3D Printing Info

Filament comparison

ABS-ESD vs Conductive

Compare printing settings, strength, heat resistance, dated prices and sources.

2 selected · all documented properties

ABS-ESD vs Conductive — documented properties and sources
PropertyESD-safe ABSABSConductive filamentSPECIALTY
Market snapshot
Listing priceUSD/kg; dated snapshots$102.50/kg median; $47.00–$166.67/kg across 4 dated product listings$170.36/kg median; $89.99–$796.00/kg across 4 dated product listings
Identity & Market
Base polymer / chemistryABS compounded with a conductive carbon filler for static-dissipative parts[1]A carbon-filled compound conductive by volume rather than merely dissipative; Proto-pasta's is PLA-based, Recreus's and NinjaTek's are TPU, and add:north's Koltron G1 does not state its base polymer[2][3][4][5]
Densityg/cm³1.09 (ISO 1183)[1]Not documented
Typical priceUSD/kg1 kg-equivalent spools span 47–167; the middle of the market is about 103[6][7][8]1 kg-equivalent spools span 90–181 for the carbon-filled grades; add:north's Koltron G1 sits far above at 796 because it is sold only in 100 and 250 g coils[9][10][11]
Price range across brandsUSD/kg47–167 across brands; IEMAI 47, YXPOLYER 65, 3DXTech 140 at 750 g pricing; the EMI-shielding ABS grade runs 167[6][7][8]90–796 across brands; Proto-pasta conductive PLA 90 at 1 kg, Recreus Conductive Filaflex 160 at 500 g, NinjaTek Eel 181 at 1 kg, add:north Koltron G1 796 at 250 g[9][3][10][11]
Market availability1–5Niche, a handful of specialist brands[6]Niche, a handful of specialist brands[9][3]
Spool sizes & diameters1.75 and 2.85 mm; 750 g spools[6]1.75 and 2.85 mm; 0.05, 0.1, 0.25, 0.5, 1 and 2 kg spools[9][3][10][11]
Typical applicationsElectronics handling fixtures, trays and jigs used around static-sensitive parts[1]Capacitive touch surfaces, low-current traces, EMI shielding and static-safe fixtures[2]
Printing Parameters
Enclosure / chamber requirement1–5Enclosure recommended[12]Open frame is fine[2]
Bed surface & adhesion aidClean the plate and apply glue; Simplify3D also lists Kapton tape and ABS slurry[12][13]Not documented
Warping tendency1–5High — enclosure needed for reliable large parts[12]Not documented
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[12]Not documented
Stringing / oozing tendency1–5Slight — Polymaker advises 1–2 mm retraction at 20–30 mm/s[14]Not documented
Overall printing difficulty1–5Intermediate — dry filament and a tuned profile[12]Intermediate — dry filament and a tuned profile[2]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required[1]Brass acceptable; hardened steel for volume work[2]
Abrasiveness1–5Moderately abrasive — conductive carbon filler[1]Moderately abrasive — conductive carbon filler[2]
Nozzle clog risk1–5Low — 3DXTech lists no special nozzle concerns and no minimum layer height for its ESD-ABS, only an 80 °C pre-dry[15]Low — Proto-pasta states the carbon-filled grade prints on standard PLA settings with no special nozzle required[2]
Heat-creep / jam sensitivity1–5Slightly sensitive[13]Not documented
Hotend requirementNo special hot-end required[13]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Moderate — the ABS matrix takes up 0.51–0.65 % saturated at 25 °C / 55 % RH and 3DXTech specifies a 80 °C, 4 h pre-dry[16][17][15]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[18]Not documented
Effect of moisture on strengthPolymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam in the hotend and shows as bubbling and poor layer adhesion[18]Polymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[18]
Storage requirementSealed with desiccant; Polymaker rates ABS moderate-sensitivity[18]Not documented
Mechanical Properties
Tensile strength (XY)MPa58 at break (printed XY, ISO 527) — the conductive filler raises strength above the unfilled grade's 42[1][19]Not documented
Young's modulusMPa2130 (printed XY, ISO 527)[1]Not documented
Elongation at break%4 at break (printed XY, ISO 527)[1]Not documented
Flexural strengthMPa80 (printed XY, ISO 178)[1]Not documented
Flexural modulusMPa2275 (printed XY, ISO 178)[1]Not documented
Brittleness1–5Moderate[1]Brittle — snaps with little warning; carbon-black loading at conductive levels embrittles PLA[2]
Creep resistance / sustained load1–5Moderate — no creep test found; Tg of 105 °C keeps room-temperature service far below softening[1]Not documented
Fatigue / repeated-flex resistance1–5Below average — no S-N curve found; elongation at break 4 %, well below unfilled ABS[1][19]Not documented
Elasticity / flexibility1–5Rigid[1]Rigid[2]
Thermal Properties
Glass transition (Tg)°C105 (DSC)[1]Not documented
Environment & Chemical
Chemical resistanceGood against weak acids, weak alkalis, oils and grease; dissolved by acetone[20]Not documented
Food contactNot food safe — Polymaker cites potential chemical leaching[14]Not documented
Biodegradability / compostabilityNot biodegradable[14]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[14]Not documented
Electrical & ESD propertiesSurface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ABS[1][19]Conductive rather than dissipative — Proto-pasta sells the grade as electrically conductive composite PLA[2]
Health & Safety
Fume toxicity1–5High — hazardous VOC such as styrene; enclosure and filtration needed[21][12]Low hazard — minimal VOC and particle emission; none of these materials was in the chamber study[21]
VOC emission rateµg/min12–113 styrene, the dominant VOC from every ABS and HIPS combination tested[21]Not documented
Ultrafine-particle emission rateparticles/min2 × 10¹⁰ to 9 × 10¹⁰ median across all ABS printers, two orders of magnitude above PLA's ≈1 × 10⁸[21]Not documented
Hazardous species emittedStyrene dominates. Bambu Lab states ABS and ASA release harmful gases such as styrene at printing temperature, which can be toxic and cause dizziness or nausea[21][12]Not documented
Ventilation / filtration requirement1–5Enclosure with carbon and HEPA filtration — an enclosure alone cut measured UFP by only about 35 %[21][12]Open a window / occasional ventilation[21]
Dust & fibre handling hazardConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1]Conductive carbon filler is bound in the matrix; avoid inhaling sanding dust[2]
Post-Processing
Sanding & machiningSands well and takes filler before painting[14]Not documented
Painting & finishingPaints readily after light abrasion[14]Not documented
Support material pairingHIPS breaks away or dissolves in d-limonene; Bambu Lab sells a dedicated Support for ABS[22][12]Not documented
Solvents & Solubility
Soluble inAcetone dissolves it — the basis of ABS slurry; so do MEK, THF, ethyl acetate, chloroform, dichloromethane and toluene.[23][20]Chloroform dissolves PLA-based grades, leaving the carbon black; TPU-based grades need DMF, NMP or THF. Laboratory reagents.[24][25]
Softened or crazed byPetrol and perchloroethylene soften it and benzene attacks it; d-limonene disrupts layer adhesion in some ABS and ASA grades.[23][26]Acetone and ethyl acetate plasticise a PLA-based grade; a TPU-based grade swells in toluene, esters and alcohols.[24][25]
Solvent welding & smoothing agentAcetone: about 20 min of vapour at 80 °C over 5 mm of liquid. Prusa measured layer adhesion more than doubled.[27]None — neither PLA nor TPU has a workshop-safe welding or smoothing solvent.[24][25]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. 3DXSTAT ESD-ABS Technical Data Sheet 3DXTech · 2026-08 · tds
  2. Electrically Conductive Composite PLA — product page and technical data Proto-pasta · 2026-08 · tds
  3. Recreus product catalogue Recreus · 2026-08 · vendor
  4. Eel 3D Printing Filament Technical Specifications NinjaTek · 2026-08 · tds
  5. Koltron G1 Technical Data Sheet add:north · 2026-08 · tds
  6. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  7. IEMAI ESD-ABS 3D Printing Filament product page IEMAI 3D · 2026-08 · vendor
  8. YXPOLYER ABS ESD product page YXPOLYER · 2026-08 · vendor
  9. Proto-pasta product catalogue Proto-pasta · 2026-08 · vendor
  10. Eel product page — durometer, print guidelines and price NinjaTek · 2026-08 · vendor
  11. add:north Koltron G1 product page add:north · 2026-08 · vendor
  12. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  13. ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  14. ABS — material basics Polymaker Wiki · 2026-08 · doc
  15. 3DXSTAT ESD-ABS — product page (print recommendations) 3DXTech · 2026-08 · doc
  16. Bambu Filament Technical Data Sheet V3.0 — ABS Bambu Lab · 2026-08 · tds
  17. Polymaker ABS Pro Technical Data Sheet V1 (2026-05-29) Polymaker · 2026-05 · tds
  18. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  19. 3DXMAX ABS Technical Data Sheet 3DXTech · 2026-08 · tds
  20. PolyLite ABS Technical Data Sheet (V5.5 served at this URL) Polymaker · 2024-11 · tds
  21. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  22. HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  23. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  24. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  25. Elastollan — Chemical properties: swelling and chemical resistance BASF · 2026-08 · tds
  26. HIPS — Knowledge Base Prusa Research · 2026-08 · doc
  27. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc