3D Printing Info

Printer comparison

Bambu Lab X1E vs Stratasys F120

Compare hardware, build volume, printing specifications, dated prices and sources.

2 selected · all documented properties

Bambu Lab X1E vs Stratasys F120 — documented properties and sources
PropertyBambu Lab X1ECOREXYStratasys F120INDUSTRIAL
Identity
BrandBambu LabStratasys
ClassCOREXYINDUSTRIAL
Identity & Market
Manufacturer & exact marketed model name (verify the exact product identity first)Bambu Lab X1E; spec PDF header "Bambu Lab X1E Technical Specification"[1]Stratasys F120, part of the Stratasys F123 Series[2]
Release date (announcement and actual shipping)Not documentedThe F123 series spec sheet carried is revision 0721a (July 2021). Stratasys does not print a launch date on it[2]
Variants & sibling models — and how to tell them apart (spec-contamination risk)Enterprise variant of the X1-Carbon, not a trim level. Differences from the X1C, from the two manufacturer spec sheets side by side: active chamber heating to 60 C (X1C has none), 320 C vs 300 C hot end, Smooth PEI plate included vs Cool/Engineering plates, G3+H12+carbon filter stack vs carbon filter only, Ethernet with a network kill switch, removable network module and 802.1X vs Wi-Fi only, 16 kg vs 14.13 kg, and 1400 W at 220 V / 750 W at 110 V vs 1000 W / 350 W[1][3]The F120 is the odd one out in the series: smaller cabinet (889 x 870 x 721 mm, 124 kg vs 1,626 x 864 x 711 mm, 227 kg), two external material coil boxes rather than internal spool bays, only two model materials, and no 0.127 mm layer option. Same build size as the F170 but not the same machine[2]
Market position: superseded? successor announced?Not present in the Bambu Lab US store 3D-printer collection in Aug 2026, which lists A1, A1 mini, A2L, P1S, P2S, X2D, H2S, H2D and H2C. Bambu sells business machines through a separate Business & Institution channel, so absence from the consumer collection is not proof of discontinuation; no live first-party price could be recorded[4]Not documented
Physical & Frame
Build volume X×Y×Z (mm) — advertised vs actually usable256 x 256 x 256 mm (manufacturer figure)[1]254 x 254 x 254 mm (10 x 10 x 10 in)[2]
Machine footprint (mm) & clearance needed (cable/spool overhang)389 x 389 x 457 mm - identical to the X1-Carbon[1]889 x 870 x 721 mm (35 x 35 x 29 in)[2]
Net weight (kg)16 kg net (against 14.13 kg for the X1-Carbon)[1][3]124 kg (F120) or 227 kg with consumables (F170, F270, F370)[2]
Frame construction & materialSteel chassis with an aluminium and glass shell[1]Fully enclosed office/classroom-grade cabinet, factory assembled[2]
Enclosure: open / enclosed; panel material; door/lidFully enclosed with a door sensor, and the only X1 with active chamber heating; the chamber is controlled to a maximum of 60 C[1]Enclosed build chamber[2]
Passive chamber temperature reached (if enclosed; measured values preferred)Actively heated chamber, maximum controlled temperature 60 C (manufacturer figure; not a passive measurement)[1]Not documented
Kinematics & Motion Hardware
Kinematics (bedslinger i3 / CoreXY / other)CoreXY, two stepper motors with one belt each (X1 series motion system)[5]Not documented
X-axis guide type (rods / linear rails / V-wheels; size)Carbon X rail as on the X1-Carbon (X1 series toolhead and gantry)[6]Not documented
Z-axis: leadscrew count & type, sync mechanism, anti-backlashThree leadscrews belt-driven from a single stepper motor, whole bed moving in Z (X1 series)[5]Not documented
Speed & Acceleration
Max print speed (claimed, mm/s)500 mm/s max toolhead speed (manufacturer claim); no independent measurement found[1]Not documented
Max acceleration (claimed, mm/s²)20 m/s2 = 20000 mm/s2 max toolhead acceleration (manufacturer claim)[1]Not documented
Max volumetric flow claimed (mm³/s)32 mm3/s claimed on a 150x150 mm single-wall model in Bambu ABS at 280 C[1]Not documented
Extruder
Type (direct drive / bowden) & design nameDirect drive with hardened-steel extruder gears[1]Not documented
Hotend & Nozzle
Hotend design (proprietary/standard; quick-swap mechanism?)All-metal hotend with a hardened-steel nozzle; 0.4 mm included, 0.2/0.6/0.8 mm optional; built-in filament cutter[1]Not documented
Max nozzle temp claimed AND firmware max temp limit (both values)320 C claimed max hot-end temperature - 20 C above the X1-Carbon[1][3]Not documented
Heated Bed & Surface
Max bed temp claimed AND firmware limit110 C at 220 V, 120 C at 110 V max build-plate temperature[1]Not documented
Bed surface (material, texture, coating), single/double-sidedFlexible steel plate, Smooth PEI plate included; High Temperature, Textured PEI and Cool plates optional[1]Not documented
Leveling & Z-Offset
Auto bed leveling: probe technology (inductive / strain gauge / load cell / touch probe)Nozzle-touch probing on the three ceramic heatbed force sensors, plus the Bambu micro-lidar for first-layer inspection[1][7]Not documented
Filament Handling & Detection
Filament runout sensor (type, location)Yes - run-out sensor and door sensor; odometry with AMS[1]Not documented
Cooling & Air Handling
Part-cooling fan(s): count, size, ducting designPart-cooling fan, hot-end fan, control-board fan, chamber temperature regulator fan and auxiliary part-cooling fan, all closed-loop controlled[1]Not documented
Chamber/exhaust fan & filtration (activated carbon / HEPA)G3 pre-filter, H12 HEPA filter and granulated coconut-shell activated-carbon filter; VOC filtration rated Optimal and particulate filtration present[1]Not documented
Electronics & Power
Mainboard model & MCU (exact chip markings if teardowns exist)Motion controller dual-core Cortex-M4; application processor quad ARM A7 at 1.2 GHz with a 2 TOPS NPU; 4 GB eMMC[1]Not documented
Input voltage (110/220 V, switch or auto)Not documented100-132 V / 15 A or 200-240 V / 7 A, 50/60 Hz[2]
Total rated power draw100-240 VAC 50/60 Hz; 1400 W at 220 V, 750 W at 110 V[1]Not documented
Firmware & Openness
Firmware base & current version (Klipper fork / Marlin fork / proprietary)Closed-source proprietary firmware - not a Klipper or Marlin derivative, and no printer-firmware source is published. The bambulab GitHub organisation carries 11 repositories (Bambu Studio, wxWidgets/boost/ffmpeg forks, the wiki); none is printer firmware. Updates are delivered over the air via Bambu Studio / Bambu Handy[8]Proprietary Stratasys firmware; print preparation is GrabCAD Print. The F370 additionally carries an Insight software licence and DoD STIG compliance powered by Red Hat Enterprise Linux[2]
Connectivity, UI & Camera
Display: size, type, touch?5-inch 1280x720 touchscreen[1]Not documented
On-device UI capabilities (model preview, per-object controls, etc.)Touchscreen plus app and PC application[1]Not documented
WiFi (band/standard), Ethernet, USB ports, SD/flash-driveWi-Fi (802.11 b/g/n) plus 100 Mbps full-duplex RJ45 Ethernet, a network kill switch covering both Wi-Fi and Ethernet, a removable network module and 802.1X network access control - the feature set that distinguishes the X1E from every other Bambu machine. 4 GB eMMC and a microSD card reader[1]Wired TCP/IP at 100 Mbps minimum, 100base-T Ethernet, RJ45. Wireless-ready IEEE 802.11 n/g/b with WPA2-PSK or 802.1x EAP, CCMP/TKIP encryption[2]
Camera: built-in / optional? Resolution & framerate (verify — marketing often omits real fps)Built-in 1920x1080 chamber monitoring camera; micro-lidar also fitted[1]Not documented
Materials Support
Officially supported filament listOptimal: PLA, PETG, TPU, PVA, BVOH. Superior: ABS, ASA, PC, PA, PET and carbon/glass-fibre reinforced PLA, PETG, PA, PET, PC, ABS, ASA. Ideal: PPA-CF/GF, PPS, PPS-CF/GF[1]ABS-M30 and ASA, with SR-30 support material. Notably the F120 does NOT get PLA, FDM TPU 92A or ABS-CF10, and cannot use the 0.127 mm layer height[2]
Safety
Thermal runaway protection (verify in firmware source if at all possible)Firmware over-temperature protection is documented for the X1 series: HMS_0300-0200-0001-0003 fires when the heater runs at full power without reaching target in time. Thresholds are not published and the firmware is closed-source[9]Not documented
Certifications (UL/ETL/CE/FCC — verify, don't assume)Not documentedCE (low-voltage and EMC directives), FCC, EAC, cTUVus, KC, RoHS, WEEE, REACH, RCM[2]
Noise & Power Consumption
Noise: claimed dB and independently measured dB (distance/method)Not documented46 dB maximum during build, 35 dB idle — manufacturer specification, no distance or method stated, and not an independent measurement[2]
Reliability, Support & Ecosystem
Warranty length & support reputation (evidence, not vibes)2-year limited warranty for consumers in the US, Canada, the EU, Switzerland, Norway and Iceland; 1 year in the rest of the world. Bambu Lab's own policy records the US/Canada term as a 2026 extension from one year to two[10]Not documented
Independently Measured Performance
Dimensional accuracy measurements (third-party, with numbers)Not documentedParts produced within +/-0.200 mm or +/-0.002 mm/mm, whichever is greater. Manufacturer figure derived from statistical data at 95% dimensional yield; Z accuracy carries an extra -0.000/+slice-height tolerance[2]

