3D Printing Info

Filament comparison

PC-ABS vs PC-GF

Compare printing settings, strength, heat resistance, dated prices and sources.

PC/ABS blend guideGlass-fibre PC (PC-GF) guide

2 selected · all documented properties

Open these two in the interactive comparisonMore PC-ABS comparisonsMore PC-GF comparisons
PC-ABS vs PC-GF — documented properties and sources
PropertyPC/ABS blendPCGlass-fibre PC (PC-GF)PC
Market snapshot
Listing priceUSD/kg; dated snapshots$45.99/kg median; $34.99–$84.00/kg across 5 dated product listings$71.27/kg median; $71.27–$71.27/kg across 1 dated product listings
Identity & Market
Base polymer / chemistryPolycarbonate/ABS alloy — PC stiffness and heat resistance with ABS processability[1][2]Polycarbonate reinforced with 30 wt% short glass fibre[3]
Densityg/cm³1.10 (Polymaker) and 1.24 (3DXTech FR grade), ISO 1183; Stratasys specific gravity 1.10 (ASTM D792)[1][2][4]1.17 (measured on a 100 % infill printed part, ISO 1183-A)[3]
Typical priceUSD/kg1 kg spools cluster near 50[5][6]1 kg spools cluster near 71[7]
Price range across brandsUSD/kg35–84 across brands; Reli3D 35, SUNLU 46, Polymaker 50, 3DXMAX 84[5][6][8][9]71 — BASF Ultrafuse PC GF30 at igo3d is the only priced listing found; Owens Corning sells XSTRAND GF30-PC in 500 g and 1 kg[7][3]
Market availability1–5Available from several mainstream brands[5][6]Niche, a handful of specialist brands — neither Polymaker's nor 3DXTech's polycarbonate range contains a glass-fibre grade, but BASF Forward AM and Owens Corning both sell one through European retail[7][3][5][6]
Spool sizes & diameters1.75 and 2.85 mm; 0.5 and 1 kg spools[5][6]1.75 and 2.85 mm at +/- 0.05 mm; 500 g and 1 kg net spools[3]
Typical applicationsAutomotive interior and electronics housings that need PC heat resistance without PC's warping[1]Functional prototyping for mechanical engineering, electronics and automotive[3]
Diameter tolerance± mmNot documented+/- 0.05 (Owens Corning XSTRAND)[3]
Printing Parameters
Nozzle temperature°C250–270 (Polymaker)[1]280-330 (Owens Corning XSTRAND GF30-PC)[3]
Bed temperature°C90–105 (Polymaker)[1]80-110 (Owens Corning XSTRAND GF30-PC)[3]
Enclosure / chamber requirement1–5Enclosure required (passive) — Polymaker specifies a 90–100 °C chamber[1]Enclosure required (passive) — as for unfilled PC[10][11]
Recommended chamber temperature°C90–100 (Polymaker)[1]Not documented
Part cooling fanOff (Polymaker)[1]Not documented
Bed surface & adhesion aidPEI with a glue stick or a commercial adhesive[12]Perforated plate, DimaFix or Magigoo PC glue (Owens Corning)[3]
Maximum volumetric flow (mm³/s; see test conditions)mm³/s20 at Polymaker's 250 mm/s cap on a 0.4 mm nozzle at 0.2 mm layer[1][13]Not documented
Warping tendency1–5High — enclosure needed for reliable large parts[1][11]Not documented
Bed-adhesion difficulty1–5Needs a specific surface plus adhesive[12][14]Not documented
Stringing / oozing tendency1–5Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[14]Not documented
Overall printing difficulty1–5Advanced — enclosure, hardware upgrades, tuning[1][11]Not documented
Extruder requirementNot documentedOwens Corning specifies a nozzle above 0.4 mm and hardened steel nozzles and drive wheels[3]
Hardware Wear & Reliability
Nozzle hardness required1–4Brass fine indefinitely[11]Hardened steel required — Owens Corning states glass reinforcement shortens brass nozzle and drive-wheel life[3]
Abrasiveness1–5Non-abrasive[1]Highly abrasive — 30 wt% glass fibre[3]
Nozzle clog risk1–5Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry of 4 h or more[15]High — jams from moisture, heat creep or particles; PC already absorbs water from the air and Prusa lists glass-filled composites as a higher clogging risk[16][12]
Heat-creep / jam sensitivity1–5Slightly sensitive[12]Not documented
Hotend requirementAll-metal hot end required (Simplify3D)[12]Not documented
Moisture Behaviour
Moisture absorption (hygroscopicity)1–5Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h or more pre-dry[17][18][15]Negligible (<0.1 % EMC) — Owens Corning measures below 0.1 % at 23 °C and 50 % RH (ISO 62)[3]
Equilibrium moisture content at ~50 % RH%Not documentedBelow 0.1 at 23 °C and 50 % RH, and below 0.1 at saturation (ISO 62)[3]
Drying temperature & time75 °C for 6 h (Polymaker)[1]Not documented
Symptoms when wetBubbling and popping at the nozzle, stringing and a rough surface[19]Not documented
Effect of moisture on strengthNo dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[14][19]No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic; absorbed water flashes to steam and shows as bubbling and poor layer adhesion[14][19]
Storage requirementAirtight containers with desiccant to prevent reabsorption[14]Not documented
Mechanical Properties
Tensile strength (XY)MPa39.9 ± 1.0 printed XY, ISO 527 (Polymaker); 3DXTech quotes 60 at break for its FR PC/ABS[1][2]65 at break (printed, ISO 527 at 1 mm/min)[3]
Young's modulusMPa1835 ± 65 printed XY, ISO 527 (Polymaker); 3DXTech quotes 2250[1][2]5400 (printed, ISO 527 at 1 mm/min)[3]
Elongation at break%4.2 ± 0.3 printed XY, ISO 527 (Polymaker); 3DXTech quotes 10 at break[1][2]2.5 at break (printed, ISO 527 at 1 mm/min)[3]
Flexural strengthMPa66.3 ± 0.9 printed XY, ISO 178 (Polymaker); 3DXTech quotes 85[1][2]113 at yield (printed, ISO 178 at 2 mm/min)[3]
Flexural modulusMPa2081 ± 106 printed XY, ISO 178 (Polymaker); 3DXTech quotes 2300[1][2]5500 (printed, ISO 178 at 2 mm/min)[3]
Charpy impact, notchedkJ/m²25.8 ± 1.3 printed XY, ISO 179, notched (Polymaker) — above both unfilled PC and ABS[1]Not documented
Other impact dataNotched Charpy still 13 ± 2 kJ/m² at −30 °C printed XY (Polymaker, ISO 179-1/1eA), against 1.5 in Z. Stratasys prints Izod notched at 241 J/m XZ against 34.0 J/m ZX, and unnotched 655 against 101 J/m (ASTM D256, F900 T16).[1][4]Not documented
Layer adhesion / Z tensileMPa25.9-30.2 at break printed ZX (Stratasys, ASTM D638 on the F900 and Fortus 450mc); 22.9 +/- 1.2 printed Z, ISO 527 (Polymaker)[1][4]Not documented
Brittleness1–5Tough — absorbs impact, yields before breaking[1]Brittle — snaps with little warning; 2.5 % elongation at break[3]
Hardness (scale-specific)Shore A / Shore D / RockwellRockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a PC/ABS filament[20]Rockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for a glass-fibre grade[20]
Creep resistance / sustained load1–5Good. Room-temperature tensile creep of moulded PC/ABS was still running unbroken at 30 MPa when the experiment was stopped for time; specimens failed within the test window at 39-47 MPa (ASTM D638)[21]Excellent — holds load for years. Room-temperature tensile creep of moulded unfilled PC ran unbroken at 41 MPa until the test was stopped, and 30 wt% glass raises the tensile modulus from about 2.3 to 5.4 GPa[21][3]
Elasticity / flexibility1–5Rigid[1]Rigid[3]
Z strength as % of XY%75-86 (Stratasys ZX against XZ tensile at break, ASTM D638) against 57 (Polymaker, printed Z against XY tensile)[1][4]Not documented
Thermal Properties
HDT at 0.45 MPa°C112 (ISO 75 at 0.45 MPa, Polymaker); Stratasys prints 117.9 in XY and 126.1 in XZ (ASTM D648 Method B at 66 psi), against 125.0 moulded[1][4]Not documented
HDT at 1.8 MPa°C106 (ISO 75 at 1.8 MPa, Polymaker); Stratasys prints 107.5 in XY and 112.0 in XZ (ASTM D648 Method B at 264 psi), against 102.9 moulded[1][4]137 (printed, ISO 75 Method A at 1.8 MPa)[3]
Glass transition (Tg)°C109 (Polymaker) and 137 (3DXTech FR grade), DSC; Stratasys measures 105.3 (ASTM D7426 inflection point)[1][2][4]145 (DSC, ISO 11357)[3]
Melting point / Vicat°CAmorphous — no melting point; Vicat 135 (Polymaker, ISO 306)[1]270 stated as melting point (ISO 11357) — unusual for an amorphous polymer, but this is the published figure[3]
Continuous service temperature°C113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[18]Not documented
Annealing response90 °C for 2 h (Polymaker)[1]Not documented
Thermal expansion (CTE)µm/m·K59.9 over -50 to 35 °C and 73.0 over -50 to 95 °C (printed XY, ASTM E831)[4]26.2 in XY and 77.4 in Z (printed, ISO 11359-2) — a threefold anisotropy, and the lowest in-plane expansion of any polycarbonate here[3]
Flammability / UL 94Not documentedUL 94 V-0 verified (Owens Corning)[3]
Environment & Chemical
UV resistance1–5Degrades within weeks outdoors[14]Good — years with some colour shift. Owens Corning lists UV resistance as a product benefit but publishes no exposure data[3]
Chemical resistanceWithstands oils, solvents and fuels; Polymaker rates it good against weak acids[14]Not documented
Water / humidity resistance in service1–5Not documentedExcellent — essentially unaffected; below 0.1 % water at saturation (ISO 62)[3]
Food contactBisphenol-A polycarbonate is not offered as food-contact filament[14]Not documented
Biodegradability / compostabilityNot biodegradable[14]Not documented
RecyclabilityMechanically recyclable but not accepted in household plastic collection[14]Not documented
Electrical & ESD propertiesNot documentedElectrically insulating (Owens Corning)[3]
Health & Safety
Fume toxicity1–5Moderate — measurable VOCs and UFPs, ventilation advised[22]Moderate — measurable VOCs and UFPs, ventilation advised[22]
Ultrafine-particle emission rateparticles/min≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[22]≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[22]
Ventilation / filtration requirement1–5Ventilated room or enclosure recommended[22][11]Ventilated room or enclosure recommended[22][11]
Dust & fibre handling hazardNot documentedOwens Corning warns that the glass reinforcement is abrasive when melted and advises sufficient ventilation and avoiding extrusion fumes[3]
Post-Processing
Sanding & machiningSands and machines well; the toughness means it cuts rather than chips[12]Not documented
Gluing & solvent weldingCyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[12]Not documented
Vapour / chemical smoothingAcetone attacks the ABS phase, so surface smoothing is partial rather than full[1]Not documented
Support material pairingPrints its own supports; 3DXTech sells a dedicated PC break-away support[12]Not documented
Dimensional accuracy & detailNot documentedHigh dimensional stability is the headline benefit; the 26.2 um/m*K in-plane CTE is a third of unfilled PC's[3]
Solvents & Solubility
Soluble inDichloromethane and chloroform dissolve the PC phase; acetone, MEK and THF dissolve the ABS phase.[23][24]Dichloromethane and chloroform dissolve the matrix and leave the fibre; DMF and dioxane do the same (Covestro).[23]
Softened or crazed byPetrol, esters, ether and 1 % alkali stress-crack the PC phase; aromatics and esters soften the ABS phase.[23][24]Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[23]
Solvent welding & smoothing agentAcetone attacks only the ABS phase, so smoothing is partial; a dichloromethane cement welds the whole section.[1][25]Dichloromethane cement welds the resin, but the fibre keeps the joint from flowing closed. Controlled carcinogen.[25]

Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Polymaker PC-ABS Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  2. Firewire Flame Retardant PC/ABS Technical Data Sheet Rev 3.0 3DXTech · 2026-08 · tds
  3. XSTRAND GF30-PC Data Sheet Owens Corning · 2019-04 · tds
  4. PC-ABS — FDM Material Data Sheet Stratasys · 2023-08 · tds
  5. Polymaker product catalogue Polymaker · 2026-08 · vendor
  6. 3DXTech product catalogue 3DXTech · 2026-08 · vendor
  7. BASF Ultrafuse PC GF30 Black 2.85 mm 1.000 g igo3d · 2026-08 · vendor
  8. Reli3D PC-ABS Filament, Black, 1000 g spool Reli3D (Amazon US) · 2026-08 · vendor
  9. SUNLU PC-ABS 3D Printer Filament 1 kg SUNLU · 2026-08 · vendor
  10. PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
  11. ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
  12. Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
  13. Max volumetric speed Prusa Knowledge Base · 2026-08 · doc
  14. PC — material basics Polymaker Wiki · 2026-08 · doc
  15. 3DXTech 3DXMAX ABS product page 3DXTech · 2026-08 · vendor
  16. Composite materials filled with carbon, kevlar or glass Prusa Knowledge Base · 2026-08 · doc
  17. Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
  18. Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
  19. Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
  20. TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
  21. Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
  22. Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
  23. Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
  24. Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
  25. Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds