Filament comparison
ABS-ESD vs PA6/66
Compare printing settings, strength, heat resistance, dated prices and sources.
2 selected · all documented properties
| Property | ESD-safe ABSABS | PA66 (Nylon 66)PA |
|---|---|---|
| Market snapshot | ||
| Listing priceUSD/kg; dated snapshots | $102.50/kg median; $47.00–$166.67/kg across 4 dated product listings | Not documented |
| Identity & Market | ||
| Base polymer / chemistry | ABS compounded with a conductive carbon filler for static-dissipative parts[1] | Polyamide 66, condensed from hexamethylenediamine and adipic acid; melts around 40 °C above PA6[2] |
| Densityg/cm³ | 1.09 (ISO 1183)[1] | 1.14 (extruded unfilled PA66 stock)[3] |
| Typical priceUSD/kg | 1 kg-equivalent spools span 47–167; the middle of the market is about 103[4][5][6] | Not documented |
| Price range across brandsUSD/kg | 47–167 across brands; IEMAI 47, YXPOLYER 65, 3DXTech 140 at 750 g pricing; the EMI-shielding ABS grade runs 167[4][5][6] | Not documented |
| Market availability1–5 | Niche, a handful of specialist brands[4] | Special order, 1–2 makers worldwide — no unfilled PA66 filament appeared in any catalogue searched, and the 3DXTech nylon range offers PA6, PA12 and a 6/66 copolymer but no straight PA66[4][7] |
| Spool sizes & diameters | 1.75 and 2.85 mm; 750 g spools[4] | Not documented |
| Typical applications | Electronics handling fixtures, trays and jigs used around static-sensitive parts[1] | Not documented |
| Printing Parameters | ||
| Enclosure / chamber requirement1–5 | Enclosure recommended[8] | Enclosure required (passive)[2] |
| Bed surface & adhesion aid | Clean the plate and apply glue; Simplify3D also lists Kapton tape and ABS slurry[8][9] | Not documented |
| Warping tendency1–5 | High — enclosure needed for reliable large parts[8] | Not documented |
| Bed-adhesion difficulty1–5 | Needs a specific surface plus adhesive[8] | Not documented |
| Stringing / oozing tendency1–5 | Slight — Polymaker advises 1–2 mm retraction at 20–30 mm/s[10] | Not documented |
| Overall printing difficulty1–5 | Intermediate — dry filament and a tuned profile[8] | Advanced — enclosure, hardware upgrades, tuning[2] |
| Hardware Wear & Reliability | ||
| Nozzle hardness required1–4 | Hardened steel required[1] | Not documented |
| Abrasiveness1–5 | Moderately abrasive — conductive carbon filler[1] | Not documented |
| Nozzle clog risk1–5 | Low — 3DXTech lists no special nozzle concerns and no minimum layer height for its ESD-ABS, only an 80 °C pre-dry[11] | Very high — frequent jams without careful setup[12][13] |
| Heat-creep / jam sensitivity1–5 | Slightly sensitive[9] | Not documented |
| Hotend requirement | No special hot-end required[9] | Not documented |
| Moisture Behaviour | ||
| Moisture absorption (hygroscopicity)1–5 | Moderate — the ABS matrix takes up 0.51–0.65 % saturated at 25 °C / 55 % RH and 3DXTech specifies a 80 °C, 4 h pre-dry[14][15][11] | Very high (>2 %)[13] |
| Equilibrium moisture content at ~50 % RH% | Not documented | 8.5 at saturation on extruded PA66 stock (ASTM D570) — the highest uptake of any polymer in this dataset[3] |
| Symptoms when wet | Bubbling and popping at the nozzle, stringing and a rough surface[13] | Not documented |
| Effect of moisture on strength | Polymaker rates ABS moderate-sensitivity and publishes no dry-versus-conditioned figures; absorbed water flashes to steam in the hotend and shows as bubbling and poor layer adhesion[13] | Measured dry against wet on printed specimens at 6.16 % moisture (Polymaker CoPA): tensile 78.0 → 34.3 MPa, Young's modulus 2703 → 724 MPa, flexural strength 109.8 → 22.6 MPa, while notched Charpy rises 6.9 → 27.7 kJ/m² and elongation 12.7 → 13.2 %[16][12] |
| Storage requirement | Sealed with desiccant; Polymaker rates ABS moderate-sensitivity[13] | Not documented |
| Mechanical Properties | ||
| Tensile strength (XY)MPa | 58 at break (printed XY, ISO 527) — the conductive filler raises strength above the unfilled grade's 42[1][17] | 82.7 at yield and 84.8 at break on extruded PA66 stock (ASTM D638; converted from 12,000 and 12,300 psi) — no printed figure exists because no unfilled PA66 filament was found[3] |
| Young's modulusMPa | 2130 (printed XY, ISO 527)[1] | 2413 on extruded PA66 stock (ASTM D638; converted from 350,000 psi)[3] |
| Elongation at break% | 4 at break (printed XY, ISO 527)[1] | 50 at break on extruded PA66 stock (ASTM D638)[3] |
| Flexural strengthMPa | 80 (printed XY, ISO 178)[1] | 113.8 on extruded PA66 stock (ASTM D790; converted from 16,500 psi)[3] |
| Flexural modulusMPa | 2275 (printed XY, ISO 178)[1] | 3034 on extruded PA66 stock (ASTM D790; converted from 440,000 psi)[3] |
| Other impact data | Not documented | Izod 53 J/m on extruded PA66 stock, converted from 1.0 ft-lb/in (ASTM D256)[3] |
| Brittleness1–5 | Moderate[1] | Not documented |
| Hardness (scale-specific)Shore A / Shore D / Rockwell | Not documented | Shore D 86 and Rockwell 85 (108) — the source does not name the scales on extruded PA66 stock (ASTM D2240, D785)[3] |
| Creep resistance / sustained load1–5 | Moderate — no creep test found; Tg of 105 °C keeps room-temperature service far below softening[1] | Not documented |
| Fatigue / repeated-flex resistance1–5 | Below average — no S-N curve found; elongation at break 4 %, well below unfilled ABS[1][17] | Excellent — living hinges viable[2] |
| Elasticity / flexibility1–5 | Rigid[1] | Semi-flexible[12] |
| Wear resistance & friction | Not documented | Wear factor 200e-10 in3*min/(ft*lb*h) on extruded PA66 stock (ASTM D3702); Ensinger lists very good slide and wear properties[3] |
| Thermal Properties | ||
| HDT at 0.45 MPa°C | Not documented | 232 on extruded PA66 stock (ASTM D648 at 66 psi; converted from 450 °F)[3] |
| HDT at 1.8 MPa°C | Not documented | 90 on extruded PA66 stock (ASTM D648 at 264 psi; converted from 194 °F) — the gap to the 0.45 MPa figure is the widest in the dataset[3] |
| Glass transition (Tg)°C | 105 (DSC)[1] | Not documented |
| Melting point / Vicat°C | Not documented | 255 melting on extruded PA66 stock (ASTM D2133; converted from 491 °F)[3] |
| Continuous service temperature°C | Not documented | 85 long term and 149 short term on extruded PA66 stock (converted from 185 °F and 300 °F)[3] |
| Thermal expansion (CTE)µm/m·K | Not documented | 81.0 (extruded PA66 stock, ASTM D696; source states 4.5e-5 in/in/°F)[3] |
| Flammability / UL 94 | Not documented | UL 94 V-2 on extruded PA66 stock[3] |
| Environment & Chemical | ||
| Chemical resistance | Good against weak acids, weak alkalis, oils and grease; dissolved by acetone[18] | Not documented |
| Food contact | Not food safe — Polymaker cites potential chemical leaching[10] | Not documented |
| Biodegradability / compostability | Not biodegradable[10] | Not documented |
| Recyclability | Mechanically recyclable but not accepted in household plastic collection[10] | Not documented |
| Electrical & ESD properties | Surface resistance 10⁷–10⁹ ohm/sq, the static-dissipative band (ASTM D257), against above 10¹³ for unfilled ABS[1][17] | Volume resistance 1e15 ohm-cm and dielectric constant 4 on extruded PA66 stock (ASTM D257, D150)[3] |
| Health & Safety | ||
| Fume toxicity1–5 | High — hazardous VOC such as styrene; enclosure and filtration needed[19][8] | Moderate — measurable VOCs and UFPs, ventilation advised[19] |
| VOC emission rateµg/min | 12–113 styrene, the dominant VOC from every ABS and HIPS combination tested[19] | Up to 180 caprolactam, the dominant VOC from nylon; total VOC reached nearly 200 µg/min, the highest of the nine filaments tested[19] |
| Ultrafine-particle emission rateparticles/min | 2 × 10¹⁰ to 9 × 10¹⁰ median across all ABS printers, two orders of magnitude above PLA's ≈1 × 10⁸[19] | ≈2 × 10⁸ median — low for ultrafine particles despite the highest VOC mass of any filament tested[19] |
| Hazardous species emitted | Styrene dominates. Bambu Lab states ABS and ASA release harmful gases such as styrene at printing temperature, which can be toxic and cause dizziness or nausea[19][8] | Caprolactam, at up to 180 µg/min from nylon filament — the largest single-VOC emission rate measured in the study[19] |
| Ventilation / filtration requirement1–5 | Enclosure with carbon and HEPA filtration — an enclosure alone cut measured UFP by only about 35 %[19][8] | Ventilated room or enclosure recommended[19] |
| Dust & fibre handling hazard | Conductive carbon filler is bound in the matrix; avoid inhaling sanding dust[1] | Not documented |
| Post-Processing | ||
| Sanding & machining | Sands well and takes filler before painting[10] | Not documented |
| Painting & finishing | Paints readily after light abrasion[10] | Not documented |
| Support material pairing | HIPS breaks away or dissolves in d-limonene; Bambu Lab sells a dedicated Support for ABS[20][8] | Not documented |
| Solvents & Solubility | ||
| Soluble in | Acetone dissolves it — the basis of ABS slurry; so do MEK, THF, ethyl acetate, chloroform, dichloromethane and toluene.[21][18] | Dissolved at 23 °C by formic acid above ~80 %, phenol, m-cresol, 96 % sulphuric acid or hexafluoroisopropanol — laboratory reagents.[22] |
| Softened or crazed by | Petrol and perchloroethylene soften it and benzene attacks it; d-limonene disrupts layer adhesion in some ABS and ASA grades.[21][23] | Zinc chloride solutions stress-crack it — 10 % marginal, 37 % not resistant; alcoholic calcium chloride dissolves it.[22] |
| Solvent welding & smoothing agent | Acetone: about 20 min of vapour at 80 °C over 5 mm of liquid. Prusa measured layer adhesion more than doubled.[24] | None — nylon's only solvents are formic acid, phenol and HFIP, all of which degrade the part they wet.[22] |
Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- 3DXSTAT ESD-ABS Technical Data Sheet 3DXTech · 2026-08 · tds
- PA (Nylon) — material basics Polymaker Wiki · 2026-08 · doc
- TECAMID 66 natural (PA66) — stock shape properties Ensinger · 2026-08 · tds
- 3DXTech product catalogue 3DXTech · 2026-08 · vendor
- IEMAI ESD-ABS 3D Printing Filament product page IEMAI 3D · 2026-08 · vendor
- YXPOLYER ABS ESD product page YXPOLYER · 2026-08 · vendor
- Polymaker product catalogue Polymaker · 2026-08 · vendor
- ABS / ASA / PC Usage Guide Bambu Lab Wiki · 2026-08 · doc
- ABS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- ABS — material basics Polymaker Wiki · 2026-08 · doc
- 3DXSTAT ESD-ABS — product page (print recommendations) 3DXTech · 2026-08 · doc
- Moisture Conditioning — effect on printed nylon properties Polymaker Wiki · 2026-08 · doc
- Wet Filament — signs, causes and drying Polymaker Wiki · 2026-08 · doc
- Bambu Filament Technical Data Sheet V3.0 — ABS Bambu Lab · 2026-08 · tds
- Polymaker ABS Pro Technical Data Sheet V1 (2026-05-29) Polymaker · 2026-05 · tds
- PolyMide CoPA Technical Data Sheet V5.4 (dry and wet status blocks) Polymaker · 2024-11 · tds
- 3DXMAX ABS Technical Data Sheet 3DXTech · 2026-08 · tds
- PolyLite ABS Technical Data Sheet (V5.5 served at this URL) Polymaker · 2024-11 · tds
- Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
- HIPS — Ultimate 3D Printing Materials Guide Simplify3D · 2026-08 · doc
- Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
- Ultramid Nylon Chemical Resistance guide (unmodified PA6 B27E and PA66 A27E) BASF · 2026-08 · tds
- HIPS — Knowledge Base Prusa Research · 2026-08 · doc
- Improve your 3D prints with chemical smoothing Prusa Research · 2026-08 · doc