Filament comparison
PA6/66 vs PC-ESD
Compare printing settings, strength, heat resistance, dated prices and sources.
2 selected · all documented properties
| Property | PA66 (Nylon 66)PA | ESD-safe PCPC |
|---|---|---|
| Market snapshot | ||
| Listing priceUSD/kg; dated snapshots | Not documented | $180.00/kg median; $180.00–$180.00/kg across 1 dated product listings |
| Identity & Market | ||
| Base polymer / chemistry | Polyamide 66, condensed from hexamethylenediamine and adipic acid; melts around 40 °C above PA6[1] | Polycarbonate compounded with a conductive filler for static-dissipative parts[2] |
| Densityg/cm³ | 1.14 (extruded unfilled PA66 stock)[3] | 1.24 (ISO 1183, 3DXTech); Stratasys specific gravity 1.195 (ASTM D792)[2][4] |
| Typical priceUSD/kg | Not documented | 1 kg-equivalent spools cluster near 180[5] |
| Price range across brandsUSD/kg | Not documented | 180 at 3DXTech's 750 g pricing — the most expensive material in this group[5] |
| Market availability1–5 | Special order, 1–2 makers worldwide — no unfilled PA66 filament appeared in any catalogue searched, and the 3DXTech nylon range offers PA6, PA12 and a 6/66 copolymer but no straight PA66[5][6] | Special order, 1–2 makers worldwide[5] |
| Spool sizes & diameters | Not documented | 1.75 and 2.85 mm; 750 g spools plus Stratasys-compatible cartridges[5] |
| Typical applications | Not documented | Electronics fixtures and trays that need PC heat resistance and static dissipation together[2] |
| Printing Parameters | ||
| Enclosure / chamber requirement1–5 | Enclosure required (passive)[1] | Enclosure required (passive)[7][8] |
| Bed surface & adhesion aid | Not documented | PEI with a glue stick or a commercial adhesive[9] |
| Warping tendency1–5 | Not documented | Severe — heated chamber needed[7][8] |
| Bed-adhesion difficulty1–5 | Not documented | Needs a specific surface plus adhesive[9][10] |
| Stringing / oozing tendency1–5 | Not documented | Moderate — retraction tuning needed; Polymaker flags stringing as a common PC problem[10] |
| Overall printing difficulty1–5 | Advanced — enclosure, hardware upgrades, tuning[1] | Advanced — enclosure, hardware upgrades, tuning[7] |
| Hardware Wear & Reliability | ||
| Nozzle hardness required1–4 | Not documented | Hardened steel required[2] |
| Abrasiveness1–5 | Not documented | Moderately abrasive — conductive carbon filler[2] |
| Nozzle clog risk1–5 | Very high — frequent jams without careful setup[11][12] | Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a 120 °C pre-dry[13] |
| Heat-creep / jam sensitivity1–5 | Not documented | Slightly sensitive[9] |
| Hotend requirement | Not documented | All-metal hot end required (Simplify3D)[9] |
| Moisture Behaviour | ||
| Moisture absorption (hygroscopicity)1–5 | Very high (>2 %)[12] | Low (0.1–0.3 %) — the PC matrix takes up 0.15–0.25 % and 3DXTech specifies a 120 °C, 4 h pre-dry[14][15][13] |
| Equilibrium moisture content at ~50 % RH% | 8.5 at saturation on extruded PA66 stock (ASTM D570) — the highest uptake of any polymer in this dataset[3] | Not documented |
| Symptoms when wet | Not documented | Bubbling and popping at the nozzle, stringing and a rough surface[12] |
| Effect of moisture on strength | Measured dry against wet on printed specimens at 6.16 % moisture (Polymaker CoPA): tensile 78.0 → 34.3 MPa, Young's modulus 2703 → 724 MPa, flexural strength 109.8 → 22.6 MPa, while notched Charpy rises 6.9 → 27.7 kJ/m² and elongation 12.7 → 13.2 %[16][11] | No dry-versus-conditioned figures are published. Polymaker calls PC highly hygroscopic and requires a 70–80 °C dry for 6–8 h; run wet, the loss shows as surface defects and poor layer adhesion[10][12] |
| Storage requirement | Not documented | Airtight containers with desiccant to prevent reabsorption[10] |
| Mechanical Properties | ||
| Tensile strength (XY)MPa | 82.7 at yield and 84.8 at break on extruded PA66 stock (ASTM D638; converted from 12,000 and 12,300 psi) — no printed figure exists because no unfilled PA66 filament was found[3] | 68 at break (printed XY, ISO 527, 3DXTech) — above the 58 of 3DXTech's unfilled ezPC; Stratasys prints 47.6-49.4 at yield in XZ (ASTM D638)[2][17][4] |
| Young's modulusMPa | 2413 on extruded PA66 stock (ASTM D638; converted from 350,000 psi)[3] | 2300 (printed XY, ISO 527); Stratasys prints 1960 in XZ and 1810-1910 in ZX (ASTM D638)[2][4] |
| Elongation at break% | 50 at break on extruded PA66 stock (ASTM D638)[3] | 6 at break (printed XY, ISO 527), against 14 for the unfilled grade[2][17] |
| Flexural strengthMPa | 113.8 on extruded PA66 stock (ASTM D790; converted from 16,500 psi)[3] | 95 (printed XY, ISO 178); Stratasys prints 82.6-83.2 at break in XZ against 46.3-49.5 in ZX (ASTM D790)[2][4] |
| Flexural modulusMPa | 3034 on extruded PA66 stock (ASTM D790; converted from 440,000 psi)[3] | 2310 (printed XY, ISO 178)[2] |
| Other impact data | Izod 53 J/m on extruded PA66 stock, converted from 1.0 ft-lb/in (ASTM D256)[3] | Not documented |
| Layer adhesion / Z tensileMPa | Not documented | 32.5-37.9 at yield printed ZX (Stratasys, ASTM D638 on the Fortus 450mc and F900)[4] |
| Brittleness1–5 | Not documented | Moderate[2] |
| Hardness (scale-specific)Shore A / Shore D / Rockwell | Shore D 86 and Rockwell 85 (108) — the source does not name the scales on extruded PA66 stock (ASTM D2240, D785)[3] | Rockwell 70 (118) — the source does not name the scales and Shore D 79 on extruded unfilled PC stock (ASTM D785, D2240); no figure is published for an ESD grade[18] |
| Creep resistance / sustained load1–5 | Not documented | Excellent — holds load for years. Moulded unfilled PC was still running unbroken under 41 MPa tensile creep at room temperature when the test was stopped, and the conductive filler leaves the glass transition unchanged at 142 °C, so the creep mechanism is polycarbonate's[19][4] |
| Fatigue / repeated-flex resistance1–5 | Excellent — living hinges viable[1] | Not documented |
| Elasticity / flexibility1–5 | Semi-flexible[11] | Rigid[2] |
| Z strength as % of XY% | Not documented | 68-77 (Stratasys ZX against XZ tensile yield, ASTM D638)[4] |
| Wear resistance & friction | Wear factor 200e-10 in3*min/(ft*lb*h) on extruded PA66 stock (ASTM D3702); Ensinger lists very good slide and wear properties[3] | Not documented |
| Thermal Properties | ||
| HDT at 0.45 MPa°C | 232 on extruded PA66 stock (ASTM D648 at 66 psi; converted from 450 °F)[3] | 143-146 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 66 psi); 135 moulded[4] |
| HDT at 1.8 MPa°C | 90 on extruded PA66 stock (ASTM D648 at 264 psi; converted from 194 °F) — the gap to the 0.45 MPa figure is the widest in the dataset[3] | 140-144 printed in XY, XZ and ZX (Stratasys, ASTM D648 Method B at 264 psi); 124 moulded[4] |
| Glass transition (Tg)°C | Not documented | 143 (DSC, 3DXTech) and 142 (Stratasys, ASTM D7426)[2][4] |
| Melting point / Vicat°C | 255 melting on extruded PA66 stock (ASTM D2133; converted from 491 °F)[3] | Not documented |
| Continuous service temperature°C | 85 long term and 149 short term on extruded PA66 stock (converted from 185 °F and 300 °F)[3] | 113 — Prusa publishes this as the temperature resistance of Prusament PC Blend[15] |
| Thermal expansion (CTE)µm/m·K | 81.0 (extruded PA66 stock, ASTM D696; source states 4.5e-5 in/in/°F)[3] | 68.4 on extruded unfilled PC stock (ASTM D696; source states 3.8e-5 in/in/°F); no figure is published for a conductive-filled grade[18] |
| Flammability / UL 94 | UL 94 V-2 on extruded PA66 stock[3] | Not documented |
| Environment & Chemical | ||
| Chemical resistance | Not documented | Withstands oils, solvents and fuels; Polymaker rates it good against weak acids[10] |
| Food contact | Not documented | Bisphenol-A polycarbonate is not offered as food-contact filament[10] |
| Biodegradability / compostability | Not documented | Not biodegradable[10] |
| Recyclability | Not documented | Mechanically recyclable but not accepted in household plastic collection[10] |
| Electrical & ESD properties | Volume resistance 1e15 ohm-cm and dielectric constant 4 on extruded PA66 stock (ASTM D257, D150)[3] | Surface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ezPC[2][17] |
| Health & Safety | ||
| Fume toxicity1–5 | Moderate — measurable VOCs and UFPs, ventilation advised[20] | Moderate — measurable VOCs and UFPs, ventilation advised[20] |
| VOC emission rateµg/min | Up to 180 caprolactam, the dominant VOC from nylon; total VOC reached nearly 200 µg/min, the highest of the nine filaments tested[20] | Not documented |
| Ultrafine-particle emission rateparticles/min | ≈2 × 10⁸ median — low for ultrafine particles despite the highest VOC mass of any filament tested[20] | ≈4 × 10¹⁰ median — the highest ultrafine-particle rate of the nine filaments in the chamber study, above every ABS tested[20] |
| Hazardous species emitted | Caprolactam, at up to 180 µg/min from nylon filament — the largest single-VOC emission rate measured in the study[20] | Not documented |
| Ventilation / filtration requirement1–5 | Ventilated room or enclosure recommended[20] | Ventilated room or enclosure recommended[20][7] |
| Dust & fibre handling hazard | Not documented | Conductive carbon filler is bound in the matrix; avoid inhaling sanding dust[2] |
| Post-Processing | ||
| Sanding & machining | Not documented | Sands and machines well; the toughness means it cuts rather than chips[9] |
| Gluing & solvent welding | Not documented | Cyanoacrylate; dichloromethane solvent-welds PC but is a laboratory reagent[9] |
| Vapour / chemical smoothing | Not documented | No practical vapour smoothing[9] |
| Support material pairing | Not documented | Prints its own supports; 3DXTech sells a dedicated PC break-away support[9] |
| Solvents & Solubility | ||
| Soluble in | Dissolved at 23 °C by formic acid above ~80 %, phenol, m-cresol, 96 % sulphuric acid or hexafluoroisopropanol — laboratory reagents.[21] | Dichloromethane, chloroform, DMF and dioxane dissolve it outright (Covestro, 6 days at 23 °C). Laboratory reagents.[22] |
| Softened or crazed by | Zinc chloride solutions stress-crack it — 10 % marginal, 37 % not resistant; alcoholic calcium chloride dissolves it.[21] | Methanol, butyl acetate, ether, 1 % NaOH and phthalate plasticisers stress-crack it; acetone, MEK and xylene swell it.[22] |
| Solvent welding & smoothing agent | None — nylon's only solvents are formic acid, phenol and HFIP, all of which degrade the part they wet.[21] | Dichloromethane cement welds PC — 16.5 MPa lap shear at one week (IPS Weld-On 3). A controlled carcinogen.[23] |
Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- PA (Nylon) — material basics Polymaker Wiki · 2026-08 · doc
- 3DXSTAT ESD-PC Technical Data Sheet 3DXTech · 2026-08 · tds
- TECAMID 66 natural (PA66) — stock shape properties Ensinger · 2026-08 · tds
- PC-ESD — FDM Material Data Sheet Stratasys · 2024-10 · tds
- 3DXTech product catalogue 3DXTech · 2026-08 · vendor
- Polymaker product catalogue Polymaker · 2026-08 · vendor
- ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
- PolyLite PC Technical Data Sheet V5.4 Polymaker · 2024-11 · tds
- Polycarbonate — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- PC — material basics Polymaker Wiki · 2026-08 · doc
- Moisture Conditioning — effect on printed nylon properties Polymaker Wiki · 2026-08 · doc
- Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
- 3DXSTAT ESD-PC — product page (print recommendations) 3DXTech · 2026-08 · doc
- Bambu Filament Technical Data Sheet V2.0 — PC Bambu Lab · 2026-08 · tds
- Prusament PC Blend Technical Datasheet v1.1 Prusa Polymers · 2022-02 · tds
- PolyMide CoPA Technical Data Sheet V5.4 (dry and wet status blocks) Polymaker · 2024-11 · tds
- ezPC Polycarbonate Technical Data Sheet 3DXTech · 2026-08 · tds
- TECANAT natural (PC) — stock shape properties Ensinger · 2026-08 · tds
- Experimental data for creep and dynamic mechanical properties of polycarbonate and polycarbonate/ABS Data in Brief 42:108264 · 2022-06 · paper
- Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
- Ultramid Nylon Chemical Resistance guide (unmodified PA6 B27E and PA66 A27E) BASF · 2026-08 · tds
- Makrolon — The chemical resistance (Makrolon 2800, 6 days at 23 °C and 50 °C) Covestro · 2016-12 · tds
- Weld-On 3 Acrylic Plastic Cement — technical data sheet (shipped as dichloromethane) IPS Corporation · 2002-07 · tds