Filament comparison
PLA-PHA vs PSU
Compare printing settings, strength, heat resistance, dated prices and sources.
2 selected · all documented properties
| Property | PLA/PHA blendPLA | PSUHIGHTEMP |
|---|---|---|
| Market snapshot | ||
| Listing priceUSD/kg; dated snapshots | $76.40/kg median; $76.40–$76.40/kg across 1 dated product listings | $168.00/kg median; $168.00–$168.00/kg across 1 dated product listings |
| Identity & Market | ||
| Base polymer / chemistry | PLA blended with polyhydroxyalkanoate, a bacterially fermented bio-polyester[1] | Polysulfone — the lowest-temperature and cheapest of the sulfone family[2] |
| Densityg/cm³ | 1.2 (ISO 1183)[1] | 1.24 (ISO 1183)[2] |
| Typical priceUSD/kg | Not documented | 1 kg-equivalent spools cluster near 250[3] |
| Price range across brandsUSD/kg | Not documented | 168-250 across formats; 250 g spool $42 (168/kg), 500 g $125 (250/kg) — 3DXTech is the only filament supplier found[3] |
| Market availability1–5 | Niche, a handful of specialist brands[1][4] | Special order, 1–2 makers worldwide[3] |
| Spool sizes & diameters | 1.75 and 2.85 mm; 750 g and 2200 g spools[1] | 1.75 mm; 250 g and 500 g spools[3] |
| Typical applications | General-purpose printing where PLA's brittleness is the limiting factor[1] | Transparent high-temperature housings, medical trays and hot-water fittings[2] |
| Printing Parameters | ||
| Nozzle temperature°C | 195–220 (colorFabb)[1] | Not documented |
| Bed temperature°C | 50–60 (colorFabb)[1] | 120–140 (3DXTech)[2] |
| Enclosure / chamber requirement1–5 | Open frame is fine[1] | Actively heated chamber required[5][6] |
| Part cooling fan | 0–100 %; colorFabb states the blend runs on both heated and unheated beds[1][7] | Not documented |
| Maximum volumetric flow (mm³/s; see test conditions)mm³/s | 3.2–8 at colorFabb's 40–100 mm/s, on a 0.4 mm nozzle at 0.2 mm layer[7][8] | Not documented |
| Overall printing difficulty1–5 | Beginner — prints on any machine out of the box[1] | Expert / industrial hardware only[5][6] |
| Hardware Wear & Reliability | ||
| Nozzle hardness required1–4 | Brass fine indefinitely[1] | Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[5] |
| Abrasiveness1–5 | Non-abrasive[1] | Non-abrasive when unfilled[2] |
| Nozzle clog risk1–5 | Very low — unfilled PLA blend; Prusa lists no drybox and no hardened nozzle for PLA[9] | Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[10] |
| Moisture Behaviour | ||
| Moisture absorption (hygroscopicity)1–5 | Moderate — the PLA matrix takes up 0.40–0.51 % saturated; colorFabb publishes no figure for the blend[11][12] | Not documented |
| Equilibrium moisture content at ~50 % RH% | Not documented | 0.30 in 24 h on extruded stock (ASTM D570)[13] |
| Effect of moisture on strength | Polymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures for this grade; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[14] | No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[10] |
| Mechanical Properties | ||
| Tensile strength (XY)MPa | 62–64 (ISO 527-1A, colorFabb; two grades quoted)[1] | 52 (printed XY, ISO 527, 3DXTech); 81 at break on extruded stock (ASTM D638)[2][13] |
| Young's modulusMPa | 2960–3070 (ISO 527-1A, colorFabb)[1] | 2100 (printed XY, ISO 527)[2] |
| Elongation at break% | 4 and 11 (ISO 527-1A, colorFabb; two grades quoted)[1] | 8 (printed XY, ISO 527) against 50 on extruded stock — nearly three times PPSU's printed 3 %[2][15][13] |
| Flexural strengthMPa | Not documented | 87 (printed XY, ISO 178)[2] |
| Flexural modulusMPa | 2500–3300 flexural modulus (ISO 178, colorFabb)[1] | 2050 (printed XY, ISO 178)[2] |
| Charpy impact, notchedkJ/m² | 2.8–3.7 (ISO 179, notched, colorFabb)[1] | Not documented |
| Other impact data | Not documented | Izod notched 69 J/m on extruded PSU stock, converted from 1.3 ft-lb/in (ASTM D256)[13] |
| Brittleness1–5 | Moderate — colorFabb positions the blend as tougher and less brittle than its generic PLA grades[1] | Moderate[2] |
| Hardness (scale-specific)Shore A / Shore D / Rockwell | Not documented | Rockwell M120 on extruded PSU stock (ASTM D785)[13] |
| Creep resistance / sustained load1–5 | Poor — no PLA/PHA creep test; plain printed PLA sagged from 12 to 16.2–21.8 mm over 5 days at 1.25 kg[16][17][18] | Good. Ensinger lists high creep resistance as a headline property of extruded PSU stock, which is rated to 173 °C heat deflection at 1.8 MPa[13] |
