3D Printing Info

Filament comparison

PC-ESD vs PEEK

Compare printing settings, strength, heat resistance, dated prices and sources.

ESD-safe PC guidePEEK guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-ESD comparisonsMore PEEK comparisons
PC-ESD vs PEEK — documented properties and sources
PropertyESD-safe PCPCPEEKHIGHTEMP
Market snapshot
Listing priceUSD/kg; dated snapshots$180.00/kg median; $180.00–$180.00/kg across 1 dated product listings$531.87/kg median; $296.14–$770.00/kg across 5 dated product listings
Identity & Market
Base polymer / chemistryPolycarbonate compounded with a conductive filler for static-dissipative parts[1]Polyether ether ketone — a semi-crystalline polyaryletherketone[2]
Densityg/cm³1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[1][3]1.30 (ISO 1183)[2][4]
Typical priceUSD/kg1 kg-equivalent spools cluster near 180[5]1 kg-equivalent spools span 296–770; the middle of the market is about 532[5][6][7]
Price range across brandsUSD/kg180 at 3DXTech's 750 g pricing — the most expensive material in this group[5]296-770 across brands and spool sizes; 3D4Makers recycled R-PEEK 296 at 750 g, IEMAI 3D 420 at 1 kg, LEHVOSS Luvocom 3F PEEK 9581 532 at 2 kg, 3DXTech ThermaX PEEK 770 at 500 g[5][6][7]
Market availability1–5Special order, 1–2 makers worldwide[5]Niche, a handful of specialist brands[5][6][4]
Spool sizes & diameters1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[5]1.75 and 2.85 mm; 200 g to 2 kg spools[5][6][4]
Typical applicationsElectronics fixtures and trays that need PC heat resistance and static dissipation together[1]Aerospace brackets, semiconductor handling, sterilisable medical tooling and downhole parts[2]
Printing Parameters
Nozzle temperature°CNot documented380-400 (3DXTech printed-specimen conditions); Victrex quotes a 340-450 melt range for AM 450 FIL[2][4]
Bed temperature°CNot documented130–140 (3DXTech)[2]
Enclosure / chamber requirement1–5Enclosure required (passive)[8][9]Actively heated chamber required[10][11]
Recommended chamber temperature°CNot documentedNot less than 150 for semi-crystalline printing (Victrex AM 450 FIL); bed above 150[4]
Bed surface & adhesion aidPEI with a glue stick or a commercial adhesive[12]Not documented
Warping tendency1–5Severe — heated chamber needed[8][9]Severe — heated chamber needed[10]
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[12][13]Very difficult — special plates or slurry required[10]
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[13]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[8]Expert / industrial hardware only[10][11]
Extruder requirementNot documentedAn all-metal hot end rated above 400 °C and a heated chamber; 3DXTech tests at 0.25 mm layer height on a 0.4 mm nozzle[2][10]
Hardware Wear & Reliability
Nozzle hardness required1–4Hardened steel required[1]Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[10]
Abrasiveness1–5Moderately abrasive — conductive carbon filler[1]Non-abrasive when unfilled[2]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[14]Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[15]
Heat-creep / jam sensitivity1–5Slightly sensitive[12]Not documented
Hotend requirementAll-metal hot end required (Simplify3D)[12]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[16][17][14]Not documented
Equilibrium moisture content at ~50 % RH%Not documented0.45 at saturation, 23 °C (ISO 62); 0.55 at 100 °C[4]
Drying temperature & timeNot documented120 °C for 5 h, target below 0.020 % moisture (Victrex AM 450 FIL)[4]
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[18]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[13][18]No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[15]
Storage requirementAirtight containers with desiccant to prevent reabsorption[13]Not documented
Mechanical Properties
Tensile strength (XY)MPa68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[1][19][3]60-100 (printed XY): Victrex AM 450 FIL 60-80 at yield and 3DXTech 100, both ISO 527; 98 at yield injection-moulded[2][4]
Young's modulusMPa2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[1][3]3000-4000 (printed XY, ISO 527, Victrex AM 450 FIL); 3720 (3DXTech); 4000 injection-moulded[2][4]
Elongation at break%6 at break (printed XY, ISO 527), against 14 for the unfilled grade[1][19]28 (printed XY, ISO 527) — remarkably ductile for a high-temperature polymer[2]
Flexural strengthMPa95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[1][3]130 (printed XY, ISO 178)[2]
Flexural modulusMPa2310 (printed XY, ISO 178)[1]2700 (printed XY, ISO 178)[2]
Charpy impact, notchedkJ/m²Not documented6.0 (injection-moulded, ISO 179/1eA); unnotched does not break[4]
Other impact dataNot documentedIzod notched 7.0 kJ/m2 injection-moulded (ISO 180/A). Printed anisotropy is extreme: VICTREX AM 200 on a Stratasys F900 gives Izod notched 1380-1530 J/m XZ against 30-62 J/m ZX (ASTM D256)[4][20]
Layer adhesion / Z tensileMPa32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[3]20-85 at yield (printed ZX, ISO 527, Victrex AM 450 FIL); the spread is set by chamber temperature and weld quality[4]
Brittleness1–5Moderate[1]Tough — absorbs impact, yields before breaking[2]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[21]Shore D 84.5 (injection-moulded, ISO 868); Rockwell M100 / R125 on extruded PEEK stock (ASTM D785)[4][22]
Creep resistance / sustained load1–5Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[23][3]Excellent — holds load for years. Victrex rates PEEK for long-term creep; injection-moulded flexural stress at 3.5 % strain falls only from 125 MPa at 23 °C to 85 MPa at 125 °C, and extruded stock is rated to 249 °C continuous[24][4][22]
Fatigue / repeated-flex resistance1–5Not documentedExcellent — living hinges viable. Victrex rates PEEK for long-term fatigue as well as creep[24]
Elasticity / flexibility1–5Rigid[1]Rigid[2]
Z strength as % of XY%68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[3]71-84 (VICTREX AM 200 LMPAEK printed on the Stratasys F900 and Fortus 450mc, ZX against XZ tensile yield, ASTM D638); unfilled PEEK's own ZX spread is wider[20]
Thermal Properties
HDT at 0.45 MPa°C143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[3]140 (printed XY, ISO 75 at 0.45 MPa, 3DXTech)[2]
HDT at 1.8 MPa°C140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[3]152 (unannealed, ISO 75-2/Af, Victrex AM 450 FIL); 160 on extruded stock (ASTM D648 at 264 psi)[4][22]
Glass transition (Tg)°C143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[1][3]143 (DSC, 3DXTech); Victrex gives onset 143 and midpoint 150 (ISO 11357-2)[2][4]
Melting point / Vicat°CNot documented343 melting (ISO 11357-3, Victrex); VICTREX AM 200 LMPAEK melts at 303[4][20]
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[17]240 UL 746B relative thermal index, strength (RTI electrical 260, impact 180); Ensinger rates extruded PEEK stock at 249 long term[4][22]
Thermal expansion (CTE)µm/m·K68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[21]37.8 (extruded PEEK stock, 23-60 °C, ASTM E831; source states 2.1e-5 in/in/°F), rising to 41.9 at 60-100 °C and 55.8 at 100-150 °C[22]
Flammability / UL 94Not documentedUL 94 V-0 at 1.5 mm on the base resin; glow-wire flammability index 960 °C at 2.0 mm (IEC 60695-2-12)[2][4]
Environment & Chemical
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[13]Outstanding — resistant to almost all solvents and to steam sterilisation[2]
Water / humidity resistance in service1–5Not documentedExcellent — essentially unaffected; 0.45 % water at saturation and resistant to steam sterilisation[4][2]
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[13]Not documented
Biodegradability / compostabilityNot biodegradable[13]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[13]Not documented
Electrical & ESD propertiesSurface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[1][19]Not documented
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[25]Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[25]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[25]Not documented
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[25][8]Ventilated room or enclosure recommended[25]
Dust & fibre handling hazardConductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1]Not documented
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[12]Not documented
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[12]Not documented
Vapour / chemical smoothingNo practical vapour smoothing[12]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[12]Not documented
Solvents & Solubility
Soluble inDichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[26]95–98 wt% sulphuric acid dissolves it — 10 g per 100 mL at 40–70 °C gives a dark red solution. Laboratory route only.[27][28]
Softened or crazed byMethanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[26]Concentrated nitric, hydrofluoric, hydrobromic and hydriodic acids attack it; DCM, DMSO and THF swell thin-walled sections.[29][28]
Solvent welding & smoothing agentDichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[30]None — no solvent softens PEEK, so parts are joined thermally or mechanically, never chemically.[29][28]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
  2. ThermaX PEEK Technical Data Sheet v3 3DXTech · 2026-08 · tds
  3. PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
  4. VICTREX AM 450 FIL — datasheet Victrex · 2025-12 · tds
  5. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  6. 3D4Makers product catalogue 3D4Makers · 2026-08 · vendor
  7. IEMAI 3D PEEK 3D Printing Filament — store page IEMAI 3D · 2026-08 · vendor
  8. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  9. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  10. Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
  11. Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
  12. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  13. PC — material basics Polymaker Wiki · 2026-08 · doc
  14. 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
  15. ThermaX PEEK — product page 3DXTech · 2026-08 · vendor
  16. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  17. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  18. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  19. ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
  20. VICTREX AM 200 — FDM Material Data Sheet Stratasys · 2024-04 · tds
  21. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  22. TECAPEEK natural (PEEK) — stock shape properties Ensinger · 2026-08 · tds
  23. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  24. PEEK polymers — product overview Victrex · 2026-08 · doc
  25. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  26. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  27. The Effects of Sulfonated Poly(ether ether ketone) Ion Exchange Preparation Conditions on Membrane Properties Yee, Zhang & Ladewig, Membranes 3(3) 182–195 · 2013-07 · paper
  28. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  29. What solvents are not compatible with PEEK? — fluidics technical FAQ IDEX Health & Science · 2026-08 · doc
  30. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds