Filament comparison
PEEK vs PVDF
Compare printing settings, strength, heat resistance, dated prices and sources.
2 selected · all documented properties
| Property | PEEKHIGHTEMP | PVDFENGINEERING |
|---|---|---|
| Market snapshot | ||
| Listing priceUSD/kg; dated snapshots | $531.87/kg median; $296.14–$770.00/kg across 5 dated product listings | $250.67/kg median; $250.67–$250.67/kg across 1 dated product listings |
| Identity & Market | ||
| Base polymer / chemistry | Polyether ether ketone — a semi-crystalline polyaryletherketone[1] | Polyvinylidene fluoride — a semi-crystalline fluoropolymer[2][3] |
| Densityg/cm³ | 1.30 (ISO 1183)[1][4] | 1.71 (ISO 1183) — the densest unfilled filament in the dataset[2] |
| Typical priceUSD/kg | 1 kg-equivalent spools span 296–770; the middle of the market is about 532[5][6][7] | 1 kg-equivalent spools cluster near 251[5] |
| Price range across brandsUSD/kg | 296-770 across brands and spool sizes; 3D4Makers recycled R-PEEK 296 at 750 g, IEMAI 3D 420 at 1 kg, LEHVOSS Luvocom 3F PEEK 9581 532 at 2 kg, 3DXTech ThermaX PEEK 770 at 500 g[5][6][7] | 251 at 3DXTech's 750 g pricing — the most expensive material in the whole dataset[5] |
| Market availability1–5 | Niche, a handful of specialist brands[5][6][4] | Special order, 1–2 makers worldwide[5][8] |
| Spool sizes & diameters | 1.75 and 2.85 mm; 200 g to 2 kg spools[5][6][4] | 1.75 and 2.85 mm; 750 g spools[5] |
| Typical applications | Aerospace brackets, semiconductor handling, sterilisable medical tooling and downhole parts[1] | Chemical-plant fittings, semiconductor handling and parts needing outstanding UV and chemical resistance[2] |
| Printing Parameters | ||
| Nozzle temperature°C | 380-400 (3DXTech printed-specimen conditions); Victrex quotes a 340-450 melt range for AM 450 FIL[1][4] | Not documented |
| Bed temperature°C | 130–140 (3DXTech)[1] | 70–110 (3DXTech FluorX)[2] |
| Enclosure / chamber requirement1–5 | Actively heated chamber required[9][10] | Enclosure required (passive)[2] |
| Recommended chamber temperature°C | Not less than 150 for semi-crystalline printing (Victrex AM 450 FIL); bed above 150[4] | Not documented |
| Warping tendency1–5 | Severe — heated chamber needed[9] | High — enclosure needed for reliable large parts[2] |
| Bed-adhesion difficulty1–5 | Very difficult — special plates or slurry required[9] | Not documented |
| Overall printing difficulty1–5 | Expert / industrial hardware only[9][10] | Expert / industrial hardware only[2][3] |
| Extruder requirement | An all-metal hot end rated above 400 °C and a heated chamber; 3DXTech tests at 0.25 mm layer height on a 0.4 mm nozzle[1][9] | Not documented |
| Hardware Wear & Reliability | ||
| Nozzle hardness required1–4 | Brass fine indefinitely for unfilled grades, but brass softens near these nozzle temperatures — hardened or plated hot ends are the norm[9] | Brass fine indefinitely for unfilled grades[2] |
| Abrasiveness1–5 | Non-abrasive when unfilled[1] | Non-abrasive when unfilled[2] |
| Nozzle clog risk1–5 | Moderate — needs dry filament and a clean nozzle; 3DXTech lists no special nozzle concerns but a mandatory 120 °C pre-dry before every print[11] | Low — 3DXTech lists no special nozzle concerns, no minimum layer height and states drying is not required[8] |
| Other hardware wear | Not documented | Hydrogen fluoride released on overheating is extremely corrosive and will attack hotend and enclosure metalwork as well as people[3] |
| Moisture Behaviour | ||
| Moisture absorption (hygroscopicity)1–5 | Not documented | Negligible (<0.1 % EMC) — fluoropolymers are essentially non-hygroscopic[2] |
| Equilibrium moisture content at ~50 % RH% | 0.45 at saturation, 23 °C (ISO 62); 0.55 at 100 °C[4] | Not documented |
| Drying temperature & time | 120 °C for 5 h, target below 0.020 % moisture (Victrex AM 450 FIL)[4] | Not documented |
| Effect of moisture on strength | No dry-versus-conditioned figures are published; 3DXTech mandates a 120 °C, 4 h pre-dry before every print because trapped water flashes to steam at these nozzle temperatures[11] | Not applicable in practice — 3DXTech states drying is not required for PVDF, so there is no moisture-driven strength loss to measure[8] |
| Mechanical Properties | ||
| Tensile strength (XY)MPa | 60-100 (printed XY): Victrex AM 450 FIL 60-80 at yield and 3DXTech 100, both ISO 527; 98 at yield injection-moulded[1][4] | 51 at break (printed XY, ISO 527)[2] |
| Young's modulusMPa | 3000-4000 (printed XY, ISO 527, Victrex AM 450 FIL); 3720 (3DXTech); 4000 injection-moulded[1][4] | 2450 (printed XY, ISO 527)[2] |
| Elongation at break% | 28 (printed XY, ISO 527) — remarkably ductile for a high-temperature polymer[1] | 25 at break (printed XY, ISO 527)[2] |
| Flexural strengthMPa | 130 (printed XY, ISO 178)[1] | 50 (printed XY, ISO 178)[2] |
| Flexural modulusMPa | 2700 (printed XY, ISO 178)[1] | 1800 (printed XY, ISO 178)[2] |
| Charpy impact, notchedkJ/m² | 6.0 (injection-moulded, ISO 179/1eA); unnotched does not break[4] | Not documented |
| Other impact data | Izod notched 7.0 kJ/m2 injection-moulded (ISO 180/A). Printed anisotropy is extreme: VICTREX AM 200 on a Stratasys F900 gives Izod notched 1380-1530 J/m XZ against 30-62 J/m ZX (ASTM D256)[4][12] | Izod 133 J/m on extruded PVDF stock, converted from 2.49 ft-lb/in (ASTM D256)[13] |
| Layer adhesion / Z tensileMPa | 20-85 at yield (printed ZX, ISO 527, Victrex AM 450 FIL); the spread is set by chamber temperature and weld quality[4] | Not documented |
| Brittleness1–5 | Tough — absorbs impact, yields before breaking[1] | Tough — absorbs impact, yields before breaking[2] |
| Hardness (scale-specific)Shore A / Shore D / Rockwell | Shore D 84.5 (injection-moulded, ISO 868); Rockwell M100 / R125 on extruded PEEK stock (ASTM D785)[4][14] | Rockwell M79 on extruded PVDF stock (ASTM D785)[13] |
| Creep resistance / sustained load1–5 | Excellent — holds load for years. Victrex rates PEEK for long-term creep; injection-moulded flexural stress at 3.5 % strain falls only from 125 MPa at 23 °C to 85 MPa at 125 °C, and extruded stock is rated to 249 °C continuous[15][4][14] | Not documented |
| Fatigue / repeated-flex resistance1–5 | Excellent — living hinges viable. Victrex rates PEEK for long-term fatigue as well as creep[15] | Not documented |
| Elasticity / flexibility1–5 | Rigid[1] | Slightly flexible in thin sections[2] |
| Z strength as % of XY% | 71-84 (VICTREX AM 200 LMPAEK printed on the Stratasys F900 and Fortus 450mc, ZX against XZ tensile yield, ASTM D638); unfilled PEEK's own ZX spread is wider[12] | Not documented |
| Thermal Properties | ||
| HDT at 0.45 MPa°C | 140 (printed XY, ISO 75 at 0.45 MPa, 3DXTech)[1] | 149 on extruded PVDF stock (ASTM D648 at 66 psi; converted from 300 °F)[13] |
| HDT at 1.8 MPa°C | 152 (unannealed, ISO 75-2/Af, Victrex AM 450 FIL); 160 on extruded stock (ASTM D648 at 264 psi)[4][14] | 113 on extruded PVDF stock (ASTM D648 at 264 psi; converted from 235 °F)[13] |
| Glass transition (Tg)°C | 143 (DSC, 3DXTech); Victrex gives onset 143 and midpoint 150 (ISO 11357-2)[1][4] | Not documented |
| Melting point / Vicat°C | 343 melting (ISO 11357-3, Victrex); VICTREX AM 200 LMPAEK melts at 303[4][12] | 170 melting (ISO 11357)[2] |
| Continuous service temperature°C | 240 UL 746B relative thermal index, strength (RTI electrical 260, impact 180); Ensinger rates extruded PEEK stock at 249 long term[4][14] | 149 long term and short term on extruded PVDF stock (converted from 300 °F)[13] |
| Thermal expansion (CTE)µm/m·K | 37.8 (extruded PEEK stock, 23-60 °C, ASTM E831; source states 2.1e-5 in/in/°F), rising to 41.9 at 60-100 °C and 55.8 at 100-150 °C[14] | 127.8 (extruded PVDF stock, ASTM D696; source states 7.1e-5 in/in/°F) — the highest thermal expansion of any engineering polymer in this dataset[13] |
| Flammability / UL 94 | UL 94 V-0 at 1.5 mm on the base resin; glow-wire flammability index 960 °C at 2.0 mm (IEC 60695-2-12)[1][4] | UL 94 V-0 on extruded PVDF stock; Ensinger lists inherent flame resistance[13] |
| Environment & Chemical | ||
| UV resistance1–5 | Not documented | Excellent — designed for permanent outdoor use; Ensinger lists good UV and weather resistance and high gamma radiation resistance for PVDF stock[2][13] |
| Chemical resistance | Outstanding — resistant to almost all solvents and to steam sterilisation[1] | Outstanding — resistant to most acids, solvents and oxidising agents, which is the reason to use it[2] |
| Water / humidity resistance in service1–5 | Excellent — essentially unaffected; 0.45 % water at saturation and resistant to steam sterilisation[4][1] | Excellent — essentially unaffected[2] |
| Health & Safety | ||
| Fume toxicity1–5 | Moderate — measurable VOCs and UFPs, ventilation advised. None of these polymers was in the chamber study, and all are processed far above the temperatures it covered[16] | Very high — toxic decomposition products; local exhaust mandatory. Above 315 °C thermal decomposition yields hydrofluoric acid, hydrogen cyanide and carbon monoxide[3] |
| Hazardous species emitted | Not documented | Above 315 °C: hydrofluoric acid, hydrogen cyanide, phenols, carbon monoxide, carbon dioxide and dense smoke. HF is extremely corrosive, its skin burns may not be immediately visible or painful, and exposure can be fatal by skin absorption, inhalation or ingestion[3] |
| Ventilation / filtration requirement1–5 | Ventilated room or enclosure recommended[16] | Local exhaust to outside / fume hood — the SDS states local exhaust is preferred[3] |
| Dust & fibre handling hazard | Not documented | Molten polymer causes thermal burns and must not be pulled off the skin. If HF is detected during a decomposition event, cut the heat but keep the extraction running, ventilate, and clear non-essential people from the area[3] |
| Post-Processing | ||
| Dimensional accuracy & detail | Not documented | The processing window sits well below the 315 °C decomposition threshold, so nozzle temperature must be controlled rather than raised to chase flow[2][3] |
| Solvents & Solubility | ||
| Soluble in | 95–98 wt% sulphuric acid dissolves it — 10 g per 100 mL at 40–70 °C gives a dark red solution. Laboratory route only.[17][18] | THF, MEK, DMF, DMAc, NMP, DMSO and trimethyl phosphate dissolve 5–10 wt% at ambient — Arkema's active solvents, all lab reagents.[19] |
| Softened or crazed by | Concentrated nitric, hydrofluoric, hydrobromic and hydriodic acids attack it; DCM, DMSO and THF swell thin-walled sections.[20][18] | Acetone, MIBK, cyclohexanone, butyl acetate and glycol ethers swell it; alkalis above pH 12 attack the homopolymer.[19][21] |
| Solvent welding & smoothing agent | None — no solvent softens PEEK, so parts are joined thermally or mechanically, never chemically.[20][18] | None for the workshop — the active solvents (NMP, DMAc, DMF) are laboratory reagents used for casting membranes, not joints.[19] |
Material entries describe families or representative grades, not an interchangeable specification for every spool. Test methods, orientations and conditions may differ. Unknown values are marked “Not documented”. Prices and source dates remain historical snapshots; check the linked guide for product details. Differences highlight text, not a universal winner.
Sources for this comparison
- ThermaX PEEK Technical Data Sheet v3 3DXTech · 2026-08 · tds
- FluorX PVDF Technical Data Sheet v3 3DXTech · 2026-08 · tds
- FluorX PVDF Safety Data Sheet v1.1 3DXTech · 2026-08 · msds
- VICTREX AM 450 FIL — datasheet Victrex · 2025-12 · tds
- 3DXTech product catalogue 3DXTech · 2026-08 · vendor
- 3D4Makers product catalogue 3D4Makers · 2026-08 · vendor
- IEMAI 3D PEEK 3D Printing Filament — store page IEMAI 3D · 2026-08 · vendor
- FluorX PVDF — product page 3DXTech · 2026-08 · vendor
- Prusament PEI 1010 Technical Datasheet v1.0 Prusa Polymers · 2024-09 · tds
- Prusament PEI 1010 — material page Prusa Polymers · 2026-08 · doc
- ThermaX PEEK — product page 3DXTech · 2026-08 · vendor
- VICTREX AM 200 — FDM Material Data Sheet Stratasys · 2024-04 · tds
- TECAFLON PVDF natural — stock shape properties Ensinger · 2026-08 · tds
- TECAPEEK natural (PEEK) — stock shape properties Ensinger · 2026-08 · tds
- PEEK polymers — product overview Victrex · 2026-08 · doc
- Emissions of Ultrafine Particles and Volatile Organic Compounds from Commercially Available Desktop Three-Dimensional Printers with Multiple Filaments (Azimi et al.) Environmental Science & Technology 50(3) 1260-1268 · 2016-01 · paper
- The Effects of Sulfonated Poly(ether ether ketone) Ion Exchange Preparation Conditions on Membrane Properties Yee, Zhang & Ladewig, Membranes 3(3) 182–195 · 2013-07 · paper
- Chemical resistance — resistance of Ensinger plastics to chemicals (DIN 50 014, 23/50) Ensinger · 2026-08 · tds
- Kynar PVDF — Design properties: solubility and irradiation (active and latent solvents) Arkema · 2026-08 · tds
- What solvents are not compatible with PEEK? — fluidics technical FAQ IDEX Health & Science · 2026-08 · doc
- Kynar PVDF resin — chemical and fuel resistance Arkema · 2026-08 · tds