Manufacturer claims, independent measurements, packages and test conditions retain their source wording. FDM linear speed and resin vertical speed use different units and are not directly comparable. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.

Sources for this comparison

  1. Bambu Lab X1E Technical Specification (PDF) cdn1.bambulab.com · 2026-08 · doc
  2. Stratasys F123 Series product specification sheet (PSS_FDM_F123Series_0721a, PDF) stratasys.com · 2026-08 · doc
  3. Bambu Lab X1-Carbon - Technical Specifications (PDF) public-cdn.bambulab.com · 2026-08 · doc
  4. Bambu Lab US Store - 3D Printers collection listing (base prices, Aug 2026) us.store.bambulab.com · 2026-08 · vendor
  5. Bambu Lab Wiki - X1 introduction wiki.bambulab.com · 2026-08 · doc
  6. PRNewswire - Bambu Lab Launches X1 Series, 23 May 2022 (Kickstarter dates and MSRP table) prnewswire.com · 2026-08 · doc
  7. Bambu Lab Wiki - Replace the Heatbed Sensor Unit / Heatbed Piezo Interface Board wiki.bambulab.com · 2026-08 · doc
  8. GitHub - bambulab organisation repository list (11 repos, checked Aug 2026) github.com · 2026-08 · doc
  9. Bambu Lab Wiki - HMS_0300-0200-0001-0003: nozzle heater over-temperature (X1 series) wiki.bambulab.com · 2026-08 · doc
  10. Bambu Lab Warranty Policy bambulab.com · 2026-08 · vendor