3D Printing Info

Filament comparison

PC-GF vs PLA Stone

Compare printing settings, strength, heat resistance, dated prices and sources.

2 selected · all documented properties

PC-GF vs PLA Stone — documented properties and sources
PropertyGlass-fibre PC (PC-GF)PCStone-filled PLAPLA
Market snapshot
Listing priceUSD/kg; dated snapshots$71.27/kg median; $71.27–$71.27/kg across 1 dated product listings$22.99/kg median; $15.99–$49.16/kg across 6 dated product listings
Identity & Market
Base polymer / chemistryPolycarbonate reinforced with 30 wt% short glass fibre[1]PLA filled with stone or mineral powder — Formfutura StoneFil declares 40–50 wt% stone powder[2][3]
Densityg/cm³1.17 (measured on a 100 % infill printed part, ISO 1183-A)[1]1.22 (Bambu Lab PLA Marble) and 1.50–1.70 (Formfutura StoneFil), ISO 1183[3][2]
Typical priceUSD/kg1 kg spools cluster near 71[4]1 kg spools cluster near 21[5][6]
Price range across brandsUSD/kg71 — BASF Ultrafuse PC GF30 at igo3d is the only priced listing found; Owens Corning sells XSTRAND GF30-PC in 500 g and 1 kg[4][1]16–49 across brands; SUNLU 16, ELEGOO 19, Polymaker 21, Bambu Lab 25, Prusament 38, Filament PM MarbleJet 49 on 0.5 kg spools[7][6][5][8][9][10]
Market availability1–5Niche, a handful of specialist brands — neither Polymaker's nor 3DXTech's polycarbonate range contains a glass-fibre grade, but BASF Forward AM and Owens Corning both sell one through European retail[4][1][6][11]Stocked by most mainstream brands[5][6][7]
Spool sizes & diameters1.75 and 2.85 mm at +/- 0.05 mm; 500 g and 1 kg net spools[1]1.75 and 2.85 mm; 0.5 and 1 kg spools plus refills[6][2]
Typical applicationsFunctional prototyping for mechanical engineering, electronics and automotive[1]Architectural models, sculpture and props with a matte mineral surface[3]
Diameter tolerance± mm+/- 0.05 (Owens Corning XSTRAND)[1]Not documented
Printing Parameters
Nozzle temperature°C280-330 (Owens Corning XSTRAND GF30-PC)[1]190–230 (Bambu Lab)[3]
Bed temperature°C80-110 (Owens Corning XSTRAND GF30-PC)[1]35–45 (Bambu Lab)[3]
Enclosure / chamber requirement1–5Enclosure required (passive) — as for unfilled PC[12][13]Open frame is fine[3]
Part cooling fanNot documentedFan on[3]
Bed surface & adhesion aidPerforated plate, DimaFix or Magigoo PC glue (Owens Corning)[1]Not documented
Overall printing difficulty1–5Not documentedEasy — minor profile tuning; 0.2 mm nozzles are not usable[14]
Extruder requirementOwens Corning specifies a nozzle above 0.4 mm and hardened steel nozzles and drive wheels[1]Nozzles below 0.4 mm are not compatible (Bambu Lab)[14]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required — Owens Corning states glass reinforcement shortens brass nozzle and drive-wheel life[1]Brass acceptable; hardened steel for volume work — Bambu Lab's compatibility table says no hardened nozzle is needed while the note under the same table groups PLA Marble with particle-filled materials that should always use one[14]
Abrasiveness1–5Highly abrasive — 30 wt% glass fibre[1]Moderately abrasive — stone fill[14][2]
Nozzle clog risk1–5High — jams from moisture, heat creep or particles; PC already absorbs water from the air and Prusa lists glass-filled composites as a higher clogging risk[15][16]Moderate — needs dry filament and a clean nozzle[14]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Negligible (<0.1 % EMC) — Owens Corning measures below 0.1 % at 23 °C and 50 % RH (ISO 62)[1]Moderate — 0.44 % saturated at 25 °C / 55 % RH[3]
Equilibrium moisture content at ~50 % RH%Below 0.1 at 23 °C and 50 % RH, and below 0.1 at saturation (ISO 62)[1]0.44 saturated at 25 °C / 55 % RH (Bambu Lab)[3]
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[17][18]Polymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures for this grade; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[18]
Mechanical Properties
Tensile strength (XY)MPa65 at break (printed, ISO 527 at 1 mm/min)[1]33 ± 4 printed XY, ISO 527 (Bambu Lab)[3]
Young's modulusMPa5400 (printed, ISO 527 at 1 mm/min)[1]2330 ± 240 printed XY, ISO 527 (Bambu Lab)[3]
Elongation at break%2.5 at break (printed, ISO 527 at 1 mm/min)[1]6.7 ± 0.5 printed XY, ISO 527 (Bambu Lab)[3]
Flexural strengthMPa113 at yield (printed, ISO 178 at 2 mm/min)[1]75 ± 5 printed XY, ISO 178 (Bambu Lab)[3]
Flexural modulusMPa5500 (printed, ISO 178 at 2 mm/min)[1]2920 ± 180 printed XY, ISO 178 (Bambu Lab)[3]
Charpy impact, notchedkJ/m²Not documented9.5 ± 2.6 printed XY, ISO 179, notched (Bambu Lab)[3]
Other impact dataNot documentedCharpy unnotched 24.0 printed XY (Bambu Lab, ISO 179)[3]
Layer adhesion / Z tensileMPaNot documented30 ± 4 printed Z, ISO 527 (Bambu Lab)[3]
Brittleness1–5Brittle — snaps with little warning; 2.5 % elongation at break[1]Brittle — snaps with little warning[3]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a glass-fibre grade[19]Not documented
Creep resistance / sustained load1–5Excellent — holds load for years. Room-temperature tensile creep of moulded unfilled PC ran unbroken at 41 MPa until the test was stopped, and 30 wt% glass raises the tensile modulus from about 2.3 to 5.4 GPa[20][1]Poor — no stone-filled creep test; plain printed PLA sagged from 12 to 16.2–21.8 mm over 5 days at 1.25 kg[21][22][23]
Fatigue / repeated-flex resistance1–5Not documentedPoor — no grade-specific S-N curve; plain printed PLA ran 38 000–49 000 cycles at 30 % of tensile strength and the mineral filler leaves a brittle compound[24][3]
Elasticity / flexibility1–5Rigid[1]Rigid[3]
Z strength as % of XY%Not documented91 by tensile, 73 by flexural (printed, Bambu Lab)[3]
Thermal Properties
HDT at 0.45 MPa°CNot documented56 (ISO 75, 0.45 MPa)[3]
HDT at 1.8 MPa°C137 (printed, ISO 75 Method A at 1.8 MPa)[1]53 (ISO 75, 1.8 MPa)[3]
Glass transition (Tg)°C145 (DSC, ISO 11357)[1]56 (DSC)[3]
Melting point / Vicat°C270 stated as melting point (ISO 11357) — unusual for an amorphous polymer, but this is the published figure[1]156 peak melt (DSC); Formfutura gives a 120–170 melting range for StoneFil[3][2]
Thermal expansion (CTE)µm/m·K26.2 in XY and 77.4 in Z (printed, ISO 11359-2) — a threefold anisotropy, and the lowest in-plane expansion of any polycarbonate here[1]Not documented
Flammability / UL 94UL 94 V-0 verified (Owens Corning)[1]Not documented
Environment & Chemical
UV resistance1–5Good — years with some colour shift. Owens Corning lists UV resistance as a product benefit but publishes no exposure data[1]Degrades within weeks outdoors[25]
Water / humidity resistance in service1–5Excellent — essentially unaffected; below 0.1 % water at saturation (ISO 62)[1]Not documented
Electrical & ESD propertiesElectrically insulating (Owens Corning)[1]Not documented
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[26]Low hazard — minimal VOC and particle emission[26]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[26]Not documented
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[26][13]None needed in a normal room[26]
Dust & fibre handling hazardOwens Corning warns that the glass reinforcement is abrasive when melted and advises sufficient ventilation and avoiding extrusion fumes[1]Formfutura's SDS sets an occupational limit of 1 mg/m³ for the stone powder and lists it as both a fibre and a particulate — do not dry-sand without extraction[2]
Post-Processing
Sanding & machiningNot documentedSands to a stone-like matte surface[2]
Support material pairingNot documentedSupport for PLA (Bambu Lab)[3]
Dimensional accuracy & detailHigh dimensional stability is the headline benefit; the 26.2 um/m*K in-plane CTE is a third of unfilled PC's[1]Matte mineral surface hides layer lines; 55° overhangs and 30 mm bridges as for plain PLA[3]
Solvents & Solubility
Soluble inDichloromethane and chloroform dissolve the matrix and leave the fibre; DMF and dioxane do the same (Covestro).[27]Chloroform dissolves the PLA matrix (10 % w/v, 2–4 h at 23 °C) and leaves the filler as loose sludge; laboratory reagent.[28]
Softened or crazed byMethanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[27]Acetone, ethyl acetate and toluene plasticise the matrix but dissolve <1 % even at 65 °C; acetone submersion crazes parts.[28][29]
Solvent welding & smoothing agentDichloromethane cement welds the resin, but the fibre keeps the joint from flowing closed. Controlled carcinogen.[30]Chloroform vapour attacks only the resin fraction, so the filler is left standing proud; no workshop-safe agent exists.[31][29]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. XSTRAND GF30-PC Data Sheet Owens Corning · 2019-04 · tds
  2. StoneFil safety data sheet Formfutura · 2026-08 · msds
  3. Bambu Filament Technical Data Sheet — PLA Marble Bambu Lab · 2026-08 · tds
  4. BASF Ultrafuse PC GF30 Black 2.85 mm 1.000 g igo3d · 2026-08 · vendor
  5. PLA Marble — product page Bambu Lab US Store · 2026-08 · vendor
  6. Polymaker product catalogue Polymaker · 2026-08 · vendor
  7. ELEGOO product catalogue ELEGOO · 2026-08 · vendor
  8. Printed Solid product catalogue Printed Solid · 2026-08 · vendor
  9. SUNLU High Speed PLA Marble 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
  10. Filament PM PLA MarbleJet technical data sheet Filament PM (Plasty Mladec) · 2026-08 · tds
  11. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  12. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  13. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  14. PLA Usage Guide Bambu Lab Wiki · 2026-08 · doc
  15. Composite materials filled with carbon, kevlar or glass Prusa Knowledge Base · 2026-08 · doc
  16. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  17. PC — material basics Polymaker Wiki · 2026-08 · doc
  18. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  19. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  20. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  21. BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  22. Polymaker PLA Pro vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  23. Carbon Fiber PLA vs META-PLA vs PLA+ vs PLA by Sunlu — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
  24. Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
  25. PLA — material guide Prusa Knowledge Base · 2026-08 · doc
  26. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  27. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  28. Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
  29. Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
  30. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds
  31. Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper