Filament comparison
ABS-ESD vs PVDF
Compare printing settings, strength, heat resistance, dated prices and sources.
2 selected · all documented properties
| Property | ESD-safe ABSABS | PVDFENGINEERING |
|---|---|---|
| Market snapshot | ||
| Listing priceUSD/kg; dated snapshots | $102.50/kg median; $47.00–$166.67/kg across 4 dated product listings | $250.67/kg median; $250.67–$250.67/kg across 1 dated product listings |
| Identity & Market | ||
| Base polymer / chemistry | ABS compounded with a conductive carbon filler for static-dissipative parts[1] | Polyvinylidene fluoride — a semi-crystalline fluoropolymer[2][3] |
| Densityg/cm³ | 1.09 (ISO 1183)[1] | 1.71 (ISO 1183) — the densest unfilled filament in the dataset[2] |
| Typical priceUSD/kg | 1 kg-equivalent spools span 47–167; the middle of the market is about 103[4][5][6] | 1 kg-equivalent spools cluster near 251[4] |
| Price range across brandsUSD/kg | 47–167 across brands; IEMAI 47, YXPOLYER 65, 3DXTech 140 at 750 g pricing; the EMI-shielding ABS grade runs 167[4][5][6] | 251 at 3DXTech's 750 g pricing — the most expensive material in the whole dataset[4] |
| Market availability1–5 | Niche, a handful of specialist brands[4] | Special order, 1–2 makers worldwide[4][7] |
| Spool sizes & diameters | 1.75 and 2.85 mm; 750 g spools[4] | 1.75 and 2.85 mm; 750 g spools[4] |
| Typical applications | Electronics handling fixtures, trays and jigs used around static-sensitive parts[1] | Chemical-plant fittings, semiconductor handling and parts needing outstanding UV and chemical resistance[2] |
| Printing Parameters | ||
| Bed temperature°C | Not documented | 70–110 (3DXTech FluorX)[2] |
| Enclosure / chamber requirement1–5 | Enclosure recommended[8] | Enclosure required (passive)[2] |
| Bed surface & adhesion aid | Clean the plate and apply glue; Simplify3D also lists Kapton tape and ABS slurry[8][9] | Not documented |
| Warping tendency1–5 | High — enclosure needed for reliable large parts[8] | High — enclosure needed for reliable large parts[2] |
| Bed-adhesion difficulty1–5 | Needs a specific surface plus adhesive[8] | Not documented |
| Stringing / oozing tendency1–5 | Slight — Polymaker advises 1–2 mm retraction at 20–30 mm/s[10] | Not documented |
| Overall printing difficulty1–5 | Intermediate — dry filament and a tuned profile[8] | Expert / industrial hardware only[2][3] |
| Hardware Wear & Reliability | ||
| Nozzle hardness required1–4 | Hardened steel required[1] | Brass fine indefinitely for unfilled grades[2] |
| Abrasiveness1–5 | Moderately abrasive — conductive carbon filler[1] | Non-abrasive when unfilled[2] |
| Nozzle clog risk1–5 | Low — 3DXTech lists no special nozzle concerns and no minimum layer height for its ESD-ABS, only an 80 °C pre-dry[11] | Low — 3DXTech lists no special nozzle concerns, no minimum layer height and states drying is not required[7] |
| Heat-creep / jam sensitivity1–5 | Slightly sensitive[9] | Not documented |
| Hotend requirement | No special hot-end required[9] | Not documented |
| Other hardware wear | Not documented | Hydrogen fluoride released on overheating is extremely corrosive and will attack hotend and enclosure metalwork as well as people[3] |
| Moisture Behaviour | ||
| Moisture absorption (hygroscopicity)1–5 | Moderate — the ABS matrix takes up 0.51–0.65 % saturated at 25 °C / 55 % RH and 3DXTech specifies a 80 °C, 4 h pre-dry[12][13][11] | Negligible (<0.1 % EMC) — fluoropolymers are essentially non-hygroscopic[2] |
| Symptoms when wet | Bubbling and popping at the nozzle, stringing and a rough surface[14] | Not documented |
| Effect of moisture on strength | Polymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam in the hotend and shows as bubbling and poor layer adhesion[14] | Not applicable in practice — 3DXTech states drying is not required for PVDF, so there is no moisture-driven strength loss to measure[7] |
| Storage requirement | Sealed with desiccant; Polymaker rates ABS moderate-sensitivity[14] | Not documented |
| Mechanical Properties | ||
| Tensile strength (XY)MPa | 58 at break (printed XY, ISO 527) — the conductive filler raises strength above the unfilled grade's 42[1][15] | 51 at break (printed XY, ISO 527)[2] |
| Young's modulusMPa | 2130 (printed XY, ISO 527)[1] | 2450 (printed XY, ISO 527)[2] |
| Elongation at break% | 4 at break (printed XY, ISO 527)[1] | 25 at break (printed XY, ISO 527)[2] |
| Flexural strengthMPa | 80 (printed XY, ISO 178)[1] | 50 (printed XY, ISO 178)[2] |
| Flexural modulusMPa | 2275 (printed XY, ISO 178)[1] | 1800 (printed XY, ISO 178)[2] |
| Other impact data | Not documented | Izod 133 J/m on extruded PVDF stock, converted from 2.49 ft-lb/in (ASTM D256)[16] |
| Brittleness1–5 | Moderate[1] | Tough — absorbs impact, yields before breaking[2] |
| Hardness (scale-specific)Shore A / Shore D / Rockwell | Not documented | Rockwell M79 on extruded PVDF stock (ASTM D785)[16] |
| Creep resistance / sustained load1–5 | Moderate — no creep test found; Tg of 105 °C keeps room-temperature service far below softening[1] | Not documented |
| Fatigue / repeated-flex resistance1–5 | Below average — no S-N curve found; elongation at break 4 %, well below unfilled ABS[1][15] | Not documented |
| Elasticity / flexibility1–5 | Rigid[1] | Slightly flexible in thin sections[2] |
| Thermal Properties | ||
| HDT at 0.45 MPa°C | Not documented | 149 on extruded PVDF stock (ASTM D648 at 66 psi; converted from 300 °F)[16] |
| HDT at 1.8 MPa°C | Not documented | 113 on extruded PVDF stock (ASTM D648 at 264 psi; converted from 235 °F)[16] |
| Glass transition (Tg)°C | 105 (DSC)[1] | Not documented |
| Melting point / Vicat°C | Not documented | 170 melting (ISO 11357)[2] |
| Continuous service temperature°C | Not documented | 149 long term and short term on extruded PVDF stock (converted from 300 °F)[16] |
| Thermal expansion (CTE)µm/m·K | Not documented | 127.8 (extruded PVDF stock, ASTM D696; source states 7.1e-5 in/in/°F) — the highest thermal expansion of any engineering polymer in this dataset[16] |
| Flammability / UL 94 | Not documented | UL 94 V-0 on extruded PVDF stock; Ensinger lists inherent flame resistance[16] |
| Environment & Chemical | ||
| UV resistance1–5 | Not documented | Excellent — designed for permanent outdoor use; Ensinger lists good UV and weather resistance and high gamma radiation resistance for PVDF stock[2][16] |
| Chemical resistance | Good against weak acids, weak alkalis, oils and grease; dissolved by acetone[17] | Outstanding — resistant to most acids, solvents and oxidising agents, which is the reason to use it[2] |
| Water / humidity resistance in service1–5 | Not documented | Excellent — essentially unaffected[2] |
| Food contact | Not food safe — Polymaker cites potential chemical leaching[10] | Not documented |
| Biodegradability / compostability | Not biodegradable[10] | Not documented |
| Recyclability | Mechanically recyclable but not accepted in household plastic collection[10] | Not documented |
| Electrical & ESD properties | Surface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ABS[1][15] | Not documented |
| Health & Safety | ||
| Fume toxicity1–5 | High — hazardous VOC such as styrene; enclosure and filtration needed[18][8] | Very high — toxic decomposition products; local exhaust mandatory. Above 315 °C thermal decomposition yields hydrofluoric acid, hydrogen cyanide and carbon monoxide[3] |
| VOC emission rateµg/min | 12–113 styrene, the dominant VOC from every ABS and HIPS combination tested[18] | Not documented |
| Ultrafine-particle emission rateparticles/min | 2 × 10¹⁰ to 9 × 10¹⁰ median across all ABS printers, two orders of magnitude above PLA's ≈1 × 10⁸[18] | Not documented |
| Hazardous species emitted | Styrene dominates. Bambu Lab states ABS and ASA release harmful gases such as styrene at printing temperature, which can be toxic and cause dizziness or nausea[18][8] | Above 315 °C: hydrofluoric acid, hydrogen cyanide, phenols, carbon monoxide, carbon dioxide and dense smoke. HF is extremely corrosive, its skin burns may not be immediately visible or painful, and exposure can be fatal by skin absorption, inhalation or ingestion[3] |
| Ventilation / filtration requirement1–5 | Enclosure with carbon and HEPA filtration — an enclosure alone cut measured UFP by only about 35 %[18][8] | Local exhaust to outside / fume hood — the SDS states local exhaust is preferred[3] |
| Dust & fibre handling hazard | Conductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1] | Molten polymer causes thermal burns and must not be pulled off the skin. If HF is detected during a decomposition event, cut the heat but keep the extraction running, ventilate, and clear non-essential people from the area[3] |
| Post-Processing | ||
| Sanding & machining | Sands well and takes filler before painting[10] | Not documented |
| Painting & finishing | Paints readily after light abrasion[10] | Not documented |
| Support material pairing | HIPS breaks away or dissolves in d-limonene; Bambu Lab sells a dedicated Support for ABS[19][8] | Not documented |
| Dimensional accuracy & detail | Not documented | The processing window sits well below the 315 °C decomposition threshold, so nozzle temperature must be controlled rather than raised to chase flow[2][3] |
| Solvents & Solubility | ||
| Soluble in | Acetone dissolves it — the basis of ABS slurry; so do MEK, THF, ethyl acetate, chloroform, dichloromethane and toluene.[20][17] | THF, MEK, DMF, DMAc, NMP, DMSO and trimethyl phosphate dissolve 5–10 wt% at ambient — Arkema's active solvents, all lab reagents.[21] |
| Softened or crazed by | Petrol and perchloroethylene soften it and benzene attacks it; d-limonene disrupts layer adhesion in some ABS and ASA grades.[20][22] | Acetone, MIBK, cyclohexanone, butyl acetate and glycol ethers swell it; alkalis above pH 12 attack the homopolymer.[21][23] |
| Solvent welding & smoothing agent | Acetone: about 20 min of vapour at 80 °C over 5 mm of liquid. Prusa measured layer adhesion more than doubled.[24] | None for the workshop — the active solvents (NMP, DMAc, DMF) are laboratory reagents used for casting membranes, not joints.[21] |
Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- 3DXSTAT ESD-ABS Technical Data Sheet 3DXTech · 2026-08 · tds
- FluorX PVDF Technical Data Sheet v3 3DXTech · 2026-08 · tds
- FluorX PVDF Safety Data Sheet v1.1 3DXTech · 2026-08 · msds
- 3DXTech product catalogue 3DXTech · 2026-08 · vendor
- IEMAI ESD-ABS 3D Printing Filament product page IEMAI 3D · 2026-08 · vendor
- YXPOLYER ABS ESD product page YXPOLYER · 2026-08 · vendor
- FluorX PVDF — product page 3DXTech · 2026-08 · vendor
- ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
- ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- ABS — material basics Polymaker Wiki · 2026-08 · doc
- 3DXSTAT ESD-ABS — product page (print recommendations) 3DXTech · 2026-08 · doc
- Bambu Filament Technical Data Sheet V3.0 — ABS Bambu Lab · 2026-08 · tds
- Polymaker ABS Pro Technical Data Sheet V1 (2026-05-29) Polymaker · 2026-05 · tds
- Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
- 3DXMAX ABS Technical Data Sheet 3DXTech · 2026-08 · tds
- TECAFLON PVDF natural — stock shape properties Ensinger · 2026-08 · tds
- PolyLite ABS Technical Data Sheet (V5.5 served at this URL) Polymaker · 2024-11 · tds
- Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
- HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
- Kynar PVDF — Design properties: solubility and irradiation (active and latent solvents) Arkema · 2026-08 · tds
- HIPS — Knowledge Base Prusa Research · 2026-08 · doc
- Kynar PVDF resin — chemical and fuel resistance Arkema · 2026-08 · tds
- Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc