Filament comparison
ABS-ESD vs PC-ABS
Compare printing settings, strength, heat resistance, dated prices and sources.
2 selected · all documented properties
| Property | ESD-safe ABSABS | PC/ABS blendPC |
|---|---|---|
| Market snapshot | ||
| Listing priceUSD/kg; dated snapshots | $102.50/kg median; $47.00–$166.67/kg across 4 dated product listings | $45.99/kg median; $34.99–$84.00/kg across 5 dated product listings |
| Identity & Market | ||
| Base polymer / chemistry | ABS compounded with a conductive carbon filler for static-dissipative parts[1] | Polycarbonate/ABS alloy — PC stiffness and heat resistance with ABS processability[2][3] |
| Densityg/cm³ | 1.09 (ISO 1183)[1] | 1.10 (Polymaker) and 1.24 (3DXTech FR grade), ISO 1183; Stratasys specific gravity 1.10 (ASTM D792)[2][3][4] |
| Typical priceUSD/kg | 1 kg-equivalent spools span 47–167; the middle of the market is about 103[5][6][7] | 1 kg spools cluster near 50[8][5] |
| Price range across brandsUSD/kg | 47–167 across brands; IEMAI 47, YXPOLYER 65, 3DXTech 140 at 750 g pricing; the EMI-shielding ABS grade runs 167[5][6][7] | 35–84 across brands; Reli3D 35, SUNLU 46, Polymaker 50, 3DXMAX 84[8][5][9][10] |
| Market availability1–5 | Niche, a handful of specialist brands[5] | Available from several mainstream brands[8][5] |
| Spool sizes & diameters | 1.75 and 2.85 mm; 750 g spools[5] | 1.75 and 2.85 mm; 0.5 and 1 kg spools[8][5] |
| Typical applications | Electronics handling fixtures, trays and jigs used around static-sensitive parts[1] | Automotive interior and electronics housings that need PC heat resistance without PC's warping[2] |
| Printing Parameters | ||
| Nozzle temperature°C | Not documented | 250–270 (Polymaker)[2] |
| Bed temperature°C | Not documented | 90–105 (Polymaker)[2] |
| Enclosure / chamber requirement1–5 | Enclosure recommended[11] | Enclosure required (passive) — Polymaker specifies a 90–100 °C chamber[2] |
| Recommended chamber temperature°C | Not documented | 90–100 (Polymaker)[2] |
| Part cooling fan | Not documented | Off (Polymaker)[2] |
| Bed surface & adhesion aid | Clean the plate and apply glue; Simplify3D also lists Kapton tape and ABS slurry[11][12] | PEI with a glue stick or a commercial adhesive[13] |
| Maximum volumetric flow (mm³/s; see test conditions)mm³/s | Not documented | 20 at Polymaker's 250 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[2][14] |
| Warping tendency1–5 | High — enclosure needed for reliable large parts[11] | High — enclosure needed for reliable large parts[2][11] |
| Bed-adhesion difficulty1–5 | Needs a specific surface plus adhesive[11] | Needs a specific surface plus adhesive[13][15] |
| Stringing / oozing tendency1–5 | Slight — Polymaker advises 1–2 mm retraction at 20–30 mm/s[16] | Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[15] |
| Overall printing difficulty1–5 | Intermediate — dry filament and a tuned profile[11] | Advanced — enclosure, hardware upgrades, tuning[2][11] |
| Hardware Wear & Reliability | ||
| Nozzle hardness required1–4 | Hardened steel required[1] | Brass fine indefinitely[11] |
| Abrasiveness1–5 | Moderately abrasive — conductive carbon filler[1] | Non-abrasive[2] |
| Nozzle clog risk1–5 | Low — 3DXTech lists no special nozzle concerns and no minimum layer height for its ESD-ABS, only an 80 °C pre-dry[17] | Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry of 4 h or more[18] |
| Heat-creep / jam sensitivity1–5 | Slightly sensitive[12] | Slightly sensitive[13] |
| Hotend requirement | No special hot-end required[12] | All-metal hot end required (Simplify3D)[13] |
| Moisture Behaviour | ||
| Moisture absorption (hygroscopicity)1–5 | Moderate — the ABS matrix takes up 0.51–0.65 % saturated at 25 °C / 55 % RH and 3DXTech specifies a 80 °C, 4 h pre-dry[19][20][17] | Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h or more pre-dry[21][22][18] |
| Drying temperature & time | Not documented | 75 °C for 6 h (Polymaker)[2] |
| Symptoms when wet | Bubbling and popping at the nozzle, stringing and a rough surface[23] | Bubbling and popping at the nozzle, stringing and a rough surface[23] |
| Effect of moisture on strength | Polymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam in the hotend and shows as bubbling and poor layer adhesion[23] | No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[15][23] |
| Storage requirement | Sealed with desiccant; Polymaker rates ABS moderate-sensitivity[23] | Airtight containers with desiccant to prevent reabsorption[15] |
| Mechanical Properties | ||
| Tensile strength (XY)MPa | 58 at break (printed XY, ISO 527) — the conductive filler raises strength above the unfilled grade's 42[1][24] | 39.9 ± 1.0 printed XY, ISO 527 (Polymaker); 3DXTech quotes 60 at break for its FR PC/ABS[2][3] |
| Young's modulusMPa | 2130 (printed XY, ISO 527)[1] | 1835 ± 65 printed XY, ISO 527 (Polymaker); 3DXTech quotes 2250[2][3] |
| Elongation at break% | 4 at break (printed XY, ISO 527)[1] | 4.2 ± 0.3 printed XY, ISO 527 (Polymaker); 3DXTech quotes 10 at break[2][3] |
| Flexural strengthMPa | 80 (printed XY, ISO 178)[1] | 66.3 ± 0.9 printed XY, ISO 178 (Polymaker); 3DXTech quotes 85[2][3] |
| Flexural modulusMPa | 2275 (printed XY, ISO 178)[1] | 2081 ± 106 printed XY, ISO 178 (Polymaker); 3DXTech quotes 2300[2][3] |
| Charpy impact, notchedkJ/m² | Not documented | 25.8 ± 1.3 printed XY, ISO 179, notched (Polymaker) — above both unfilled PC and ABS[2] |
| Other impact data | Not documented | Notched Charpy still 13 ± 2 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA), against 1.5 in Z. Stratasys prints Izod notched at 241 J/m XZ against 34.0 J/m ZX, and unnotched 655 against 101 J/m (ASTM D256, F900 T16).[2][4] |
| Layer adhesion / Z tensileMPa | Not documented | 25.9-30.2 at break printed ZX (Stratasys, ASTM D638 on the F900 and Fortus 450mc); 22.9 +/- 1.2 printed Z, ISO 527 (Polymaker)[2][4] |
| Brittleness1–5 | Moderate[1] | Tough — absorbs impact, yields before breaking[2] |
| Hardness (scale-specific)Shore A / Shore D / Rockwell | Not documented | Rockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a PC/ABS filament[25] |
| Creep resistance / sustained load1–5 | Moderate — no creep test found; Tg of 105 °C keeps room-temperature service far below softening[1] | Good. Room-temperature tensile creep of moulded PC/ABS was still running unbroken at 30 MPa when the experiment was stopped for time; specimens failed within the test window at 39-47 MPa (ASTM D638)[26] |
| Fatigue / repeated-flex resistance1–5 | Below average — no S-N curve found; elongation at break 4 %, well below unfilled ABS[1][24] | Not documented |
| Elasticity / flexibility1–5 | Rigid[1] | Rigid[2] |
| Z strength as % of XY% | Not documented | 75-86 (Stratasys ZX against XZ tensile at break, ASTM D638) against 57 (Polymaker, printed Z against XY tensile)[2][4] |
| Thermal Properties | ||
| HDT at 0.45 MPa°C | Not documented | 112 (ISO 75 at 0.45 MPa, Polymaker); Stratasys prints 117.9 in XY and 126.1 in XZ (ASTM D648 Method B at 66 psi), against 125.0 moulded[2][4] |
| HDT at 1.8 MPa°C | Not documented | 106 (ISO 75 at 1.8 MPa, Polymaker); Stratasys prints 107.5 in XY and 112.0 in XZ (ASTM D648 Method B at 264 psi), against 102.9 moulded[2][4] |
| Glass transition (Tg)°C | 105 (DSC)[1] | 109 (Polymaker) and 137 (3DXTech FR grade), DSC; Stratasys measures 105.3 (ASTM D7426 inflection point)[2][3][4] |
| Melting point / Vicat°C | Not documented | Amorphous — no melting point; Vicat 135 (Polymaker, ISO 306)[2] |
| Continuous service temperature°C | Not documented | 113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[22] |
| Annealing response | Not documented | 90 °C for 2 h (Polymaker)[2] |
| Thermal expansion (CTE)µm/m·K | Not documented | 59.9 over -50 to 35 °C and 73.0 over -50 to 95 °C (printed XY, ASTM E831)[4] |
| Environment & Chemical | ||
| UV resistance1–5 | Not documented | Degrades within weeks outdoors[15] |
| Chemical resistance | Good against weak acids, weak alkalis, oils and grease; dissolved by acetone[27] | Withstands oils, solvents and fuels; Polymaker rates it good against weak acids[15] |
| Food contact | Not food safe — Polymaker cites potential chemical leaching[16] | Bisphenol-A polycarbonate is not offered as food-contact filament[15] |
| Biodegradability / compostability | Not biodegradable[16] | Not biodegradable[15] |
| Recyclability | Mechanically recyclable but not accepted in household plastic collection[16] | Mechanically recyclable but not accepted in household plastic collection[15] |
| Electrical & ESD properties | Surface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ABS[1][24] | Not documented |
| Health & Safety | ||
| Fume toxicity1–5 | High — hazardous VOC such as styrene; enclosure and filtration needed[28][11] | Moderate — measurable VOCs and UFPs, ventilation advised[28] |
| VOC emission rateµg/min | 12–113 styrene, the dominant VOC from every ABS and HIPS combination tested[28] | Not documented |
| Ultrafine-particle emission rateparticles/min | 2 × 10¹⁰ to 9 × 10¹⁰ median across all ABS printers, two orders of magnitude above PLA's ≈1 × 10⁸[28] | ≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[28] |
| Hazardous species emitted | Styrene dominates. Bambu Lab states ABS and ASA release harmful gases such as styrene at printing temperature, which can be toxic and cause dizziness or nausea[28][11] | Not documented |
| Ventilation / filtration requirement1–5 | Enclosure with carbon and HEPA filtration — an enclosure alone cut measured UFP by only about 35 %[28][11] | Ventilated room or enclosure recommended[28][11] |
| Dust & fibre handling hazard | Conductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1] | Not documented |
| Post-Processing | ||
| Sanding & machining | Sands well and takes filler before painting[16] | Sands and machines well; the toughness means it cuts rather than chips[13] |
| Painting & finishing | Paints readily after light abrasion[16] | Not documented |
| Gluing & solvent welding | Not documented | Cyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[13] |
| Vapour / chemical smoothing | Not documented | Acetone attacks the ABS phase, so surface smoothing is partial rather than full[2] |
| Support material pairing | HIPS breaks away or dissolves in d-limonene; Bambu Lab sells a dedicated Support for ABS[29][11] | Prints its own supports; 3DXTech sells a dedicated PC break-away support[13] |
| Solvents & Solubility | ||
| Soluble in | Acetone dissolves it — the basis of ABS slurry; so do MEK, THF, ethyl acetate, chloroform, dichloromethane and toluene.[30][27] | Dichloromethane and chloroform dissolve the PC phase; acetone, MEK and THF dissolve the ABS phase.[31][30] |
| Softened or crazed by | Petrol and perchloroethylene soften it and benzene attacks it; d-limonene disrupts layer adhesion in some ABS and ASA grades.[30][32] | Petrol, esters, ether and 1 % alkali stress-crack the PC phase; aromatics and esters soften the ABS phase.[31][30] |
| Solvent welding & smoothing agent | Acetone: about 20 min of vapour at 80 °C over 5 mm of liquid. Prusa measured layer adhesion more than doubled.[33] | Acetone attacks only the ABS phase, so smoothing is partial; a dichloromethane cement welds the whole section.[2][34] |
Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- 3DXSTAT ESD-ABS Technical Data Sheet 3DXTech · 2026-08 · tds
- Polymaker PC-ABS Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
- Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
- PC-ABS — FDM Material Data Sheet Stratasys · 2023-08 · tds
- 3DXTech product catalogue 3DXTech · 2026-08 · vendor
- IEMAI ESD-ABS 3D Printing Filament product page IEMAI 3D · 2026-08 · vendor
- YXPOLYER ABS ESD product page YXPOLYER · 2026-08 · vendor
- Polymaker product catalogue Polymaker · 2026-08 · vendor
- Reli3D PC-ABS Filament, Black, 1000 g spool Reli3D (Amazon US) · 2026-08 · vendor
- SUNLU PC-ABS 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
- ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
- ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
- PC — material basics Polymaker Wiki · 2026-08 · doc
- ABS — material basics Polymaker Wiki · 2026-08 · doc
- 3DXSTAT ESD-ABS — product page (print recommendations) 3DXTech · 2026-08 · doc
- 3DXTech 3DXMAX ABS product page 3DXTech · 2026-08 · vendor
- Bambu Filament Technical Data Sheet V3.0 — ABS Bambu Lab · 2026-08 · tds
- Polymaker ABS Pro Technical Data Sheet V1 (2026-05-29) Polymaker · 2026-05 · tds
- Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
- Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
- Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
- 3DXMAX ABS Technical Data Sheet 3DXTech · 2026-08 · tds
- TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
- Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
- PolyLite ABS Technical Data Sheet (V5.5 served at this URL) Polymaker · 2024-11 · tds
- Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
- HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
- Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
- HIPS — Knowledge Base Prusa Research · 2026-08 · doc
- Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
- Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds