Filament comparison
PC-ESD vs PLA-PHA
Compare printing settings, strength, heat resistance, dated prices and sources.
2 selected · all documented properties
| Property | ESD-safe PCPC | PLA/PHA blendPLA |
|---|---|---|
| Market snapshot | ||
| Listing priceUSD/kg; dated snapshots | $180.00/kg median; $180.00–$180.00/kg across 1 dated product listings | $76.40/kg median; $76.40–$76.40/kg across 1 dated product listings |
| Identity & Market | ||
| Base polymer / chemistry | Polycarbonate compounded with a conductive filler for static-dissipative parts[1] | PLA blended with polyhydroxyalkanoate, a bacterially fermented bio-polyester[2] |
| Densityg/cm³ | 1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[1][3] | 1.2 (ISO 1183)[2] |
| Typical priceUSD/kg | 1 kg-equivalent spools cluster near 180[4] | Not documented |
| Price range across brandsUSD/kg | 180 at 3DXTech's 750 g pricing — the most expensive material in this group[4] | Not documented |
| Market availability1–5 | Special order, 1–2 makers worldwide[4] | Niche, a handful of specialist brands[2][5] |
| Spool sizes & diameters | 1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[4] | 1.75 and 2.85 mm; 750 g and 2200 g spools[2] |
| Typical applications | Electronics fixtures and trays that need PC heat resistance and static dissipation together[1] | General-purpose printing where PLA's brittleness is the limiting factor[2] |
| Printing Parameters | ||
| Nozzle temperature°C | Not documented | 195–220 (colorFabb)[2] |
| Bed temperature°C | Not documented | 50–60 (colorFabb)[2] |
| Enclosure / chamber requirement1–5 | Enclosure required (passive)[6][7] | Open frame is fine[2] |
| Part cooling fan | Not documented | 0–100 %; colorFabb states the blend runs on both heated and unheated beds[2][8] |
| Bed surface & adhesion aid | PEI with a glue stick or a commercial adhesive[9] | Not documented |
| Maximum volumetric flow (mm³/s; see test conditions)mm³/s | Not documented | 3.2–8 at colorFabb's 40–100 mm/s, on a 0.4 mm nozzle at 0.2 mm layer[8][10] |
| Warping tendency1–5 | Severe — heated chamber needed[6][7] | Not documented |
| Bed-adhesion difficulty1–5 | Needs a specific surface plus adhesive[9][11] | Not documented |
| Stringing / oozing tendency1–5 | Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[11] | Not documented |
| Overall printing difficulty1–5 | Advanced — enclosure, hardware upgrades, tuning[6] | Beginner — prints on any machine out of the box[2] |
| Hardware Wear & Reliability | ||
| Nozzle hardness required1–4 | Hardened steel required[1] | Brass fine indefinitely[2] |
| Abrasiveness1–5 | Moderately abrasive — conductive carbon filler[1] | Non-abrasive[2] |
| Nozzle clog risk1–5 | Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[12] | Very low — unfilled PLA blend; Prusa lists no drybox and no hardened nozzle for PLA[13] |
| Heat-creep / jam sensitivity1–5 | Slightly sensitive[9] | Not documented |
| Hotend requirement | All-metal hot end required (Simplify3D)[9] | Not documented |
| Moisture Behaviour | ||
| Moisture absorption (hygroscopicity)1–5 | Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[14][15][12] | Moderate — the PLA matrix takes up 0.40–0.51 % saturated; colorFabb publishes no figure for the blend[16][17] |
| Symptoms when wet | Bubbling and popping at the nozzle, stringing and a rough surface[18] | Not documented |
| Effect of moisture on strength | No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[11][18] | Polymaker rates PLA low-sensitivity and publishes no dry-versus-conditioned figures for this grade; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[18] |
| Storage requirement | Airtight containers with desiccant to prevent reabsorption[11] | Not documented |
| Mechanical Properties | ||
| Tensile strength (XY)MPa | 68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[1][19][3] | 62–64 (ISO 527-1A, colorFabb; two grades quoted)[2] |
| Young's modulusMPa | 2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[1][3] | 2960–3070 (ISO 527-1A, colorFabb)[2] |
| Elongation at break% | 6 at break (printed XY, ISO 527), against 14 for the unfilled grade[1][19] | 4 and 11 (ISO 527-1A, colorFabb; two grades quoted)[2] |
| Flexural strengthMPa | 95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[1][3] | Not documented |
| Flexural modulusMPa | 2310 (printed XY, ISO 178)[1] | 2500–3300 flexural modulus (ISO 178, colorFabb)[2] |
| Charpy impact, notchedkJ/m² | Not documented | 2.8–3.7 (ISO 179, notched, colorFabb)[2] |
| Layer adhesion / Z tensileMPa | 32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[3] | Not documented |
| Brittleness1–5 | Moderate[1] | Moderate — colorFabb positions the blend as tougher and less brittle than its generic PLA grades[2] |
| Hardness (scale-specific)Shore A / Shore D / Rockwell | Rockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[20] | Not documented |
| Creep resistance / sustained load1–5 | Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[21][3] | Poor — no PLA/PHA creep test; plain printed PLA sagged from 12 to 16.2–21.8 mm over 5 days at 1.25 kg[22][23][24] |
| Fatigue / repeated-flex resistance1–5 | Not documented | Below average — no S-N curve for the blend; colorFabb positions it as tougher and less brittle than its generic PLA, which ran 38 000–49 000 cycles at 30 % of tensile strength[25][2] |
| Elasticity / flexibility1–5 | Rigid[1] | Rigid[2] |
| Z strength as % of XY% | 68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[3] | Not documented |
| Thermal Properties | ||
| HDT at 0.45 MPa°C | 143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[3] | Not documented |
| HDT at 1.8 MPa°C | 140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[3] | Not documented |
| Glass transition (Tg)°C | 143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[1][3] | Not documented |
| Melting point / Vicat°C | Not documented | Above 155 melting (ISO 3146-C)[2] |
| Continuous service temperature°C | 113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[15] | Not documented |
| Thermal expansion (CTE)µm/m·K | 68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[20] | Not documented |
| Environment & Chemical | ||
| UV resistance1–5 | Not documented | Degrades within weeks outdoors[26] |
| Chemical resistance | Withstands oils, solvents and fuels; Polymaker rates it good against weak acids[11] | Not documented |
| Food contact | Bisphenol-A polycarbonate is not offered as food-contact filament[11] | Not documented |
| Biodegradability / compostability | Not biodegradable[11] | colorFabb states the PHA component is 100 % biodegradable[2] |
| Recyclability | Mechanically recyclable but not accepted in household plastic collection[11] | Not documented |
| Electrical & ESD properties | Surface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[1][19] | Not documented |
| Health & Safety | ||
| Fume toxicity1–5 | Moderate — measurable VOCs and UFPs, ventilation advised[27] | Low hazard — minimal VOC and particle emission[27] |
| Ultrafine-particle emission rateparticles/min | ≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[27] | Not documented |
| Ventilation / filtration requirement1–5 | Ventilated room or enclosure recommended[27][6] | None needed in a normal room[27] |
| Dust & fibre handling hazard | Conductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1] | Not documented |
| Post-Processing | ||
| Sanding & machining | Sands and machines well; the toughness means it cuts rather than chips[9] | Not documented |
| Gluing & solvent welding | Cyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[9] | Not documented |
| Vapour / chemical smoothing | No practical vapour smoothing[9] | Not documented |
| Support material pairing | Prints its own supports; 3DXTech sells a dedicated PC break-away support[9] | Not documented |
| Solvents & Solubility | ||
| Soluble in | Dichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[28] | Chloroform dissolves the PLA phase (10 % w/v, 2–4 h at 23 °C); THF and DMF need 65 °C. Laboratory reagents.[29] |
| Softened or crazed by | Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[28] | Acetone, ethyl acetate and toluene plasticise it but dissolve <1 % even at 65 °C; submersion in acetone crazes and destroys parts.[29][30] |
| Solvent welding & smoothing agent | Dichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[31] | Chloroform vapour smooths and welds PLA at the cost of tensile strength; acetone does not smooth it at all.[32][30] |
Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
- PLA/PHA technical data sheet colorFabb · 2026-08 · tds
- PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
- 3DXTech product catalogue 3DXTech · 2026-08 · vendor
- woodFill technical data sheet colorFabb · 2026-08 · tds
- ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
- PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
- glowFill technical data sheet colorFabb · 2026-08 · tds
- Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
- PC — material basics Polymaker Wiki · 2026-08 · doc
- 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
- Filament Material Guide Prusa Knowledge Base · 2026-08 · doc
- Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
- Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
- Bambu Filament Technical Data Sheet V3.0 — PLA Basic Bambu Lab · 2026-08 · tds
- PolyLite PLA Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
- Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
- ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
- TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
- Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
- BambuLab PLA Basic vs PLA Tough vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
- Polymaker PLA Pro vs PLA-CF — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
- Carbon Fiber PLA vs META-PLA vs PLA+ vs PLA by Sunlu — results spreadsheet My Tech Fun (Igor Gaspar) · 2026-08 · test
- Mechanical Properties of Additively Manufactured Polymeric Materials — PLA and PETG — For Biomechanical Applications Polymers 16(13):1868 · 2024-06 · paper
- PLA — material guide Prusa Knowledge Base · 2026-08 · doc
- Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
- Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
- Solubility Study of Ingeo Biopolymer Grades in Common Organic Solvents (NWPD003) NatureWorks · 2019-10 · tds
- Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc
- Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds
- Effect of vapour smoothing in trichloromethane on 3D printed PLA — surface, mechanical and chemical structure Pitale, Keche & Chopra, Engineering Research Express 6(4) 045579 · 2024-12 · paper