Filament comparison
PEEK vs PLA+
Compare printing settings, strength, heat resistance, dated prices and sources.
2 selected · all documented properties
| Property | PEEKHIGHTEMP | PLA+ / Tough PLAPLA |
|---|---|---|
| Market snapshot | ||
| Listing priceUSD/kg; dated snapshots | $531.87/kg median; $296.14–$770.00/kg across 5 dated product listings | $16.49/kg median; $10.45–$39.99/kg across 10 dated product listings |
| Identity & Market | ||
| Base polymer / chemistry | Polyether ether ketone — a semi-crystalline polyaryletherketone[1] | PLA compounded with impact modifiers; suppliers publish the base as polylactic acid only[2][3] |
| Densityg/cm³ | 1.30 (ISO 1183)[1][4] | 1.17–1.24 (Polymaker); 1.21 (Bambu Lab, ISO 1183)[2][3] |
| Typical priceUSD/kg | 1 kg-equivalent spools span 296–770; the middle of the market is about 532[5][6][7] | Mainstream 1 kg spools cluster near 16[8][9] |
| Price range across brandsUSD/kg | 296-770 across brands and spool sizes; 3D4Makers recycled R-PEEK 296 at 750 g, IEMAI 3D 420 at 1 kg, LEHVOSS Luvocom 3F PEEK 9581 532 at 2 kg, 3DXTech ThermaX PEEK 770 at 500 g[5][6][7] | 10–40 across brands; budget house brands 10–17, Sakata 3D HR-870 26, Polymaker and Fiberlogy 36–40[10][9][11][12][13] |
| Market availability1–5 | Niche, a handful of specialist brands[5][6][4] | Stocked by most mainstream brands[10][8][9][11][12] |
| Spool sizes & diameters | 1.75 and 2.85 mm; 200 g to 2 kg spools[5][6][4] | 1.75 and 2.85 mm; 0.75, 0.85, 1 and 1.1 kg spools[11][12][10] |
| Typical applications | Aerospace brackets, semiconductor handling, sterilisable medical tooling and downhole parts[1] | Functional parts and enclosures that need impact tolerance but not heat resistance[2][3] |
| Diameter tolerance± mm | Not documented | ±0.03 (Bambu Lab)[14] |
| Printing Parameters | ||
| Nozzle temperature°C | 380-400 (3DXTech printed-specimen conditions); Victrex quotes a 340-450 melt range for AM 450 FIL[1][4] | 190–230 (Polymaker); Bambu Lab Tough+ needs 220–250[2][3] |
| Bed temperature°C | 130–140 (3DXTech)[1] | 25–60 (Polymaker); 35–65 (Bambu Lab Tough+)[2][3] |
| Enclosure / chamber requirement1–5 | Actively heated chamber required[15][16] | Open frame is fine[2][3] |
| Recommended chamber temperature°C | Not less than 150 for semi-crystalline printing (Victrex AM 450 FIL); bed above 150[4] | Not documented |
| Part cooling fan | Not documented | Fan on[2][3] |
| Bed surface & adhesion aid | Not documented | Textured or smooth PEI; Bambu Lab recommends glue stick or liquid glue for Tough+[2][3] |
| Warping tendency1–5 | Severe — heated chamber needed[15] | None[2] |
| Bed-adhesion difficulty1–5 | Very difficult — special plates or slurry required[15] | Sticks to anything[17] |
| Stringing / oozing tendency1–5 | Not documented | Slight — 1–3 mm retraction handles it[2][17] |
| Overall printing difficulty1–5 | Expert / industrial hardware only[15][16] | Easy — minor profile tuning; Tough+ wants a hotter nozzle than plain PLA[2][3] |
| Extruder requirement | An all-metal hot end rated above 400 °C and a heated chamber; 3DXTech tests at 0.25 mm layer height on a 0.4 mm nozzle[1][15] | Not documented |
| Hardware Wear & Reliability | ||
| Nozzle hardness required1–4 | Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[15] | Brass fine indefinitely[18] |
| Abrasiveness1–5 | Non-abrasive when unfilled[1] | Non-abrasive[19][18] |
| Nozzle clog risk1–5 | Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[20] | Very low[18] |
| Heat-creep / jam sensitivity1–5 | Not documented | Moderate — good heatbreak cooling needed; softens below 60 °C like plain PLA[21] |
| Hotend requirement | Not documented | No special hot-end required[17] |
| Moisture Behaviour | ||
| Moisture absorption (hygroscopicity)1–5 | Not documented | Low — 0.27 % saturated at 25 °C / 55 % RH[3] |
| Equilibrium moisture content at ~50 % RH% | 0.45 at saturation, 23 °C (ISO 62); 0.55 at 100 °C[4] | 0.27 saturated at 25 °C / 55 % RH (Bambu Lab Tough+)[3] |
| Drying temperature & time | 120 °C for 5 h, target below 0.020 % moisture (Victrex AM 450 FIL)[4] | 55 °C for 6–8 h; 65–75 °C for 12 h on a Bambu Lab X1 heatbed[2][3] |
| Symptoms when wet | Not documented | Bubbling and popping at the nozzle, stringing, rough surface and weak layers[22] |
| Effect of moisture on strength | No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[20] | Polymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures for the modified grades; the loss shows as poor layer adhesion rather than a strength number[22] |
| Storage requirement | Not documented | Sealed with desiccant below 20 % RH; shelf life at ambient is long[3][17] |
| Mechanical Properties | ||
| Tensile strength (XY)MPa | 60-100 (printed XY): Victrex AM 450 FIL 60-80 at yield and 3DXTech 100, both ISO 527; 98 at yield injection-moulded[1][4] | 35–43 (printed XY, ISO 527); 53 on My Tech Fun 4×4 mm bars for Bambu Lab Tough[2][3][23][24] |
| Young's modulusMPa | 3000-4000 (printed XY, ISO 527, Victrex AM 450 FIL); 3720 (3DXTech); 4000 injection-moulded[1][4] | 1860–2150 (printed XY, ISO 527) — below plain PLA at 2300–3427[2][3][25][26] |
| Elongation at break% | 28 (printed XY, ISO 527) — remarkably ductile for a high-temperature polymer[1] | 5.1–5.7 (printed XY, ISO 527)[2][3] |
| Flexural strengthMPa | 130 (printed XY, ISO 178)[1] | 62–65 (printed XY, ISO 178) — below plain PLA at 76–87[2][3][27][26] |
| Flexural modulusMPa | 2700 (printed XY, ISO 178)[1] | 2140–2393 (printed XY, ISO 178)[2][3] |
| Charpy impact, notchedkJ/m² | 6.0 (injection-moulded, ISO 179/1eA); unnotched does not break[4] | 38.9–72.3 (printed XY, ISO 179, notched) — 5–9× plain PLA[2][3] |
| Other impact data | Izod notched 7.0 kJ/m2 injection-moulded (ISO 180/A). Printed anisotropy is extreme: VICTREX AM 200 on a Stratasys F900 gives Izod notched 1380-1530 J/m XZ against 30-62 J/m ZX (ASTM D256)[4][28] | Charpy unnotched 80.6 printed XY (Bambu Lab Tough+); CNC Kitchen measured ~20 vs 5 kJ/m² for PolyLite PLA[3][23] |
| Layer adhesion / Z tensileMPa | 20-85 at yield (printed ZX, ISO 527, Victrex AM 450 FIL); the spread is set by chamber temperature and weld quality[4] | 20.9–32.4 printed Z (ISO 527); 33.0 on My Tech Fun layer-adhesion bars vs 27.6 for PLA Basic[2][3][24] |
| Brittleness1–5 | Tough — absorbs impact, yields before breaking[1] | Tough — absorbs impact, yields before breaking[2][3][23] |
| Hardness (scale-specific)Shore A / Shore D / Rockwell | Shore D 84.5 (injection-moulded, ISO 868); Rockwell M100 / R125 on extruded PEEK stock (ASTM D785)[4][29] | 78.8 Shore D measured on printed bars (My Tech Fun), against 75.3 for the same maker's plain PLA[30] |
| Creep resistance / sustained load1–5 | Excellent — holds load for years. Victrex rates PEEK for long-term creep; injection-moulded flexural stress at 3.5 % strain falls only from 125 MPa at 23 °C to 85 MPa at 125 °C, and extruded stock is rated to 249 °C continuous[31][4][29] | Poor — 12 mm bar sagged to 20.2 mm over 5 days at 1.25 kg, the same as plain PLA[24][32] |
| Fatigue / repeated-flex resistance1–5 | Excellent — living hinges viable. Victrex rates PEEK for long-term fatigue as well as creep[31] | Below average — impact modifiers raise absorbed energy 5–9×; plain PLA ran 38 000–49 000 cycles at 30 % of tensile strength[33][3][23] |
| Elasticity / flexibility1–5 | Rigid[1] | Rigid[2] |
