3D Printing Info

Filament comparison

PC-ESD vs PVDF

Compare printing settings, strength, heat resistance, dated prices and sources.

ESD-safe PC guidePVDF guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-ESD comparisonsMore PVDF comparisons
PC-ESD vs PVDF — documented properties and sources
PropertyESD-safe PCPCPVDFENGINEERING
Market snapshot
Listing priceUSD/kg; dated snapshots$180.00/kg median; $180.00–$180.00/kg across 1 dated product listings$250.67/kg median; $250.67–$250.67/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryPolycarbonate compounded with a conductive filler for static-dissipative parts[1]Polyvinylidene fluoride — a semi-crystalline fluoropolymer[2][3]
Densityg/cm³1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[1][4]1.71 (ISO 1183) — the densest unfilled filament in the dataset[2]
Typical priceUSD/kg1 kg-equivalent spools cluster near 180[5]1 kg-equivalent spools cluster near 251[5]
Price range across brandsUSD/kg180 at 3DXTech's 750 g pricing — the most expensive material in this group[5]251 at 3DXTech's 750 g pricing — the most expensive material in the whole dataset[5]
Market availability1–5Special order, 1–2 makers worldwide[5]Special order, 1–2 makers worldwide[5][6]
Spool sizes & diameters1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[5]1.75 and 2.85 mm; 750 g spools[5]
Typical applicationsElectronics fixtures and trays that need PC heat resistance and static dissipation together[1]Chemical-plant fittings, semiconductor handling and parts needing outstanding UV and chemical resistance[2]
Printing Parameters
Bed temperature°CNot documented70–110 (3DXTech FluorX)[2]
Enclosure / chamber requirement1–5Enclosure required (passive)[7][8]Enclosure required (passive)[2]
Bed surface & adhesion aidPEI with a glue stick or a commercial adhesive[9]Not documented
Warping tendency1–5Severe — heated chamber needed[7][8]High — enclosure needed for reliable large parts[2]
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[9][10]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[10]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[7]Expert / industrial hardware only[2][3]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required[1]Brass fine indefinitely for unfilled grades[2]
Abrasiveness1–5Moderately abrasive — conductive carbon filler[1]Non-abrasive when unfilled[2]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[11]Low — 3DXTech lists no special nozzle concerns, no minimum layer height and states drying is not required[6]
Heat-creep / jam sensitivity1–5Slightly sensitive[9]Not documented
Hotend requirementAll-metal hot end required (Simplify3D)[9]Not documented
Other hardware wearNot documentedHydrogen fluoride released on overheating is extremely corrosive and will attack hotend and enclosure metalwork as well as people[3]
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[12][13][11]Negligible (<0.1 % EMC) — fluoropolymers are essentially non-hygroscopic[2]
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[14]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[10][14]Not applicable in practice — 3DXTech states drying is not required for PVDF, so there is no moisture-driven strength loss to measure[6]
Storage requirementAirtight containers with desiccant to prevent reabsorption[10]Not documented
Mechanical Properties
Tensile strength (XY)MPa68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[1][15][4]51 at break (printed XY, ISO 527)[2]
Young's modulusMPa2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[1][4]2450 (printed XY, ISO 527)[2]
Elongation at break%6 at break (printed XY, ISO 527), against 14 for the unfilled grade[1][15]25 at break (printed XY, ISO 527)[2]
Flexural strengthMPa95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[1][4]50 (printed XY, ISO 178)[2]
Flexural modulusMPa2310 (printed XY, ISO 178)[1]1800 (printed XY, ISO 178)[2]
Other impact dataNot documentedIzod 133 J/m on extruded PVDF stock, converted from 2.49 ft-lb/in (ASTM D256)[16]
Layer adhesion / Z tensileMPa32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[4]Not documented
Brittleness1–5Moderate[1]Tough — absorbs impact, yields before breaking[2]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[17]Rockwell M79 on extruded PVDF stock (ASTM D785)[16]
Creep resistance / sustained load1–5Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[18][4]Not documented
Elasticity / flexibility1–5Rigid[1]Slightly flexible in thin sections[2]
Z strength as % of XY%68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[4]Not documented
Thermal Properties
HDT at 0.45 MPa°C143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[4]149 on extruded PVDF stock (ASTM D648 at 66 psi; converted from 300 °F)[16]
HDT at 1.8 MPa°C140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[4]113 on extruded PVDF stock (ASTM D648 at 264 psi; converted from 235 °F)[16]
Glass transition (Tg)°C143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[1][4]Not documented
Melting point / Vicat°CNot documented170 melting (ISO 11357)[2]
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[13]149 long term and short term on extruded PVDF stock (converted from 300 °F)[16]
Thermal expansion (CTE)µm/m·K68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[17]127.8 (extruded PVDF stock, ASTM D696; source states 7.1e-5 in/in/°F) — the highest thermal expansion of any engineering polymer in this dataset[16]
Flammability / UL 94Not documentedUL 94 V-0 on extruded PVDF stock; Ensinger lists inherent flame resistance[16]
Environment & Chemical
UV resistance1–5Not documentedExcellent — designed for permanent outdoor use; Ensinger lists good UV and weather resistance and high gamma radiation resistance for PVDF stock[2][16]
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[10]Outstanding — resistant to most acids, solvents and oxidising agents, which is the reason to use it[2]
Water / humidity resistance in service1–5Not documentedExcellent — essentially unaffected[2]
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[10]Not documented
Biodegradability / compostabilityNot biodegradable[10]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[10]Not documented
Electrical & ESD propertiesSurface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[1][15]Not documented
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[19]Very high — toxic decomposition products; local exhaust mandatory. Above 315 °C thermal decomposition yields hydrofluoric acid, hydrogen cyanide and carbon monoxide[3]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[19]Not documented
Hazardous species emittedNot documentedAbove 315 °C: hydrofluoric acid, hydrogen cyanide, phenols, carbon monoxide, carbon dioxide and dense smoke. HF is extremely corrosive, its skin burns may not be immediately visible or painful, and exposure can be fatal by skin absorption, inhalation or ingestion[3]
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[19][7]Local exhaust to outside / fume hood — the SDS states local exhaust is preferred[3]
Dust & fibre handling hazardConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1]Molten polymer causes thermal burns and must not be pulled off the skin. If HF is detected during a decomposition event, cut the heat but keep the extraction running, ventilate, and clear non-essential people from the area[3]
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[9]Not documented
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[9]Not documented
Vapour / chemical smoothingNo practical vapour smoothing[9]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[9]Not documented
Dimensional accuracy & detailNot documentedThe processing window sits well below the 315 °C decomposition threshold, so nozzle temperature must be controlled rather than raised to chase flow[2][3]
Solvents & Solubility
Soluble inDichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[20]THF, MEK, DMF, DMAc, NMP, DMSO and trimethyl phosphate dissolve 5–10 wt% at ambient — Arkema's active solvents, all lab reagents.[21]
Softened or crazed byMethanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[20]Acetone, MIBK, cyclohexanone, butyl acetate and glycol ethers swell it; alkalis above pH 12 attack the homopolymer.[21][22]
Solvent welding & smoothing agentDichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[23]None for the workshop — the active solvents (NMP, DMAc, DMF) are laboratory reagents used for casting membranes, not joints.[21]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
  2. FluorX PVDF Technical Data Sheet v3 3DXTech · 2026-08 · tds
  3. FluorX PVDF Safety Data Sheet v1.1 3DXTech · 2026-08 · msds
  4. PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
  5. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  6. FluorX PVDF — product page 3DXTech · 2026-08 · vendor
  7. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  8. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  9. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  10. PC — material basics Polymaker Wiki · 2026-08 · doc
  11. 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
  12. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  13. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  14. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  15. ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
  16. TECAFLON PVDF natural — stock shape properties Ensinger · 2026-08 · tds
  17. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  18. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  19. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  20. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  21. Kynar PVDF — Design properties: solubility and irradiation (active and latent solvents) Arkema · 2026-08 · tds
  22. Kynar PVDF resin — chemical and fuel resistance Arkema · 2026-08 · tds
  23. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds