Printer comparison
INTAMSYS FUNMAT PRO 410 vs Snapmaker J1s
Compare hardware, build volume, printing specifications, dated prices and sources.
2 selected · all documented properties
Open these two in the interactive comparisonMore INTAMSYS FUNMAT PRO 410 comparisonsMore Snapmaker J1s comparisons
| Property | INTAMSYS FUNMAT PRO 410INDUSTRIAL | Snapmaker J1sIDEX |
|---|---|---|
| Identity | ||
| Brand | INTAMSYS | Snapmaker |
| Class | INDUSTRIAL | IDEX |
| Identity & Market | ||
| Manufacturer & exact marketed model name (verify the exact product identity first) | Intamsys Funmat Pro 410, described as a dual-extrusion PEEK 3D printer[1] | Snapmaker J1S High Speed IDEX 3D Printer[2][3] |
| Street price (USD; dated snapshot per entry) | $27,995.00 at Top 3D Shop, in stock with a 5-10 business-day lead time, checked Aug 2026[1] | $1,399.00 at MatterHackers, listed as currently unavailable with a pre-order option quoting roughly 5 weeks, checked Aug 2026[2] |
| Variants & sibling models — and how to tell them apart (spec-contamination risk) | Distinguish from the 610 HT carefully: the 410 has a 90 °C chamber and 160 °C plate, the 610 HT a 300 °C chamber and 300 °C plate. Both quote a 500 °C extruder, so extruder temperature alone will not tell them apart. The 410's two nozzles are asymmetric — one fixed, one on a lift[1][4] | The J1s differs from the original J1 by an additional part-cooling fan. Usable volume depends on the print mode: 300 x 200 x 200 mm in default and backup modes, 160 x 200 x 200 in copy mode, 150 x 200 x 200 in mirror mode[2][3] |
| Physical & Frame | ||
| Build volume X×Y×Z (mm) — advertised vs actually usable | 305 x 305 x 406 mm (12 x 12 x 16 in)[1] | 300 x 200 x 200 mm in default and backup modes[2] |
| Machine footprint (mm) & clearance needed (cable/spool overhang) | 720 x 680 x 1470 mm[1] | 539 x 401 x 464 mm[2] |
| Net weight (kg) | 220 kg[1] | 25 kg net[2] |
| Frame construction & material | Not documented | Aluminium-alloy frame with one-piece die casting and linear rails; Snapmaker quotes rail repeatability of +/-0.03 mm in X/Y and +/-0.02 mm in Z[3] |
| Enclosure: open / enclosed; panel material; door/lid | Enclosed heated chamber with air filtering[1] | Not documented |
| Passive chamber temperature reached (if enclosed; measured values preferred) | 90 °C chamber (manufacturer specification, actively heated)[1] | Not documented |
| Kinematics & Motion Hardware | ||
| Kinematics (bedslinger i3 / CoreXY / other) | Two nozzles, one fixed and one that lifts out of the way[1] | IDEX — two independently driven extruders[2][3] |
| X-axis guide type (rods / linear rails / V-wheels; size) | Not documented | Linear rails[3] |
| Speed & Acceleration | ||
| Max print speed (claimed, mm/s) | Not documented | 350 mm/s maximum (manufacturer claim)[3] |
| Max travel speed | Maximum XY travel speed 500 mm/s (manufacturer figure); maximum XY acceleration 5,000 mm/s2[1] | Not documented |
| Max acceleration (claimed, mm/s²) | 5,000 mm/s2 maximum XY acceleration (manufacturer claim)[1] | 10,000 mm/s2 maximum (manufacturer claim)[3] |
| Extruder | ||
| Type (direct drive / bowden) & design name | Two nozzles, 1.75 mm filament, with an auto-cleaning station[1] | Not documented |
| Hotend & Nozzle | ||
| Max nozzle temp claimed AND firmware max temp limit (both values) | 500 °C extruder temperature (manufacturer specification)[1] | 300 °C maximum (manufacturer claim)[2][3] |
| Stock nozzle size & sizes included in box | 0.4 mm default, 0.6 mm selectable[1] | Not documented |
| Heated Bed & Surface | ||
| Max bed temp claimed AND firmware limit | 160 °C platform temperature[1] | 100 °C maximum (manufacturer claim)[2] |
| Bed surface (material, texture, coating), single/double-sided | Ceramic glass build plate[1] | Custom dual-sided PEI glass plate: glossy glass on one face, PEI coating on the other[2][3] |
| Leveling & Z-Offset | ||
| Auto bed leveling: probe technology (inductive / strain gauge / load cell / touch probe) | Auto-levelling with high-precision sensors; sensor technology not named[1] | 3-point bed levelling, which Snapmaker contrasts with 9-16 point systems; assisted calibration quoted at about 10 minutes[3] |
| Filament Handling & Detection | ||
| Filament runout sensor (type, location) | Filament jam warning and filament absence warning[1] | Not documented |
| Spool holder location & max spool size; drybox compatibility | Heated dry box for filament, up to 70 °C[1] | Not documented |
| Cooling & Air Handling | ||
| Chamber/exhaust fan & filtration (activated carbon / HEPA) | Air filtering fitted; media not specified. Cooling is water-cooled[1] | Not documented |
| Electronics & Power | ||
| Host computer (SoC, RAM, storage) if firmware runs on embedded Linux | Not documented | 1 GB RAM, 8 GB eMMC; the 5-inch display runs Android[2] |
| Input voltage (110/220 V, switch or auto) | 200-240 V / 15 A, 50-60 Hz[1] | AC 100-240 V, 50/60 Hz, 4.4 A max input; DC 24 V, 400 W max output[2] |
| Total rated power draw | 3 kW maximum[1] | 400 W maximum output[2] |
| Firmware & Openness | ||
| Firmware base & current version (Klipper fork / Marlin fork / proprietary) | Proprietary; slicing is IntamSuite (Windows only)[1] | Not named by Snapmaker; the supplied slicer is Luban, with third-party software supported[2] |
| Connectivity, UI & Camera | ||
| Display: size, type, touch? | 7-inch smart touch panel[1] | 5-inch Android display, 1280 x 720[2] |
| WiFi (band/standard), Ethernet, USB ports, SD/flash-drive | USB, Wi-Fi, Internet[1] | Wi-Fi, USB cable, USB flash drive[2] |
| Camera: built-in / optional? Resolution & framerate (verify — marketing often omits real fps) | Camera fitted[1] | Not documented |
| Power-Loss & Interruption Recovery | ||
| Power-loss recovery: mechanism (how is state saved? capacitor / eeprom / file on shutdown?) | Power-failure recovery supported; mechanism not published[1] | Not documented |
| Materials Support | ||
| Officially supported filament list | PEEK, PEKK, PEI, PPSU, PC, nylon, ABS, HIPS, PETG, PLA, PVA and CF-filled grades[1] | PLA, ABS, HIPS, PC, TPU, TPE, PETG, ASA, PP, PVA, PA, PA-GF, PA-CF[2] |
| Safety | ||
| Certifications (UL/ETL/CE/FCC — verify, don't assume) | CE, SGS, FCC[1] | Not documented |
| Noise & Power Consumption | ||
| Noise: claimed dB and independently measured dB (distance/method) | Not documented | Less than 50 dBA claimed by the manufacturer. No independent measurement; distance and method not stated[2] |
| Independently Measured Performance | ||
| Dimensional accuracy measurements (third-party, with numbers) | Resolution XY 15.6 um, Z 1.56 um (manufacturer specification)[1] | Not documented |
Manufacturer claims, independent measurements, packages and test conditions retain their source wording. FDM linear speed and resin vertical speed use different units and are not directly comparable. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- Intamsys Funmat Pro 410 product listing top3dshop.com · 2026-08 · vendor
- Snapmaker J1S High Speed IDEX 3D Printer listing matterhackers.com · 2026-08 · vendor
- Snapmaker J1s product page snapmaker.com · 2026-08 · vendor
- Intamsys Funmat Pro 610 HT product listing top3dshop.com · 2026-08 · vendor