| Z strength as % of XY% | 71-84 (VICTREX AM 200 LMPAEK printed on the Stratasys F900 and Fortus 450mc, ZX against XZ tensile yield, ASTM D638); unfilled PEEK's own ZX spread is wider[28] | 60 (Bambu Lab Tough+) to 78 (PolyMax PLA), printed[2][3] |
| Thermal Properties | ||
| HDT at 0.45 MPa°C | 140 (printed XY, ISO 75 at 0.45 MPa, 3DXTech)[1] | 55 (PolyMax) to 61 (Tough+), ISO 75 at 0.45 MPa[2][3] |
| HDT at 1.8 MPa°C | 152 (unannealed, ISO 75-2/Af, Victrex AM 450 FIL); 160 on extruded stock (ASTM D648 at 264 psi)[4][29] | 52 (PolyMax) to 58 (Tough+), ISO 75 at 1.8 MPa[2][3] |
| Glass transition (Tg)°C | 143 (DSC, 3DXTech); Victrex gives onset 143 and midpoint 150 (ISO 11357-2)[1][4] | 61 (DSC)[2][3] |
| Melting point / Vicat°C | 343 melting (ISO 11357-3, Victrex); VICTREX AM 200 LMPAEK melts at 303[4][28] | 149–151 peak melt (DSC); Vicat 62 (ISO 306)[2][3] |
| Continuous service temperature°C | 240 UL 746B relative thermal index, strength (RTI electrical 260, impact 180); Ensinger rates extruded PEEK stock at 249 long term[4][29] | 48–57 — loaded bars begin to move at this temperature: 48 for Polymaker PLA Pro, 50 for Sunlu PLA+, 52 for Bambu Lab Tough, 57 for PolyTerra PLA+[24][34][30][32] |
| Thermal expansion (CTE)µm/m·K | 37.8 (extruded PEEK stock, 23-60 °C, ASTM E831; source states 2.1e-5 in/in/°F), rising to 41.9 at 60-100 °C and 55.8 at 100-150 °C[29] | 96–99 for plain printed PLA (fibre Bragg grating, 25–50 °C); no grade-specific measurement published[35] |
| Flammability / UL 94 | UL 94 V-0 at 1.5 mm on the base resin; glow-wire flammability index 960 °C at 2.0 mm (IEC 60695-2-12)[1][4] | Flammable; no UL 94 rating published by the major brands[3][2] |
| Environment & Chemical | ||
| UV resistance1–5 | Not documented | Degrades within weeks outdoors[21][36] |
| Chemical resistance | Outstanding — resistant to almost all solvents and to steam sterilisation[1] | Good against weak acids, oils and grease; poor against strong acids and alkalis[2][3] |
| Water / humidity resistance in service1–5 | Excellent — essentially unaffected; 0.45 % water at saturation and resistant to steam sterilisation[4][1] | Not documented |
| Food contact | Not documented | Base resin is food-contact grade, but printed layer grooves harbour bacteria; Prusa advises against food use[21] |
| Biodegradability / compostability | Not documented | Industrially compostable only — needs sustained 55 °C; not home compostable[37][21] |
| Recyclability | Not documented | Mechanically recyclable; not accepted in household plastic collection[37] |
| Health & Safety | ||
| Fume toxicity1–5 | Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[38] | Low hazard — minimal VOC and particle emission[38] |
| Ventilation / filtration requirement1–5 | Ventilated room or enclosure recommended[38] | None needed in a normal room[38] |
| Post-Processing | ||
| Sanding & machining | Not documented | Wet sanding — dry sanding heats the surface by friction and smears it[36][21] |
| Gluing & solvent welding | Not documented | Cyanoacrylate for most joints; some grades partially dissolve and bond with acetone[21][39] |
| Vapour / chemical smoothing | Not documented | No practical vapour smoothing — only chloroform, hot benzene or THF, which are laboratory-only[21] |
| Support material pairing | Not documented | PolySupport and PolyDissolve S1 (Polymaker); Support for PLA (Bambu Lab)[2][3] |
| Dimensional accuracy & detail | Not documented | 55° overhangs and 30 mm bridges (Bambu Lab Tough+)[3] |
| Solvents & Solubility | ||
| Soluble in | 95–98 wt% sulphuric acid dissolves it — 10 g per 100 mL at 40–70 °C gives a dark red solution. Laboratory route only.[40][41] | Chloroform: 10 % w/v in 2–4 h at 23 °C, every grade and morphology; THF and DMF only at 65 °C. Laboratory reagents.[42] |
| Softened or crazed by | Concentrated nitric, hydrofluoric, hydrobromic and hydriodic acids attack it; DCM, DMSO and THF swell thin-walled sections.[43][41] | Acetone, ethyl acetate and toluene plasticise it but dissolve <1 % even at 65 °C; submersion in acetone crazes and destroys parts.[42][44] |
| Solvent welding & smoothing agent | None — no solvent softens PEEK, so parts are joined thermally or mechanically, never chemically.[43][41] | Chloroform vapour smooths and welds PLA at the cost of tensile strength; acetone does not smooth it at all.[45][44] |
Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- ThermaX PEEK Technical Data Sheet v3 3DXTech · 2026-08 · tds
- PolyMax PLA Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
- Bambu Filament Technical Data Sheet V3.0 — PLA Tough+ Bambu Lab · 2026-08 · tds
- VICTREX AM 450 FIL — datasheet Victrex · 2025-12 · tds
- 3DXTech product catalogue 3DXTech · 2026-08 · vendor
- 3D4Makers product catalogue 3D4Makers · 2026-08 · vendor
- IEMAI 3D PEEK 3D Printing Filament — store page IEMAI 3D · 2026-08 · vendor
- eSUN PLA+ 1.75mm 1KG eSUN Official Store · 2026-08 · vendor
- Overture PLA+ 1.75mm Overture3D · 2026-08 · vendor
- JAYO PLA+ 1.1KG Reusable Spool 1.75mm JAYO Official Store · 2026-08 · vendor
- Polymaker PolyMax PLA 0.75kg Polymaker Shop · 2026-08 · vendor
- Fiberlogy Impact PLA 850g 3DJake International · 2026-08 · vendor
- PLA HR-870 NATURAL Sakata 3D Filaments · 2026-08 · vendor
- PLA Basic — product page Bambu Lab US Store · 2026-08 · vendor
- Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
- Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
- PLA — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
- Prusament PLA — material page Prusa Polymers · 2026-08 · doc
- ThermaX PEEK — product page 3DXTech · 2026-08 · vendor
- PLA — material guide Prusa Knowledge Base · 2026-08 · doc
- Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
- The difference of PLA and PLA+ tested! (feat. Polymaker) CNC Kitchen · 2020-08 · test
- BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
- Prusament PLA Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
- PolyLite PLA Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
- Bambu Filament Technical Data Sheet V3.0 — PLA Basic Bambu Lab · 2026-08 · tds
- VICTREX AM 200 — FDM Material Data Sheet Stratasys · 2024-04 · tds
- TECAPEEK natural (PEEK) — stock shape properties Ensinger · 2026-08 · tds
- Carbon Fiber PLA vs META-PLA vs PLA+ vs PLA by Sunlu — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
- PEEK polymers — product overview Victrex · 2026-08 · doc
- PolyTerra PLA vs PLA+ — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
- Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
- Polymaker PLA Pro vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
- Characterization of Thermal Expansion Coefficient of 3D Printing Polymeric Materials Using Fiber Bragg Grating Sensors Materials 17(18):4668 · 2024-09 · paper
- Prusament PLA Technical Data Sheet v1.0 Prusa Polymers · 2018-09 · tds
- Filamentive PLA (recycled) — product page Filamentive · 2026-08 · vendor
- Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
- Prusament rPLA Corn Pigment 1kg — product page Prusa Research · 2026-08 · vendor
- The Effects of Sulfonated Poly(ether ether ketone) Ion Exchange Preparation Conditions on Membrane Properties Yee, Zhang & Ladewig, Membranes 3(3) 182–195 · 2013-07 · paper
- Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
- Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
- What solvents are not compatible with PEEK? — fluidics technical FAQ IDEX Health & Science · 2026-08 · doc
- Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
- Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper