISO 527 and ASTM D638) against 60 on extruded stock — printing costs PPSU almost all of its ductility[2][3][19]
Flexural strengthMPa80 (printed XY, ISO 178)[1]110 (printed, ISO 178 and ASTM D790, 3DXTech and Stratasys PPSF agree); 91 on extruded stock[2][3][19]
Flexural modulusMPa2275 (printed XY, ISO 178)[1]2200 (printed, ASTM D790, Stratasys PPSF) and 2215 (printed XY, ISO 178, 3DXTech)[2][3]
Other impact dataNot documentedIzod notched 58.7 J/m and unnotched 165.5 J/m (printed, ASTM D256 Method A, Stratasys PPSF); 160 J/m notched on extruded stock[3][19]
Brittleness1–5Moderate[1]Brittle — snaps with little warning[2]
Hardness (scale-specific)Shore A / Shore D / RockwellNot documentedRockwell M86 on printed PPSF (ASTM D785, Stratasys); M96 on extruded PPSU stock (and an unlabelled 123)[3][19]
Creep resistance / sustained load1–5Moderate — no creep test found; Tg of 105 °C keeps room-temperature service far below softening[1]Good. Printed PPSF holds 189 °C heat deflection at 1.8 MPa (ASTM D648) and extruded stock is rated 149 °C long-term service, but Ensinger does not claim the creep resistance it claims for PSU and PPS[3][19]
Fatigue / repeated-flex resistance1–5Below average — no S-N curve found; elongation at break 4 %, well below unfilled ABS[1][21]Not documented
Elasticity / flexibility1–5Rigid[1]Rigid[2]
Thermal Properties
HDT at 0.45 MPa°CNot documented190 (printed XY, ISO 75 at 0.45 MPa, 3DXTech)[2]
HDT at 1.8 MPa°CNot documented189 (printed, ASTM D648 at 264 psi, Stratasys PPSF); 207 on extruded stock, converted from 405 °F[3][19]
Glass transition (Tg)°C105 (DSC)[1]230 (DSC) — the highest glass transition in the dataset[2]
Continuous service temperature°CNot documented149 long-term service on extruded PPSU stock, converted from 300 °F[19]
Thermal expansion (CTE)µm/m·KNot documented55.0 (printed PPSF, ASTM D696; source states 5.5e-5 mm/mm/°C) and 55.8 on extruded stock (ASTM D696, from 3.1e-5 in/in/°F)[3][19]
Flammability / UL 94Not documentedUL 94 V-0 at 1.5 mm, rated on the base resin[2]
Environment & Chemical
Chemical resistanceGood against weak acids, weak alkalis, oils and grease; dissolved by acetone[22]Withstands repeated steam autoclaving, the usual reason to choose PPSU over PSU; Stratasys also lists PPSF as passing 24 h stress-crack exposure to antifreeze, petrol, motor oil, power-steering, transmission and washer fluid at 23 °C and 100 °C[2][3]
Food contactNot food safe — Polymaker cites potential chemical leaching[14]Not documented
Biodegradability / compostabilityNot biodegradable[14]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[14]Not documented
Electrical & ESD propertiesSurface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ABS[1][21]Volume resistivity 5e13 to 1.5e14 ohm-cm and dielectric strength 80-290 V/mil on printed PPSF (ASTM D257, D149)[3]
Health & Safety
Fume toxicity1–5High — hazardous VOC such as styrene; enclosure and filtration needed[23][10]Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[23]
VOC emission rateµg/min12–113 styrene, the dominant VOC from every ABS and HIPS combination tested[23]Not documented
Ultrafine-particle emission rateparticles/min2 × 10¹⁰ to 9 × 10¹⁰ median across all ABS printers, two orders of magnitude above PLA's ≈1 × 10⁸[23]Not documented
Hazardous species emittedStyrene dominates. Bambu Lab states ABS and ASA release harmful gases such as styrene at printing temperature, which can be toxic and cause dizziness or nausea[23][10]Not documented
Ventilation / filtration requirement1–5Enclosure with carbon and HEPA filtration — an enclosure alone cut measured UFP by only about 35 %[23][10]Ventilated room or enclosure recommended[23]
Dust & fibre handling hazardConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1]Not documented
Post-Processing
Sanding & machiningSands well and takes filler before painting[14]Not documented
Painting & finishingPaints readily after light abrasion[14]Not documented
Support material pairingHIPS breaks away or dissolves in d-limonene; Bambu Lab sells a dedicated Support for ABS[24][10]Not documented
Solvents & Solubility
Soluble inAcetone dissolves it — the basis of ABS slurry; so do MEK, THF, ethyl acetate, chloroform, dichloromethane and toluene.[25][22]Dichloromethane dissolves it at 23 °C at every stress level; acetone solvates and softens unstressed PPSU (Solvay ESCR).[26]
Softened or crazed byPetrol and perchloroethylene soften it and benzene attacks it; d-limonene disrupts layer adhesion in some ABS and ASA grades.[25][27]MEK ruptures stressed parts and toluene crazes them above 13.8 MPa; glass-filled grades survive where unfilled craze.[26]
Solvent welding & smoothing agentAcetone: about 20 min of vapour at 80 °C over 5 mm of liquid. Prusa measured layer adhesion more than doubled.[28]Dichloromethane cements PPSU and NMP softens residual resin; both are laboratory reagents, not workshop stock.[26]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. 3DXSTAT ESD-ABS Technical Data Sheet 3DXTech · 2026-08 · tds
  2. ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  3. PPSF (polyphenylsulfone) — FDM Data Sheet Stratasys · 2018-06 · tds
  4. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  5. IEMAI ESD-ABS 3D Printing Filament product page IEMAI 3D · 2026-08 · vendor
  6. YXPOLYER ABS ESD product page YXPOLYER · 2026-08 · vendor
  7. Kimya PPSU-S Natural 1.75 mm 500 g igo3d · 2026-08 · vendor
  8. 3D4Makers product catalogue 3D4Makers · 2026-08 · vendor
  9. IEMAI 3D PPSU 3D Printing Filament — store page IEMAI 3D · 2026-08 · vendor
  10. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  11. Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
  12. Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
  13. ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  14. ABS — material basics Polymaker Wiki · 2026-08 · doc
  15. 3DXSTAT ESD-ABS — product page (print recommendations) 3DXTech · 2026-08 · doc
  16. THERMAX PPSU — product page (print recommendations) 3DXTech · 2026-08 · doc
  17. Bambu Filament Technical Data Sheet V3.0 — ABS Bambu Lab · 2026-08 · tds
  18. Polymaker ABS Pro Technical Data Sheet V1 (2026-05-29) Polymaker · 2026-05 · tds
  19. TECASON P black (PPSU) — stock shape properties Ensinger · 2026-08 · tds
  20. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  21. 3DXMAX ABS Technical Data Sheet 3DXTech · 2026-08 · tds
  22. PolyLite ABS Technical Data Sheet (V5.5 served at this URL) Polymaker · 2024-11 · tds
  23. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  24. HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  25. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  26. Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
  27. HIPS — Knowledge Base Prusa Research · 2026-08 · doc
  28. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc