3D Printing Info

Filament comparison

ABS-ESD vs PLA Silk

Compare printing settings, strength, heat resistance, dated prices and sources.

2 selected · all documented properties

ABS-ESD vs PLA Silk — documented properties and sources
PropertyESD-safe ABSABSSilk PLAPLA
Market snapshot
Listing priceUSD/kg; dated snapshots$102.50/kg median; $47.00–$166.67/kg across 4 dated product listings$19.49/kg median; $9.75–$24.99/kg across 15 dated product listings
Identity & Market
Base polymer / chemistryABS compounded with a conductive carbon filler for static-dissipative parts[1]PLA with a gloss-forming additive package; suppliers publish the composition as polylactic acid only[2]
Densityg/cm³1.09 (ISO 1183)[1]1.27 (ISO 1183)[2]
Typical priceUSD/kg1 kg-equivalent spools span 47–167; the middle of the market is about 103[3][4][5]Mainstream 1 kg spools cluster near 20[6][7][8]
Price range across brandsUSD/kg47–167 across brands; IEMAI 47, YXPOLYER 65, 3DXTech 140 at 750 g pricing; the EMI-shielding ABS grade runs 167[3][4][5]10–25 across brands; CHCKX 10 in a 16-roll bundle, SUNLU 13, LANDU 18, YXPOLYER 20, Polymaker 22, Devil Design 25[9][10][11][12][13]
Market availability1–5Niche, a handful of specialist brands[3]Stocked by most mainstream brands[6][9][14]
Spool sizes & diameters1.75 and 2.85 mm; 750 g spools[3]1.75 mm; 1 and 1.1 kg spools; dual- and tri-colour coextruded variants[15][16]
Typical applicationsElectronics handling fixtures, trays and jigs used around static-sensitive parts[1]Decorative prints where surface gloss matters more than strength[2]
Diameter tolerance± mmNot documented±0.03 (Bambu Lab)[17]
Printing Parameters
Nozzle temperature°CNot documented210–240 — 20 °C above the plain PLA window[2]
Bed temperature°CNot documented35–45[2]
Enclosure / chamber requirement1–5Enclosure recommended[18]Open frame is fine[2][19]
Part cooling fanNot documentedFan on[2]
Bed surface & adhesion aidClean the plate and apply glue; Simplify3D also lists Kapton tape and ABS slurry[18][20]Cool Plate SuperTack, smooth PEI or textured PEI[2]
Warping tendency1–5High — enclosure needed for reliable large parts[18]None[2]
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[18]Sticks to anything[21]
Stringing / oozing tendency1–5Slight — Polymaker advises 1–2 mm retraction at 20–30 mm/s[22]Not documented
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile[18]Easy — minor profile tuning; hotter nozzle and slower cap of 250 mm/s[2]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required[1]Brass fine indefinitely[19]
Abrasiveness1–5Moderately abrasive — conductive carbon filler[1]Non-abrasive[23][19]
Nozzle clog risk1–5Low — 3DXTech lists no special nozzle concerns and no minimum layer height for its ESD-ABS, only an 80 °C pre-dry[24]Very low[19]
Heat-creep / jam sensitivity1–5Slightly sensitive[20]Moderate — good heatbreak cooling needed; PLA softens below 60 °C[25]
Hotend requirementNo special hot-end required[20]No special hot-end required[21]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Moderate — the ABS matrix takes up 0.51–0.65 % saturated at 25 °C / 55 % RH and 3DXTech specifies a 80 °C, 4 h pre-dry[26][27][24]Moderate — 0.40 % saturated at 25 °C / 55 % RH[2]
Equilibrium moisture content at ~50 % RH%Not documented0.40 saturated at 25 °C / 55 % RH (Bambu Lab)[2]
Drying temperature & timeNot documented55 °C for 8 h in a forced-air dryer, or 65–75 °C for 12 h on an X1 heatbed[2][28]
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[29]Bubbling and popping at the nozzle, stringing, rough surface and weak layers[29]
Effect of moisture on strengthPolymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam in the hotend and shows as bubbling and poor layer adhesion[29]Polymaker rates PLA low-sensitivity — the loss shows as poor layer adhesion and brittle layers rather than a published strength figure[29]
Storage requirementSealed with desiccant; Polymaker rates ABS moderate-sensitivity[29]Sealed with desiccant below 20 % RH; shelf life at ambient is long[30][21]
Mechanical Properties
Tensile strength (XY)MPa58 at break (printed XY, ISO 527) — the conductive filler raises strength above the unfilled grade's 42[1][31]33 (printed XY, ISO 527); eSun Silk broke 22 % below the 16-brand PLA mean on identical 4×4 mm bars[2][32]
Young's modulusMPa2130 (printed XY, ISO 527)[1]2130 (printed XY, ISO 527)[2]
Elongation at break%4 at break (printed XY, ISO 527)[1]2.8 (printed XY, ISO 527) — a quarter of PLA Basic at 12.2[2][30]
Flexural strengthMPa80 (printed XY, ISO 178)[1]75 (printed XY, ISO 178)[2]
Flexural modulusMPa2275 (printed XY, ISO 178)[1]2460 (printed XY, ISO 178)[2]
Charpy impact, notchedkJ/m²Not documented10.3 (printed XY, ISO 179, notched); unnotched 18.5[2]
Layer adhesion / Z tensileMPaNot documented25 (printed Z, ISO 527), and flexural Z collapses to 30 against 75 in XY; eSun Silk broke at 12.3 kg where twelve of the 16 plain PLAs managed 44.6–61.5 kg[2][32][33]
Brittleness1–5Moderate[1]Brittle — snaps with little warning[2]
Creep resistance / sustained load1–5Moderate — no creep test found; Tg of 105 °C keeps room-temperature service far below softening[1]Poor — no silk-specific creep data published; plain PLA sagged from 12 to 18.7–20.3 mm over 5 days at 1.25 kg[34][35]
Fatigue / repeated-flex resistance1–5Below average — no S-N curve found; elongation at break 4 %, well below unfilled ABS[1][31]Poor — no grade-specific S-N curve; plain printed PLA ran 38 000–49 000 cycles at 30 % of tensile strength (R = 0.2)[36][25]
Elasticity / flexibility1–5Rigid[1]Rigid[2]
Z strength as % of XY%Not documented76 by tensile, 40 by flexural (printed, Bambu Lab)[2]
Thermal Properties
HDT at 0.45 MPa°CNot documented60 (ISO 75, 0.45 MPa)[2]
HDT at 1.8 MPa°CNot documented56 (ISO 75, 1.8 MPa)[2]
Glass transition (Tg)°C105 (DSC)[1]57 (DSC)[2]
Melting point / Vicat°CNot documented158 peak melt (DSC); Vicat 66 °C[2]
Continuous service temperature°CNot documented50 — a loaded bar begins to move at this temperature (My Tech Fun, eSun eSilk PLA)[33]
Annealing responseNot documented50–55 °C for 6–12 h[2]
Flammability / UL 94Not documentedFlammable; no UL 94 rating published by the major brands[30][37]
Environment & Chemical
UV resistance1–5Not documentedDegrades within weeks outdoors[25][38]
Chemical resistanceGood against weak acids, weak alkalis, oils and grease; dissolved by acetone[39]Good against weak acids, oils and grease; poor against strong acids and alkalis; dissolved by chloroform, THF and hot benzene[37][25]
Water / humidity resistance in service1–5Not documentedGood — insoluble in water[30]
Food contactNot food safe — Polymaker cites potential chemical leaching[22]Base resin is food-contact grade, but printed layer grooves harbour bacteria; Prusa advises against food use[25]
Biodegradability / compostabilityNot biodegradable[22]Industrially compostable only — needs sustained 55 °C; not home compostable[40][25]
RecyclabilityMechanically recyclable but not accepted in household plastic collection[22]Mechanically recyclable; not accepted in household plastic collection[40]
Electrical & ESD propertiesSurface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ABS[1][31]Not documented
Health & Safety
Fume toxicity1–5High — hazardous VOC such as styrene; enclosure and filtration needed[41][18]Low hazard — minimal VOC and particle emission[41]
VOC emission rateµg/min12–113 styrene, the dominant VOC from every ABS and HIPS combination tested[41]Not documented
Ultrafine-particle emission rateparticles/min2 × 10¹⁰ to 9 × 10¹⁰ median across all ABS printers, two orders of magnitude above PLA's ≈1 × 10⁸[41]Not documented
Hazardous species emittedStyrene dominates. Bambu Lab states ABS and ASA release harmful gases such as styrene at printing temperature, which can be toxic and cause dizziness or nausea[41][18]Not documented
Ventilation / filtration requirement1–5Enclosure with carbon and HEPA filtration — an enclosure alone cut measured UFP by only about 35 %[41][18]None needed in a normal room[41]
Dust & fibre handling hazardConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1]Not documented
Post-Processing
Sanding & machiningSands well and takes filler before painting[22]Wet sanding — dry sanding heats the surface by friction and smears it[38][25]
Painting & finishingPaints readily after light abrasion[22]Not documented
Gluing & solvent weldingNot documentedCyanoacrylate for most joints; some grades partially dissolve and bond with acetone[25][42]
Vapour / chemical smoothingNot documentedNo practical vapour smoothing — only chloroform, hot benzene or THF, which are laboratory-only[25]
Support material pairingHIPS breaks away or dissolves in d-limonene; Bambu Lab sells a dedicated Support for ABS[43][18]Support for PLA (Bambu Lab)[2]
Dimensional accuracy & detailNot documented55° overhangs and 30 mm bridges; gloss hides fine detail and is destroyed by sanding[2]
Solvents & Solubility
Soluble inAcetone dissolves it — the basis of ABS slurry; so do MEK, THF, ethyl acetate, chloroform, dichloromethane and toluene.[44][39]Chloroform: 10 % w/v in 2–4 h at 23 °C, every grade and morphology; THF and DMF only at 65 °C. Laboratory reagents.[45]
Softened or crazed byPetrol and perchloroethylene soften it and benzene attacks it; d-limonene disrupts layer adhesion in some ABS and ASA grades.[44][46]Acetone, ethyl acetate and toluene plasticise it but dissolve <1 % even at 65 °C; submersion in acetone crazes and destroys parts.[45][47]
Solvent welding & smoothing agentAcetone: about 20 min of vapour at 80 °C over 5 mm of liquid. Prusa measured layer adhesion more than doubled.[47]Chloroform vapour smooths and welds PLA at the cost of tensile strength; acetone does not smooth it at all.[48][47]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. 3DXSTAT ESD-ABS Technical Data Sheet 3DXTech · 2026-08 · tds
  2. Bambu Filament Technical Data Sheet V1.0 — PLA Silk+ Bambu Lab · 2026-08 · tds
  3. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  4. IEMAI ESD-ABS 3D Printing Filament product page IEMAI 3D · 2026-08 · vendor
  5. YXPOLYER ABS ESD product page YXPOLYER · 2026-08 · vendor
  6. Panchroma Silk PLA collection Polymaker Shop · 2026-08 · vendor
  7. Spectrum PLA Silk — product listing 3DJake International · 2026-08 · vendor
  8. 3DJake ecoPLA Silk Black 1.75mm 1000g 3DJake International · 2026-08 · vendor
  9. Sunlu Silk PLA+ 1.75mm 1kg Sunlu Official Store · 2026-08 · vendor
  10. Bambu Lab PLA Silk 1.75mm 1kg 3D Universe · 2026-08 · vendor
  11. CHCKX 16 Pack Silk Dual Color PLA Filament Bundle CHCKX (Amazon US) · 2026-08 · vendor
  12. YXPOLYER Silk PLA Black&Gold product page YXPOLYER · 2026-08 · vendor
  13. LANDU Silk Tri-Color PLA Filament 1.75 mm 1 kg LANDU (Amazon US) · 2026-08 · vendor
  14. Overture Silk PLA 1.75mm Overture3D · 2026-08 · vendor
  15. eSUN PLA-Silk Magic 1.75mm eSUN Official Store · 2026-08 · vendor
  16. JAYO Silk PLA+ 1.75mm 1.1kg JAYO Official Store · 2026-08 · vendor
  17. PLA Basic — product page Bambu Lab US Store · 2026-08 · vendor
  18. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  19. Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
  20. ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  21. PLA — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  22. ABS — material basics Polymaker Wiki · 2026-08 · doc
  23. Prusament PLA — material page Prusa Polymers · 2026-08 · doc
  24. 3DXSTAT ESD-ABS — product page (print recommendations) 3DXTech · 2026-08 · doc
  25. PLA — material guide Prusa Knowledge Base · 2026-08 · doc
  26. Bambu Filament Technical Data Sheet V3.0 — ABS Bambu Lab · 2026-08 · tds
  27. Polymaker ABS Pro Technical Data Sheet V1 (2026-05-29) Polymaker · 2026-05 · tds
  28. Filament Drying Recommendations Bambu Lab Wiki · 2026-08 · doc
  29. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  30. Bambu Filament Technical Data Sheet V3.0 — PLA Basic Bambu Lab · 2026-08 · tds
  31. 3DXMAX ABS Technical Data Sheet 3DXTech · 2026-08 · tds
  32. 16 PLA brand comparison test — results spreadsheet My Tech Fun (Igor Gaspar) · 2022-10 · test
  33. Testing eSun PLA filaments: PLA-ST vs PLA+ vs Silk PLA My Tech Fun (Igor Gaspar) · 2026-08 · test
  34. BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  35. PolyTerra PLA vs PLA+ — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  36. Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
  37. PolyLite PLA Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  38. Prusament PLA Technical Data Sheet v1.0 Prusa Polymers · 2018-09 · tds
  39. PolyLite ABS Technical Data Sheet (V5.5 served at this URL) Polymaker · 2024-11 · tds
  40. Filamentive PLA (recycled) — product page Filamentive · 2026-08 · vendor
  41. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  42. Prusament rPLA Corn Pigment 1kg — product page Prusa Research · 2026-08 · vendor
  43. HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  44. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  45. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  46. HIPS — Knowledge Base Prusa Research · 2026-08 · doc
  47. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  48. Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper