3D Printing Info

Filament comparison

PSU vs PVDF

Compare printing settings, strength, heat resistance, dated prices and sources.

PSU guidePVDF guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PSU comparisonsMore PVDF comparisons
PSU vs PVDF — documented properties and sources
PropertyPSUHIGHTEMPPVDFENGINEERING
Market snapshot
Listing priceUSD/kg; dated snapshots$168.00/kg median; $168.00–$168.00/kg across 1 dated product listings$250.67/kg median; $250.67–$250.67/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryPolysulfone — the lowest-temperature and cheapest of the sulfone family[1]Polyvinylidene fluoride — a semi-crystalline fluoropolymer[2][3]
Densityg/cm³1.24 (ISO 1183)[1]1.71 (ISO 1183) — the densest unfilled filament in the dataset[2]
Typical priceUSD/kg1 kg-equivalent spools cluster near 250[4]1 kg-equivalent spools cluster near 251[4]
Price range across brandsUSD/kg168-250 across formats; 250 g spool $42 (168/kg), 500 g $125 (250/kg) — 3DXTech is the only filament supplier found[4]251 at 3DXTech's 750 g pricing — the most expensive material in the whole dataset[4]
Market availability1–5Special order, 1–2 makers worldwide[4]Special order, 1–2 makers worldwide[4][5]
Spool sizes & diameters1.75 mm; 250 g and 500 g spools[4]1.75 and 2.85 mm; 750 g spools[4]
Typical applicationsTransparent high-temperature housings, medical trays and hot-water fittings[1]Chemical-plant fittings, semiconductor handling and parts needing outstanding UV and chemical resistance[2]
Printing Parameters
Bed temperature°C120–140 (3DXTech)[1]70–110 (3DXTech FluorX)[2]
Enclosure / chamber requirement1–5Actively heated chamber required[6][7]Enclosure required (passive)[2]
Warping tendency1–5Not documentedHigh — enclosure needed for reliable large parts[2]
Overall printing difficulty1–5Expert / industrial hardware only[6][7]Expert / industrial hardware only[2][3]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[6]Brass fine indefinitely for unfilled grades[2]
Abrasiveness1–5Non-abrasive when unfilled[1]Non-abrasive when unfilled[2]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[8]Low — 3DXTech lists no special nozzle concerns, no minimum layer height and states drying is not required[5]
Other hardware wearNot documentedHydrogen fluoride released on overheating is extremely corrosive and will attack hotend and enclosure metalwork as well as people[3]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Not documentedNegligible (<0.1 % EMC) — fluoropolymers are essentially non-hygroscopic[2]
Equilibrium moisture content at ~50 % RH%0.30 in 24 h on extruded stock (ASTM D570)[9]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[8]Not applicable in practice — 3DXTech states drying is not required for PVDF, so there is no moisture-driven strength loss to measure[5]
Mechanical Properties
Tensile strength (XY)MPa52 (printed XY, ISO 527, 3DXTech); 81 at break on extruded stock (ASTM D638)[1][9]51 at break (printed XY, ISO 527)[2]
Young's modulusMPa2100 (printed XY, ISO 527)[1]2450 (printed XY, ISO 527)[2]
Elongation at break%8 (printed XY, ISO 527) against 50 on extruded stock — nearly three times PPSU's printed 3 %[1][10][9]25 at break (printed XY, ISO 527)[2]
Flexural strengthMPa87 (printed XY, ISO 178)[1]50 (printed XY, ISO 178)[2]
Flexural modulusMPa2050 (printed XY, ISO 178)[1]1800 (printed XY, ISO 178)[2]
Other impact dataIzod notched 69 J/m on extruded PSU stock, converted from 1.3 ft-lb/in (ASTM D256)[9]Izod 133 J/m on extruded PVDF stock, converted from 2.49 ft-lb/in (ASTM D256)[11]
Brittleness1–5Moderate[1]Tough — absorbs impact, yields before breaking[2]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell M120 on extruded PSU stock (ASTM D785)[9]Rockwell M79 on extruded PVDF stock (ASTM D785)[11]
Creep resistance / sustained load1–5Good. Ensinger lists high creep resistance as a headline property of extruded PSU stock, which is rated to 173 °C heat deflection at 1.8 MPa[9]Not documented
Elasticity / flexibility1–5Rigid[1]Slightly flexible in thin sections[2]
Thermal Properties
HDT at 0.45 MPa°C172 (printed XY, ISO 75 at 0.45 MPa, 3DXTech); 181 on extruded stock, converted from 358 °F at 66 psi[1][9]149 on extruded PVDF stock (ASTM D648 at 66 psi; converted from 300 °F)[11]
HDT at 1.8 MPa°C174 on extruded PSU stock, converted from 345 °F at 264 psi (ASTM D648)[9]113 on extruded PVDF stock (ASTM D648 at 264 psi; converted from 235 °F)[11]
Glass transition (Tg)°C187 (DSC, 3DXTech) and 185 on extruded stock (ASTM D3418), against 230 for PPSU[1][10][9]Not documented
Melting point / Vicat°CNot documented170 melting (ISO 11357)[2]
Continuous service temperature°C141 long-term service on extruded PSU stock, converted from 285 °F[9]149 long term and short term on extruded PVDF stock (converted from 300 °F)[11]
Thermal expansion (CTE)µm/m·K55.8 (extruded PSU stock, ASTM D696; source states 3.1e-5 in/in/°F)[9]127.8 (extruded PVDF stock, ASTM D696; source states 7.1e-5 in/in/°F) — the highest thermal expansion of any engineering polymer in this dataset[11]
Flammability / UL 94UL 94 V-0 on extruded PSU stock[9]UL 94 V-0 on extruded PVDF stock; Ensinger lists inherent flame resistance[11]
Environment & Chemical
UV resistance1–5Not documentedExcellent — designed for permanent outdoor use; Ensinger lists good UV and weather resistance and high gamma radiation resistance for PVDF stock[2][11]
Chemical resistanceNot documentedOutstanding — resistant to most acids, solvents and oxidising agents, which is the reason to use it[2]
Water / humidity resistance in service1–5Not documentedExcellent — essentially unaffected[2]
Electrical & ESD propertiesSurface resistance above 10¹³ ohm/sq — an insulator (IEC 60093)[1]Not documented
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[12]Very high — toxic decomposition products; local exhaust mandatory. Above 315 °C thermal decomposition yields hydrofluoric acid, hydrogen cyanide and carbon monoxide[3]
Hazardous species emittedNot documentedAbove 315 °C: hydrofluoric acid, hydrogen cyanide, phenols, carbon monoxide, carbon dioxide and dense smoke. HF is extremely corrosive, its skin burns may not be immediately visible or painful, and exposure can be fatal by skin absorption, inhalation or ingestion[3]
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[12]Local exhaust to outside / fume hood — the SDS states local exhaust is preferred[3]
Dust & fibre handling hazardNot documentedMolten polymer causes thermal burns and must not be pulled off the skin. If HF is detected during a decomposition event, cut the heat but keep the extraction running, ventilate, and clear non-essential people from the area[3]
Post-Processing
Dimensional accuracy & detailNot documentedThe processing window sits well below the 315 °C decomposition threshold, so nozzle temperature must be controlled rather than raised to chase flow[2][3]
Solvents & Solubility
Soluble inChlorinated hydrocarbons — dichloromethane, chloroform — dissolve polysulfone; ketones and esters attack it as well.[13][14]THF, MEK, DMF, DMAc, NMP, DMSO and trimethyl phosphate dissolve 5–10 wt% at ambient — Arkema's active solvents, all lab reagents.[15]
Softened or crazed byAcetone, MEK, ethyl acetate, benzene and toluene craze or stress-crack it; methanol and isopropanol only marginally.[14][13]Acetone, MIBK, cyclohexanone, butyl acetate and glycol ethers swell it; alkalis above pH 12 attack the homopolymer.[15][16]
Solvent welding & smoothing agentDichloromethane cement welds PSU and NMP softens residual resin. Both are laboratory reagents.[13]None for the workshop — the active solvents (NMP, DMAc, DMF) are laboratory reagents used for casting membranes, not joints.[15]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. ThermaX PSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  2. FluorX PVDF Technical Data Sheet v3 3DXTech · 2026-08 · tds
  3. FluorX PVDF Safety Data Sheet v1.1 3DXTech · 2026-08 · msds
  4. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  5. FluorX PVDF — product page 3DXTech · 2026-08 · vendor
  6. Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
  7. Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
  8. THERMAX PSU — product page (print recommendations) 3DXTech · 2026-08 · doc
  9. TECASON S natural (PSU) — stock shape properties Ensinger · 2026-08 · tds
  10. ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
  11. TECAFLON PVDF natural — stock shape properties Ensinger · 2026-08 · tds
  12. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  13. Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
  14. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  15. Kynar PVDF — Design properties: solubility and irradiation (active and latent solvents) Arkema · 2026-08 · tds
  16. Kynar PVDF resin — chemical and fuel resistance Arkema · 2026-08 · tds