| Fatigue / repeated-flex resistance1–5 | Below average — no S-N curve for the blend; colorFabb positions it as tougher and less brittle than its generic PLA, which ran 38 000–49 000 cycles at 30 % of tensile strength[19][1] | Not documented |
| Elasticity / flexibility1–5 | Rigid[1] | Rigid[2] |
| Thermal Properties | ||
| HDT at 0.45 MPa°C | Not documented | 172 (printed XY, ISO 75 at 0.45 MPa, 3DXTech); 181 on extruded stock, converted from 358 °F at 66 psi[2][13] |
| HDT at 1.8 MPa°C | Not documented | 174 on extruded PSU stock, converted from 345 °F at 264 psi (ASTM D648)[13] |
| Glass transition (Tg)°C | Not documented | 187 (DSC, 3DXTech) and 185 on extruded stock (ASTM D3418), against 230 for PPSU[2][15][13] |
| Melting point / Vicat°C | Above 155 melting (ISO 3146-C)[1] | Not documented |
| Continuous service temperature°C | Not documented | 141 long-term service on extruded PSU stock, converted from 285 °F[13] |
| Thermal expansion (CTE)µm/m·K | Not documented | 55.8 (extruded PSU stock, ASTM D696; source states 3.1e-5 in/in/°F)[13] |
| Flammability / UL 94 | Not documented | UL 94 V-0 on extruded PSU stock[13] |
| Environment & Chemical | ||
| UV resistance1–5 | Degrades within weeks outdoors[20] | Not documented |
| Biodegradability / compostability | colorFabb states the PHA component is 100 % biodegradable[1] | Not documented |
| Electrical & ESD properties | Not documented | Surface resistance above 10¹³ ohm/sq — an insulator (IEC 60093)[2] |
| Health & Safety | ||
| Fume toxicity1–5 | Low hazard — minimal VOC and particle emission[21] | Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[21] |
| Ventilation / filtration requirement1–5 | None needed in a normal room[21] | Ventilated room or enclosure recommended[21] |
| Solvents & Solubility | ||
| Soluble in | Chloroform dissolves the PLA phase (10 % w/v, 2–4 h at 23 °C); THF and DMF need 65 °C. Laboratory reagents.[22] | Chlorinated hydrocarbons — dichloromethane, chloroform — dissolve polysulfone; ketones and esters attack it as well.[23][24] |
| Softened or crazed by | Acetone, ethyl acetate and toluene plasticise it but dissolve <1 % even at 65 °C; submersion in acetone crazes and destroys parts.[22][25] | Acetone, MEK, ethyl acetate, benzene and toluene craze or stress-crack it; methanol and isopropanol only marginally.[24][23] |
| Solvent welding & smoothing agent | Chloroform vapour smooths and welds PLA at the cost of tensile strength; acetone does not smooth it at all.[26][25] | Dichloromethane cement welds PSU and NMP softens residual resin. Both are laboratory reagents.[23] |
Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- PLA/PHA technical data sheet colorFabb · 2026-08 · tds
- ThermaX PSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
- 3DXTech product catalogue 3DXTech · 2026-08 · vendor
- woodFill technical data sheet colorFabb · 2026-08 · tds
- Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
- Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
- glowFill technical data sheet colorFabb · 2026-08 · tds
- Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
- Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
- THERMAX PSU — product page (print recommendations) 3DXTech · 2026-08 · doc
- Bambu Filament Technical Data Sheet V3.0 — PLA Basic Bambu Lab · 2026-08 · tds
- PolyLite PLA Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
- TECASON S natural (PSU) — stock shape properties Ensinger · 2026-08 · tds
- Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
- ThermaX PPSU Technical Data Sheet v3 3DXTech · 2026-08 · tds
- BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
- Polymaker PLA Pro vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
- Carbon Fiber PLA vs META-PLA vs PLA+ vs PLA by Sunlu — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
- Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
- PLA — material guide Prusa Knowledge Base · 2026-08 · doc
- Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
- Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
- Radel PPSU, Veradel PESU, Acudel modified PPSU Design Guide — environmental stress cracking tables Solvay Specialty Polymers · 2026-08 · tds
- Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
- Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
- Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper