3D Printing Info

Filament comparison

PC-FR vs PVDF

Compare printing settings, strength, heat resistance, dated prices and sources.

Flame-retardant PC (PC-FR) guidePVDF guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-FR comparisonsMore PVDF comparisons
PC-FR vs PVDF — documented properties and sources
PropertyFlame-retardant PC (PC-FR)PCPVDFENGINEERING
Market snapshot
Listing priceUSD/kg; dated snapshots$87.50/kg median; $54.99–$224.00/kg across 4 dated product listings$250.67/kg median; $250.67–$250.67/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryFlame-retardant polycarbonate. Polymaker builds its grade on Covestro's Makrolon family and rates it UL 94 V-0[1][2]Polyvinylidene fluoride — a semi-crystalline fluoropolymer[3][4]
Densityg/cm³1.18 (Bambu Lab) and 1.2 (Polymaker), ISO 1183[2][1]1.71 (ISO 1183) — the densest unfilled filament in the dataset[3]
Typical priceUSD/kg1 kg-equivalent spools span 55–224; the two mainstream 1 kg grades are 55 and the industrial grades 120–224[2][5]1 kg-equivalent spools cluster near 251[6]
Price range across brandsUSD/kg55–224 across brands; Bambu Lab and Polymaker 55, 3DXTech FR PC/ABS 120, 3DXLABS FR-PC 224[2][5][6]251 at 3DXTech's 750 g pricing — the most expensive material in the whole dataset[6]
Market availability1–5Available from several mainstream brands[2][5][6]Special order, 1–2 makers worldwide[6][7]
Spool sizes & diameters1.75 mm; 0.75 and 1 kg spools[5][6][2]1.75 and 2.85 mm; 750 g spools[6]
Typical applicationsElectrical enclosures, transport interiors and battery housings that must meet a flammability rating[1][2]Chemical-plant fittings, semiconductor handling and parts needing outstanding UV and chemical resistance[3]
Diameter tolerance± mm±0.03 (Bambu Lab PC FR)[2]Not documented
Printing Parameters
Nozzle temperature°C260–280 (Bambu Lab); 250–270 (Polymaker)[2][1]Not documented
Bed temperature°C90–110 (Bambu Lab); 90–105 (Polymaker)[2][1]70–110 (3DXTech FluorX)[3]
Enclosure / chamber requirement1–5Enclosure required (passive) — Bambu Lab specifies a 45–60 °C chamber, Polymaker 70–100 °C[2][1]Enclosure required (passive)[3]
Recommended chamber temperature°C45–60 (Bambu Lab); 70–100 (Polymaker)[2][1]Not documented
Part cooling fan0–60 % (Bambu Lab)[2]Not documented
Bed surface & adhesion aidSmooth or textured PEI plate (Bambu Lab)[2]Not documented
Maximum volumetric flow (mm³/s; see test conditions)mm³/s24 at Bambu Lab's 300 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[2][8]Not documented
Warping tendency1–5Severe — heated chamber needed[1][9]High — enclosure needed for reliable large parts[3]
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[10][11]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[11]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[2][9]Expert / industrial hardware only[3][4]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[9]Brass fine indefinitely for unfilled grades[3]
Abrasiveness1–5Non-abrasive[1]Non-abrasive when unfilled[3]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 6 h pre-dry at 80 °C[12]Low — 3DXTech lists no special nozzle concerns, no minimum layer height and states drying is not required[7]
Heat-creep / jam sensitivity1–5Slightly sensitive[10]Not documented
Hotend requirementAll-metal hot end required (Simplify3D)[10]Not documented
Other hardware wearNot documentedHydrogen fluoride released on overheating is extremely corrosive and will attack hotend and enclosure metalwork as well as people[4]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — 0.12 % saturated at 25 °C / 55 % RH (Bambu Lab), half that of unfilled Bambu Lab PC[2][13]Negligible (<0.1 % EMC) — fluoropolymers are essentially non-hygroscopic[3]
Equilibrium moisture content at ~50 % RH%0.12 saturated at 25 °C / 55 % RH (Bambu Lab)[2]Not documented
Drying temperature & time75 °C for 6 h (Polymaker)[1]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[14]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[11][14]Not applicable in practice — 3DXTech states drying is not required for PVDF, so there is no moisture-driven strength loss to measure[7]
Storage requirementAirtight containers with desiccant to prevent reabsorption[11]Not documented
Mechanical Properties
Tensile strength (XY)MPa60 ± 4 (Bambu Lab) and 67 ± 4.5 (Polymaker) printed XY, ISO 527[2][1]51 at break (printed XY, ISO 527)[3]
Young's modulusMPa1670 ± 40 (Bambu Lab) and 2634 ± 182 (Polymaker) printed XY, ISO 527[2][1]2450 (printed XY, ISO 527)[3]
Elongation at break%2.4 ± 0.3 (Bambu Lab) and 3.49 ± 0.7 (Polymaker) at break, printed XY, ISO 527 — the retardant roughly halves unfilled PC's elongation[2][1][15]25 at break (printed XY, ISO 527)[3]
Flexural strengthMPa96.6 ± 1.3 printed XY, ISO 178 (Polymaker)[1]50 (printed XY, ISO 178)[3]
Flexural modulusMPa2518 ± 53 printed XY, ISO 178 (Polymaker)[1]1800 (printed XY, ISO 178)[3]
Charpy impact, notchedkJ/m²11.7 ± 1.6 printed XY, ISO 179, notched (Polymaker)[1]Not documented
Other impact dataNotched Charpy 7.5 ± 1.6 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA)[1]Izod 133 J/m on extruded PVDF stock, converted from 2.49 ft-lb/in (ASTM D256)[16]
Layer adhesion / Z tensileMPa21 ± 3 (Bambu Lab) and 46 ± 4.8 (Polymaker) printed Z, ISO 527[2][1]Not documented
Brittleness1–5Moderate[2][1]Tough — absorbs impact, yields before breaking[3]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a flame-retardant filament[17]Rockwell M79 on extruded PVDF stock (ASTM D785)[16]
Creep resistance / sustained load1–5Good. Moulded unfilled PC sustained 41 MPa tensile creep at room temperature without breaking, but the retardant package drops the glass transition to 115 °C in Polymaker's grade, so the unfilled rating is not carried over in full[18][1]Not documented
Elasticity / flexibility1–5Rigid[1]Slightly flexible in thin sections[3]
Z strength as % of XY%35 (Bambu Lab) to 69 (Polymaker), printed[2][1]Not documented
Thermal Properties
HDT at 0.45 MPa°C110 (Polymaker) and 113 (Bambu Lab), ISO 75 at 0.45 MPa[1][2]149 on extruded PVDF stock (ASTM D648 at 66 psi; converted from 300 °F)[16]
HDT at 1.8 MPa°C107 (Polymaker) and 108 (Bambu Lab), ISO 75 at 1.8 MPa[1][2]113 on extruded PVDF stock (ASTM D648 at 264 psi; converted from 235 °F)[16]
Glass transition (Tg)°C115 (Polymaker) and 145 (Bambu Lab), DSC[1][2]Not documented
Melting point / Vicat°CAmorphous — no melting point; Vicat 114 (Bambu Lab, ISO 306)[2]170 melting (ISO 11357)[3]
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[19]149 long term and short term on extruded PVDF stock (converted from 300 °F)[16]
Thermal expansion (CTE)µm/m·K68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a flame-retardant grade[17]127.8 (extruded PVDF stock, ASTM D696; source states 7.1e-5 in/in/°F) — the highest thermal expansion of any engineering polymer in this dataset[16]
Flammability / UL 94UL 94 V-0 (Polymaker PolyMax PC-FR); 3DXTech rates its FR PC/ABS V-0 at 1.5 mm on the base resin[1][20]UL 94 V-0 on extruded PVDF stock; Ensinger lists inherent flame resistance[16]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors unless stabilised[11]Excellent — designed for permanent outdoor use; Ensinger lists good UV and weather resistance and high gamma radiation resistance for PVDF stock[3][16]
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[11]Outstanding — resistant to most acids, solvents and oxidising agents, which is the reason to use it[3]
Water / humidity resistance in service1–5Not documentedExcellent — essentially unaffected[3]
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[11]Not documented
Biodegradability / compostabilityNot biodegradable[11]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[11]Not documented
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[21]Very high — toxic decomposition products; local exhaust mandatory. Above 315 °C thermal decomposition yields hydrofluoric acid, hydrogen cyanide and carbon monoxide[4]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[21]Not documented
Hazardous species emittedNot documentedAbove 315 °C: hydrofluoric acid, hydrogen cyanide, phenols, carbon monoxide, carbon dioxide and dense smoke. HF is extremely corrosive, its skin burns may not be immediately visible or painful, and exposure can be fatal by skin absorption, inhalation or ingestion[4]
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[21][9]Local exhaust to outside / fume hood — the SDS states local exhaust is preferred[4]
Dust & fibre handling hazardNot documentedMolten polymer causes thermal burns and must not be pulled off the skin. If HF is detected during a decomposition event, cut the heat but keep the extraction running, ventilate, and clear non-essential people from the area[4]
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[10]Not documented
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[10]Not documented
Vapour / chemical smoothingNo practical vapour smoothing[10]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[10]Not documented
Dimensional accuracy & detailNot documentedThe processing window sits well below the 315 °C decomposition threshold, so nozzle temperature must be controlled rather than raised to chase flow[3][4]
Solvents & Solubility
Soluble inDichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[22]THF, MEK, DMF, DMAc, NMP, DMSO and trimethyl phosphate dissolve 5–10 wt% at ambient — Arkema's active solvents, all lab reagents.[23]
Softened or crazed byMethanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[22]Acetone, MIBK, cyclohexanone, butyl acetate and glycol ethers swell it; alkalis above pH 12 attack the homopolymer.[23][24]
Solvent welding & smoothing agentDichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[25]None for the workshop — the active solvents (NMP, DMAc, DMF) are laboratory reagents used for casting membranes, not joints.[23]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. PolyMax PC-FR Technical Data Sheet V5.5 Polymaker · 2024-11 · tds
  2. Bambu Filament Technical Data Sheet V1.0 — PC FR Bambu Lab · 2026-08 · tds
  3. FluorX PVDF Technical Data Sheet v3 3DXTech · 2026-08 · tds
  4. FluorX PVDF Safety Data Sheet v1.1 3DXTech · 2026-08 · msds
  5. Polymaker product catalogue Polymaker · 2026-08 · vendor
  6. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  7. FluorX PVDF — product page 3DXTech · 2026-08 · vendor
  8. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  9. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  10. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  11. PC — material basics Polymaker Wiki · 2026-08 · doc
  12. 3DXTech Firewire FR-PC/ABS product page 3DXTech · 2026-08 · vendor
  13. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  14. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  15. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  16. TECAFLON PVDF natural — stock shape properties Ensinger · 2026-08 · tds
  17. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  18. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  19. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  20. Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
  21. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  22. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  23. Kynar PVDF — Design properties: solubility and irradiation (active and latent solvents) Arkema · 2026-08 · tds
  24. Kynar PVDF resin — chemical and fuel resistance Arkema · 2026-08 · tds
  25. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds